Patent application number | Description | Published |
20080196932 | MULTILAYER SUBSTRATE INCLUDING COMPONENTS THEREIN - Components having different heights are installed in a multilayer substrate using a metal core layer formed by bonding a plurality of metal layers. The metal core layer includes through-holes and a spot-faced portion. Passive components and an active component are disposed in the through-holes and the spot-faced portion, respectively. These components are connected to conductive patterns formed on wiring layers, with connecting vias therebetween. Contact faces of each component with the connecting vias are controlled so as to be disposed at the same level with the metal layers. | 08-21-2008 |
20100023289 | MEASURING APPARATUS, MEASURING METHOD AND TEST APPARATUS - Provided is a measurement apparatus comprising a first timing detecting section that detects first change timings of a signal under measurement; a second timing detecting section that detects second change timings of the signal under measurement; a buffer section that buffers data indicating the first change timings detected by the first timing detecting section and data indicating the second change timings detected by the second timing detecting section; and a calculating section that acquires, from the buffer section, the data indicating the first change timings and the data indicating the second change timings, calculates a temporal relationship between the first change timings and the second change timings, and outputs the temporal relationship. | 01-28-2010 |
20100300736 | COMPOSITE MULTI-LAYER SUBSTRATE AND MODULE USING THE SUBSTRATE - A composite multi-layer substrate comprising a flat plate-like core member formed of a material having an excellent electric conductivity, an excellent heat conductivity, and a high rigidity, a front resin layer and a rear resin layer covering at least the front and rear surfaces of the core member, and a bottomless hole formed in the core member through the front and rear sides of the core member, wherein an electronic component is installed in the bottomless hole, whereby since the strength of the composite multi-layer substrate can be assured by the rigidity of the core member, conventional prior art glass cloth can be eliminated, deterioration in the electric characteristics caused by ion migration can be avoided and will result in reduced production cost. | 12-02-2010 |
Patent application number | Description | Published |
20090316792 | DECODING METHOD, PROGRAM FOR DECODING METHOD, RECORDING MEDIUM WITH RECORDED PROGRAM FOR DECODING METHOD, AND DECODING DEVICE - The present invention is applied to a decoder based on the ITU-T H.264 method, for example, and detects continuous numbers of a syntax element of a specific value, such as a value 0, and decodes the syntax element on the basis of the detection result. | 12-24-2009 |
20100019801 | APPARATUS, TEST APPARATUS AND METHOD FOR DETECTING A CHANGING POINT OF MEASURED SIGNAL - Provided is an apparatus comprising a delaying section that generates a plurality of delayed signals by delaying a single first input signal by different delay amounts; a first acquiring section that acquires each of a plurality of input second input signals at a first phase of a reference clock; a second acquiring section that acquires each of the plurality of second input signals at a second phase of the reference clock, which is different from the first phase; and a change point detecting section that detects a change point of one of the first input signal and a second input signal, based on values of the plurality of signals acquired by the first acquiring section and values of the plurality of signals acquired by the second acquiring section. | 01-28-2010 |
20100303147 | ENCODING APPARATUS AND ENCODING METHOD, AND DECODING APPARATUS AND DECODING METHOD - An encoding apparatus includes a receiving section receiving syntax information defined by an encoding standard, a first encoding section encoding the received syntax information to generate encoded information, a transferring section transferring transmission encoded information based on the encoded information generated by the first encoding section, a second encoding section encoding reproduced encoded information reproduced from the transferred transmission encoded information, a conversion section converting the encoded information encoded by the first encoding section into redefined encoded information, to generate the transmission encoded information in accordance with the transfer capacity of the transferring section and the processing speed of encoding in each of the first encoding section and the second encoding section so as not to cause delay in encoding in the first encoding section or the second encoding section, and an inverse conversion section inversely converting the converted redefined encoded information to generate the reproduced encoded information. | 12-02-2010 |
20120147972 | IMAGE DECODING APPARATUS, IMAGE DECODING METHOD, IMAGE ENCODING APPARATUS, IMAGE ENCODING METHOD, AND PROGRAM - An image decoding apparatus includes a first decoding unit configured to decode a bit stream that is generated by using a first variable length encoding system, so as to generate an intermediate stream, a second decoding unit configured to decode a bit stream that is generated by using a second variable length encoding system, so as to generate a syntax element, a syntax conversion unit configured to convert the syntax element that is generated, from syntax of the second variable length encoding system into syntax of the first variable length encoding system, and a first encoding unit configured to encode the syntax element that is syntax-converted, so as to generate the intermediate stream. | 06-14-2012 |
20140048321 | SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT - Provided is a substrate with a built-in electronic component that can minimize an occurrence of a deformation such as warping or distortion of the substrate with a built-in electronic component, which is caused by a difference in rigidity between a region of low rigidity and a region of high rigidity that are formed in a core layer thereof. In the substrate with a built-in electronic component, electronic components | 02-20-2014 |
20140126157 | ELECTRONIC CIRCUIT MODULE AND METHOD FOR PRODUCING THE SAME - An electronic circuit module includes a substrate with built-in component, a mount component mounted on the substrate with built-in component, a sealing portion covering the mount component, and a shield made of a conductive synthetic resin covering the sealing portion. The substrate with built-in component has a core layer made of a metal, an outer cover made of an insulating synthetic resin, and a first protrusion. The core layer has corners and side faces. The outer cover covers the corners and the side faces, and has a first surface. The first protrusion has a first end face exposed at the outer cover and a second surface adjacent to the first surface, and is formed away from the corners of the side faces to protrude outwardly. The sealing portion covers the mount component. The shield covers the sealing portion, and has a third surface bonded to the first surface and the second surface. | 05-08-2014 |
20140126160 | ELECTRONIC CIRCUIT MODULE - There is provided an electronic circuit module that prevents a bonding force between ground wiring and a shield from decreasing and maintains successfully a desirable shield effect. The electronic circuit module includes a core layer also functioning as the ground wiring, each face OS of each first protrusion of the core layer facing to an end face of a shield is adjacent to faces OS of an outer cover made of an insulating synthetic resin facing to the end face of the shield, and the end face of the shield is bonded to both of the each face OS of each first protrusion facing to the end face of the shield and the faces OS of the outer cover facing to the end face of the shield. | 05-08-2014 |
20140252522 | CAMERA MODULE - In a camera module, a planar part, which is for mitigating deformation of the surface of a second insulating portion on which an imaging device is mounted, is embedded in the second insulating portion of a substrate so as to face the imaging device mounted on the surface (top surface) of the second insulating portion. | 09-11-2014 |
20140253794 | CAMERA MODULE - A camera module, in which a recessed portion that has a greater depth than the thickness of an imaging device is disposed on the surface (top surface) of an embedded-component substrate. An imaging device is bonded to a bottom of the recessed portion such that an opening is present between the surface (top surface) of the imaging device and the surface (top surface) of the embedded-component substrate. Connection pads on the imaging device are connected to conductor pads disposed on the surface (top surface) of the embedded-component substrate by bonding wires that go through the opening. | 09-11-2014 |
20140307402 | SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT - Provided is a substrate with built-in electronic component including a component storage layer and two buildup layers. The component storage layer includes an electronic component and a cover portion having an insulating property. The electronic component includes a terminal surface and a main body. The cover portion includes a first surface formed to be flush with the terminal surface, covers the main body of the electronic component, and has a first linear expansion coefficient. The two buildup layers each include an insulating layer and a via portion. The insulating layer is adjacent to the cover portion and has a second linear expansion coefficient larger than the first linear expansion coefficient. The via portion is provided in the insulating layer and connected to the terminal surface. The insulating layer of one of the two buildup layers is formed to be in contact with the terminal surface and the first surface. | 10-16-2014 |
20150068795 | SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT AND CORE BASE-MATERIAL FOR SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT - A substrate with built-in electronic component includes an electronic component, a first wiring layer, a second wiring layer, a via, and a core base-material. The first wiring layer has a first wiring portion. The second wiring layer has a second wiring portion. The via is configured to electrically connect the first wiring portion and the second wiring portion. The core base-material has a metal layer, at least one first storage portion, and a second storage portion, the metal layer being disposed between the first wiring layer and the second wiring layer, the at least one first storage portion being formed in the metal layer, the at least one first storage portion storing the electronic component, the second storage portion being formed on an outside of the first storage portion integrally with the first storage portion, the second storage portion storing the via. | 03-12-2015 |