Patent application number | Description | Published |
20090220890 | CHEMICALLY AMPLIFIED RESIST COMPOSITION AND CHEMICALLY AMPLIFIED RESIST COMPOSITION FOR IMMERSION LITHOGRAPHY - A chemically amplified resist composition, comprising: a resin which includes a structural unit having an acid-labile group in a side chain, a structural unit represented by the formula (I) and a structural unit having a polycyclic lactone structure, and which is soluble in an organic solvent and insoluble or poorly soluble in an alkali aqueous solution but rendered soluble in an alkali aqueous solution by the action of an acid; and an acid generator represented by the formula (II). | 09-03-2009 |
20090264565 | POLYMER AND CHEMICALLY AMPLIFIED RESIST COMPOSITION COMPRISING THE SAME - The present invention provides a polymer comprising a structural unit represented by the formula (Ia) or (Ib): | 10-22-2009 |
20090317744 | POLYMER AND CHEMICALLY AMPLIFIED RESIST COMPOSITION COMPRISING THE SAME - A polymer comprising a structural unit represented by the formula (Ia) or (Ib): | 12-24-2009 |
20100055609 | COMPOUND, METHOD FOR PREPARING THE COMPOUND AND RESIST COMPOSITION CONTAINING THE COMPOUND - A compounds represented by the Formula (I) or the Formula (I′). | 03-04-2010 |
20100273112 | PROCESS FOR PRODUCING PHOTORESIST PATTERN - The present invention provides a process for producing a photoresist pattern comprising the following steps (A) to (D):
| 10-28-2010 |
20100279226 | RESIST PROCESSING METHOD - The present invention has the object of providing a method of manufacturing a resist pattern in which an extremely fine and highly accurate resist pattern can be formed which is obtained using the resist composition for forming a first resist pattern in a multi-patterning method such as a double patterning method. The resist processing method comprising; forming a first resist film by applying a first resist composition onto a substrate and drying, the first resist composition comprising a resin (A), a photo acid generator (B) and a cross-linking agent (C), the resin (A) having an acid-labile group, being insoluble or poorly soluble in alkali aqueous solution but of being rendered soluble in alkali aqueous solution through the action of an acid; prebaking; exposure processing; post-exposure baking; developing; hard-baking the first resist pattern; and obtaining a second resist film; pre-baking; exposure processing; post-exposure baking; developing to obtain a second resist pattern. | 11-04-2010 |
20110039208 | PHOTORESIST COMPOSITION CONTAINING THE SAME - The present invention provides a photoresist composition comprising a resin, an acid generator and a compound represented by the formula (C1): | 02-17-2011 |
20110039209 | COMPOUND AND PHOTORESIST COMPOSITION CONTAINING THE SAME - The present invention provides a compound represented by the formula (C1): | 02-17-2011 |