Patent application number | Description | Published |
20110062556 | COMPOUND SEMICONDUCTOR SUBSTRATE - A compound semiconductor substrate which inhibits the generation of a crack or a warp and is preferable for a normally-off type high breakdown voltage device, arranged that a multilayer buffer layer | 03-17-2011 |
20120211763 | NITRIDE SEMICONDUCTOR SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A nitride semiconductor substrate suitable for a normally-off type high breakdown-voltage device and a method of manufacturing the substrate are provided allowing both a higher threshold voltage and improvement in current collapse. | 08-23-2012 |
20140055783 | METHOD OF ANALYZING NITRIDE SEMICONDUCTOR LAYER AND METHOD OF MANUFACTURING NITRIDE SEMICONDUCTOR SUBSTRATE USING THE ANALYSIS METHOD - A method of analyzing a nitride semiconductor layer in which a mixing ratio at a ternary mixed-crystal nitride semiconductor layer can be analyzed non-destructively, simply, and precisely, even its surface is covered with a cap layer is provided. The nitride semiconductor layer having an AN layer or a BN layer with a thickness of 0.5 to 10 nm that is stacked on an A | 02-27-2014 |
20140319535 | NITRIDE SEMICONDUCTOR SUBSTRATE - A nitride semiconductor substrate is provided which is suitable for a high withstand voltage power device and prevents a warp and a crack from generating in a Si substrate when forming a thick nitride semiconductor layer on the substrate. A nitride semiconductor substrate | 10-30-2014 |
20140339679 | NITRIDE SEMICONDUCTOR SUBSTRATE - A nitride semiconductor substrate suitable for a high withstand voltage power device is provided in which current collapse is controlled, while reducing leakage current. In a nitride semiconductor substrate, wherein a buffer layer, an active layer, and an electron supply layer, each comprising a group 13 nitride, are stacked one by one on a silicon single crystal substrate, the buffer layer has a structure where a multilayer stack in which a pair of nitride layers having different concentrations of Al or Ga are repeatedly deposited a plurality of times on an initial layer of Al | 11-20-2014 |
Patent application number | Description | Published |
20090053978 | Double-Disc Grinding Machine, Static Pressure Pad, and Double-Disc Grinding Method Using the Same for Semiconductor Wafer - The present invention is a static pressure pad for supporting both sides of a raw wafer without contact by a static pressure of a fluid supplied to the both sides of the raw wafer in a double-disc grinding machine for a semiconductor wafer, wherein in patterns of lands to be banks of surrounding pockets formed on a surface side of supporting the raw wafer of the static pressure pad, an outer circumferential land pattern required to support the raw wafer is a concentric circle with respect to a rotation center of the raw wafer, and a land pattern inside the outer circumferential land pattern is a non-concentric circle with respect to the rotation center of the raw wafer and asymmetrical with respect to all the straight lines which bisect the static pressure pad. With this static pressure pad, there is provided the double-disc grinding machine and a double-disc grinding method for the semiconductor wafer, which can minimize a “middle ring” of average components obtained by averaging a nanotopography of the wafers after the double-disc grinding. | 02-26-2009 |
20090084373 | Method of Manufacturing (110) Silicon Wafer - The present invention provides a method for slicing a silicon single crystal ingot having a plane direction (110) by a wire saw to manufacture a (110) silicon wafer, wherein slicing is performed in such a manner that each angle formed between a traveling direction of a wire in the wire saw and a [−112] direction and a [1-12] direction in the (110) silicon single crystal ingot or a direction crystallographically equivalent to the directions exceeds 30°. As a result, the method for manufacturing the (110) silicon wafer that can suppress occurrence of breaking at the time of slicing and improve a production yield ratio can be provided. | 04-02-2009 |
20100180880 | Method of improving nanotopography of surface of wafer and wire saw apparatus - The present invention provides a method of improving nanotopography of a surface of a wafer sliced from an ingot by using a wire saw apparatus, including improving straightness of feed of a work feed table which is included in the wire saw apparatus and used for feeding the ingot to a wire row formed by winding a wire around a plurality of rollers, and also provides a wire saw apparatus for slicing an ingot to manufacture a wafer, including: a wire row formed by winding a wire around a plurality of rollers; a work feed table for holding and feeding the ingot to the wire row; and a linear-motion guide for linearly guiding the work feed table, wherein a component having a wavelength of 20 to 200 mm in straightness of feed of the work feed table satisfies a PV value ≦1.0 μm. As a result, there are provided the method of eliminating slice waviness having periodicity to improve the nanotopography of the surface of the wafer and the wire saw apparatus. | 07-22-2010 |
Patent application number | Description | Published |
20090253352 | Slicing Method - The present invention provides a slicing method comprising winding a wire around a plurality of grooved rollers and pressing the wire against an ingot to be sliced into wafers while supplying a slurry for slicing to the grooved rollers and causing the wire to travel, wherein a cooling speed of the ingot when a slicing depth is equal to or above ⅔ of a diameter is controlled to perform slicing by supplying a slurry for adjusting an ingot temperature to the ingot independently from the slurry for slicing while controlling a supply temperature only in a period from the moment that the slicing depth of the ingot reaches at least ⅔ of the diameter to end of slicing. As a result, the slicing method is provided, in which rapid cooling of the ingot in the time close to end of slicing the ingot can be alleviated when a wire saw is used to slice the ingot, and generation of a nano-topography can be thereby suppressed and further high quality wafers having a uniform thickness are obtained by slicing. | 10-08-2009 |
20090288530 | Slicing method and method for manufacturing epitaxial wafer - There is provided a slicing method including winding a wire around a plurality of grooved rollers and pressing the wire against an ingot to be sliced into wafers while supplying a slurry for slicing to the grooved rollers and causing the wire to travel, in which a test of slicing the ingot while supplying the slurry for slicing to the grooved rollers and controlling a supply temperature thereof is previously conducted to examine a relationship between an axial displacement of the grooved rollers and a supply temperature of the slurry for slicing, a supply temperature profile of the slurry for slicing is set based on the relationship between an axial displacement of the grooved rollers and a supply temperature of the slurry for slicing, and the slurry for slicing is supplied based on the supply temperature profile to slice the ingot while controlling an axial displacement of the grooved rollers and to uniform Sori of all wafers to be sliced out in one direction. As a result, the slicing method that can easily perform slicing with excellent reproducibility while uniforming Sori of all wafers in one direction at the time of slicing an ingot by using a wire saw is provided. | 11-26-2009 |
20100037881 | Slicing method - The present invention provides a slicing method comprising winding a wire around a plurality of grooved rollers and pressing the wire against an ingot to be sliced into wafers while supplying a slurry for slicing to the grooved rollers and causing the wire to travel, wherein a supply temperature of the slurry for slicing is controlled, and slicing is performed in such a manner that the supply temperature of the slurry for slicing and a temperature of the ingot become at least 30° C. or above at end of slicing the ingot. As a result, there is provided the slicing method that can alleviate precipitous cooling of an ingot in the time close to end of slicing the ingot and thereby suppress production of a nano-topography when slicing the ingot by using a wire saw. | 02-18-2010 |
20100089377 | SLICING METHOD AND WIRE SAW APPARATUS - The invention is directed to a method for slicing an ingot in the form of a wafer by winding a wire around a plurality of grooved rollers and pressing the wire against the ingot while making the wire travel and supplying slicing slurry to the grooved rollers, in which when the ingot is sliced, an amount of displacement of the ingot changing in an axial direction is measured and an amount of axial displacement of the grooved rollers is controlled so as to correspond to the measured amount of axial displacement of the ingot, and thereby, the ingot is sliced while controlling a relative position of the wire relative to an entire length of the ingot changing in the axial direction. As a result, a slicing method and a wire saw apparatus are provided that can perform slicing in such a way that a Bow or a Warp in a wafer obtained by slicing can be reduced, for example, by controlling a slicing path built into an ingot so that, in particular, the slicing path becomes flattened. | 04-15-2010 |
Patent application number | Description | Published |
20090317984 | Rotary Connector Device - There are provided a body, a rotor, a free motion spacer including a group of spacer sections arranged circularly between the body and the rotor and a reverse guide section in which a guide face is provided to be opposed to a roller in the group of spacer sections in the circumferential direction to form a reverse insert section and capable of turning with rotation of the rotor, and a flat cable which is reversed by inserting the reverse section into the reverse insert section in the free motion spacer and is wound around the outer and inner peripheral sides of the group of spacer sections where ribs | 12-24-2009 |
20090317994 | Rotary connector device - A rotary connector device is provided for restraining an error of rotational transmission between a steering wheel and a steering-angle sensor and restricting an increase of a steering-wheel detection error, making it possible to perform timely vehicle control. The rotary connector has: a body which is supported at a combination switch side and is adapted to pass a steering shaft; a rotor adapted to pass the steering shaft; and an attachment adapted to rotatably couple the rotor to the body and conjunctively rotate relative to the rotor, sensor-engagement recessed portions engaging with a steering-angle sensor to transmit a rotation, the recessed portions being provided at the attachment, wherein wheel-engagement protrusions engaging with a steering wheel are provided at the attachment. | 12-24-2009 |
20090317995 | Rotary Connector Device - There are provided the body supported to the side of the combination switch and having the circular wall, the rotor connected rotatably to the body and coaxial with the wall section, the free motion spacer formed circularly between the body and the rotor and capable of freely turning with rotation of the rotor, the first guide section and the roller constituting the second guide section which are provided in the free motion spacer, the first flat cable arranged along in the circumferential direction of the outer and inner peripheral sides of the free motion spacer in such a manner that both ends of the first flat cable are fixed to the body and the rotor respectively and the first flat cable is reversed by always making the convex side of the reversing section in the first flat cable contact the first guide section, and the second flat cable arranged along the circumferential direction of the outer and inner peripheral sides of the free motion spacer in such a manner that both ends of the second flat cable are fixed to the body and the rotor respectively and the second flat cable is reversed by always making the concave side of the reversing section of the second flat cable contact the roller. | 12-24-2009 |
20120209168 | PERITONEAL DIALYSIS PATIENT CONNECTION SYSTEM - Peritoneal dialysis connectors, connector sets, connector systems and methods are disclosed. In an embodiment, a connector includes, a body, a spike located at a first end of the body, a sealing ring sized to seal inside a female connector and located adjacent to the spike end, threads located adjacent to the sealing ring, and at least one barbed ring located adjacent to the threads at a second end of the body. The at least one barbed ring is configured to seal the second end of the body to a tube. | 08-16-2012 |
20130090755 | NUMERICALLY-CONTROLLED MACHINE TOOL - Provided is a numerically-controlled machine tool provided with: a tool measuring sensor that measures the length and diameter of a tool; a workpiece measuring sensor that measures the three-dimensional shape, and position and orientation of a workpiece in a non-contact manner by laser beam etc.; and a control device, which, after determining the position of the machining starting point and the slope of a reference plane on the basis of information from the workpiece measuring sensor, on the basis of an inputted machining program, machines the workpiece to the intended final form by simulation from the information from the sensors, the position of the machining starting point and the slope of the reference plane, thereby determining whether there are any machining loads greater than or equal to a specified value, and whether any of the workpiece has been left behind, and displays the determined results via a display device. | 04-11-2013 |