Patent application number | Description | Published |
20130250476 | ELECTRONIC COMPONENT AND FABRICATION METHOD THEREOF - There are provided an electronic component and a fabrication method thereof. The electronic component includes: a ceramic main body including end surfaces in a length direction, side surfaces in a width direction and top and bottom surfaces in a thickness direction; first and second external electrodes formed on the end surfaces, respectively; third and fourth external electrodes formed on the side surfaces, respectively; first internal electrodes formed within the ceramic main body and connected to first and second external electrodes; and second internal electrodes alternately arranged with the first internal electrodes, while having a ceramic layer interposed therebetween, and connected to the third and fourth external electrodes, wherein thickness t | 09-26-2013 |
20130286535 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - There is provided a multilayer ceramic electronic component, including: a ceramic body formed by laminating dielectric layers having an average thickness of 0.7p or less; external electrodes formed on external surfaces of the ceramic body; and internal electrodes respectively disposed on the dielectric layer so as to have a gap formed therebetween, wherein, when a narrowest gap between the internal electrode edges adjacent to one another is denoted by Gmin, 10 μm≦Gmin≦60 μm is satisfied. | 10-31-2013 |
20140233150 | MULTILAYER CERAMIC DEVICE - Disclosed herein is a multilayer ceramic device including: a device body having side surfaces spaced apart from each other and circumferential surfaces connecting the side surfaces to each other; internal electrodes disposed in a length direction of the device body in the device body; external electrodes having a front surface portion covering the side surfaces and a band portion extended from the front surface portion and covering portions of the circumferential surfaces; and crack guide patterns disposed in the device body and guiding a progress direction of a crack generated from the circumferential surfaces so that the crack is directed toward the side surface, wherein the crack guide pattern includes: a first metal pattern; and a second metal pattern disposed to be closer to the circumferential surface as compared with the first metal pattern and having gaps. | 08-21-2014 |
20150016020 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - There is provided a multilayer ceramic electronic component, including: a ceramic body formed by laminating dielectric layers having an average thickness of 0.7 μm or less; external electrodes formed on external surfaces of the ceramic body; and internal electrodes respectively disposed on the dielectric layer so as to have a gap formed therebetween, wherein, when a narrowest gap between the internal electrode edges adjacent to one another is denoted by Gmin, 10 μm≦Gmin≦60 μm is satisfied. | 01-15-2015 |
Patent application number | Description | Published |
20090278113 | NITRIDE SEMICONDUCTOR LIGHT EMITTING DEVICE - There is provided a nitride semiconductor light emitting device. A nitride semiconductor light emitting device according to an aspect of the invention may include: an n-type nitride semiconductor layer provided on a substrate; an active layer provided on the n-type nitride semiconductor layer, and including quantum barrier layers and quantum well layers; and a p-type nitride semiconductor layer provided on the active layer, wherein each of the quantum barrier layers includes a plurality of In | 11-12-2009 |
20120061641 | GROUP III NITRIDE NANOROD LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THEREOF - There are disclosed a group III nitride nanorod light emitting device and a method of manufacturing thereof. The group III nitride nanorod light emitting device includes a substrate, an insulating film formed on the substrate, and including a plurality of openings exposing parts of the substrate and having different diameters, and first conductive group III nitride nanorods having different diameters, respectively formed in the plurality of openings, wherein each of the first conductive group III nitride nanorods has an active layer and a second conductive semiconductor layer sequentially formed on a surface thereof. | 03-15-2012 |
20120068153 | GROUP III NITRIDE NANOROD LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THEREOF - A group III nitride nanorod light emitting device and a method of manufacturing thereof. The method includes preparing a substrate, forming an insulating film including one or more openings exposing parts of the substrate on the substrate, growing first conductive group III nitride nanorod seed layers on the substrate exposed through the openings by supplying a group III source gas and a nitrogen (N) source gas thereto, growing first conductive group III nitride nanorods on the first conductive group III nitride nanorod seed layers by supplying the group III source gas and an impurity source gas in a pulse mode and continuously supplying the N source gas, forming an active layer on a surface of each of the first conductive group III nitride nanorods, and forming a second conductive nitride semiconductor layer on the active layer. | 03-22-2012 |
20130252363 | GROUP III NITRIDE NANOROD LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THEREOF - A group III nitride nanorod light emitting device and a method of manufacturing thereof. The method includes preparing a substrate, forming an insulating film including one or more openings exposing parts of the substrate on the substrate, growing first conductive group III nitride nanorod seed layers on the substrate exposed through the openings by supplying a group III source gas and a nitrogen (N) source gas thereto, growing first conductive group III nitride nanorods on the first conductive group III nitride nanorod seed layers by supplying the group III source gas and an impurity source gas in a pulse mode and continuously supplying the N source gas, forming an active layer on a surface of each of the first conductive group III nitride nanorods, and forming a second conductive nitride semiconductor layer on the active layer. | 09-26-2013 |
20140217361 | GROUP III NITRIDE NANOROD LIGHT EMITTING DEVICE - There are disclosed a group III nitride nanorod light emitting device and a method of manufacturing thereof. The group III nitride nanorod light emitting device includes a substrate, an insulating film formed on the substrate, and including a plurality of openings exposing parts of the substrate and having different diameters, and first conductive group III nitride nanorods having different diameters, respectively formed in the plurality of openings, wherein each of the first conductive group III nitride nanorods has an active layer and a second conductive semiconductor layer sequentially formed on a surface thereof. | 08-07-2014 |
Patent application number | Description | Published |
20140170523 | ELECTRODE PASTE FOR SOLID OXIDE FUEL CELL, SOLID OXIDE FUEL CELL USING THE SAME, AND FABRICATING METHOD THEREOF - Disclosed herein are an electrode paste for a solid oxide fuel cell in an anode supported type in which an anode, an electrolyte layer, and a cathode are sequentially stacked, including a raw material powder, a dispersant, a binder, a solvent, and a liquid pore-forming material, a solid oxide fuel cell using the same, and a fabricating method thereof. The electrode paste for the solid oxide fuel cell may form uniform pores in the electrode and may provide high porosity. | 06-19-2014 |
20140178787 | SOLID OXIDE FUEL CELL ASSEMBLY AND METHOD FOR FORMING SEAL - Disclosed herein is a solid oxide fuel cell assembly, including: one or more unit cell, a box-shaped housing provided in the unit cell so as to prevent fuel and air from contacting with each other; a metal plate provided with one or more penetration hole in a plate shape partitioning the housing so as to prevent fuel and air from contacting with each other; and a seal sealing a spaced gap between an outer circumferential surface of the unit cell and a penetration hole of a metal plate. The preferred embodiment of the present invention provides the reliable sealed state between the unit cell and the metal plate by using the seal formed of a sealant, a bonding material, and a sealing material. | 06-26-2014 |
20140178793 | SOLID OXIDE FUEL CELL - Disclosed herein is a unit cell including: an internal electrode including a flat upper surface and a lower surface arranged in parallel to face each other and a plurality of internal channels having a flat lower side disposed between the upper surface and the lower surface; an interconnector seated on the upper surface of the internal electrode; an electrolyte laminated on an outer circumferential surface of the internal electrode, except for the interconnector; and an external electrode laminated on an outer circumferential surface of the electrolyte. | 06-26-2014 |
20140178795 | SOLID OXIDE FUEL CELL AND METHOD OF MANUFACTURING INTERCONNECTOR FOR SOLID OXIDE FUEL CELL - Disclosed herein is a solid oxide fuel cell including: a unit cell including an anode, an electrolyte, and a cathode; interconnectors having a rugged shape due to a channel and a protruded portion formed on one surface or both surfaces of a body and arranged in parallel at a predetermined interval, wherein a lower surface and a side of the channel are stacked with oxidation resistance insulating ceramic layers. In particular, the present invention includes a method of manufacturing an interconnector for a planar solid oxide fuel cell. | 06-26-2014 |
20140178797 | SOLID OXIDE FUEL CELL - Disclosed herein is a solid oxide fuel cell including: a unit cell including an anode, an electrolyte, and a cathode; an interconnector including a planar body, a plurality of through holes penetrating through the body, a bar inserted into the through hole and made of an electrical conductor, and a lower enclosure protruding from one surface of the body so as to enclose the through hole; and a sealant arranged along edges of the unit cell and the interconnector. | 06-26-2014 |
20140178799 | SOLID OXIDE FUEL CELL AND MANUFACTURING METHOD THEREOF - Disclosed herein is a solid oxide fuel cell including a unit cell, wherein the unit cell includes: a cylindrical internal electrode: an interconnector having a T-shaped cross section and stacked on an outer peripheral surface of the internal electrode in a length direction; an electrolyte stacked on the outer peripheral surface of the internal electrode except for the interconnector; and an external electrode stacked on an outer peripheral surface of the electrolyte except for wing parts of the interconnector. In addition, disclosed herein is a manufacturing method of a solid oxide fuel cell. | 06-26-2014 |
20140178800 | INTERCONNECT FOR SOLID OXIDE FUEL CELL AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are an interconnect for a solid oxide fuel cell and a method for manufacturing the same, the interconnect including: a conductive core; an oxidation-resistant insulating part receiving therein; and an oxidation-resistant conductive material layer coated on an exposed surface of the conductive core, which is exposed to an external environment by removing a portion of the oxidation-resistant insulating part, so that the interconnect can maintain durability against high-temperature heat generated from a flat type solid oxide fuel cell for a long time and thus have a very small voltage loss due to oxidation even with the use over a long-time period; have no sealing problem and no delaminating problem of a coating film due to a difference in coefficient of thermal expansion; be inexpensive; and have a simple structure. | 06-26-2014 |
Patent application number | Description | Published |
20130139382 | PRINTED CIRCUIT BOARD HAVING ELECTRO COMPONENT AND MANUFACTURING METHOD THEREOF - An electronic component embedded printed circuit board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the method includes providing a core board having a circuit pattern formed on a surface thereof, in which the core board is penetrated by a cavity, adhering an adhesive layer to a lower surface of the core board so as to cover the cavity, disposing an electronic component on an upper surface of the adhesive layer, the upper surface corresponding to the cavity, covering the circuit pattern by stacking a first insulator on an upper surface of the core board such that the cavity is filled, the first insulator having no backing material filled therein, and stacking a second insulator on both upper and lower sides of the cord board, in which the second insulator has a backing material filled therein. | 06-06-2013 |
20140080266 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a semiconductor package and a method of manufacturing the same, the semiconductor package including: a molding member having a cavity formed therein; a device mounted in the cavity; an insulating member formed inside the cavity and on and/or beneath the molding member and the device; a circuit layer formed on the insulating member, and including vias and connection pads electrically connected with the device; a solder resist layer formed on the circuit layer, and having openings exposing upper portions of the connection pads; and solder balls formed in the openings. | 03-20-2014 |