Patent application number | Description | Published |
20090092749 | MANUFACTURE METHOD OF BUILDUP CIRCUIT BOARD - A manufacturing method of a buildup circuit board includes forming a wiring layer on an organic polymer insulating layer by copper electroplating and building up other organic polymer insulating layer on the wiring layer, wherein in a final step of the copper electroplating, a surface of the wiring layer is roughened by copper electroplating and the organic polymer insulating layer is formed directly on the roughened surface of the wiring layer. According to the invention, a specific etching step that is essential for enhancing adhesion between the organic polymer insulating layer and the wiring layer can be omitted and no expensive etching apparatus is necessary, thus being good in economy. In addition, if various types of copper sulfate plating baths containing different types of additives used for via fill plating are used as they are, irregularities on the surface can be made in various forms and roughnesses. Thus, it is unnecessary to select a specific type of etching solution depending on film characteristics ascribed to types of additives. Moreover, it is easy to form surface irregularities in conformity with the type of material and physical properties of the organic polymer insulating layer being built up. | 04-09-2009 |
20100219081 | COPPER ELECTROPLATING BATH - A copper electroplating bath useful in filling non-through holes formed on a substrate which contains a water-soluble copper salt, sulfuric acid, and chloride ions and further contains a brightener, a carrier, and a leveler as additives, wherein the leveler contains at least one water-soluble polymer containing quaternary nitrogen, tertiary nitrogen, or both which are cationizable in a solution. In the copper electroplating bath, the filling power for non-through holes formed on a substrate can be easily controlled so as to fit to the size of the holes only by changing the quaternary nitrogen to tertiary nitrogen ratio of the water-soluble polymer to be used as the leveler, which enables copper electroplating of non-through holes of various sizes with a good fit to the sizes. | 09-02-2010 |
Patent application number | Description | Published |
20090271723 | Object display order changing program and apparatus - An icon line is displayed on a screen so as to align icons laterally. When a user slides a stick laterally based on an originating point corresponding to a point on an icon of the icon line, it is possible to scroll the icon line laterally in accordance with the stick being moved, and when a user slides a stick vertically based on an originating point corresponding to a point on an icon of the icon line, it is possible to move only the icon of the icon line in accordance with the stick being moved. Therefore, a user is allowed to easily change the display order in which a plurality of objects are displayed on the screen. | 10-29-2009 |
20090310010 | Information processing apparatus, and computer-readable storage medium recording information processing program - An information processing apparatus capable of being opened and closed includes storage means, display means, and taken image display control means. The storage means stores a taken image therein. The display means has a display screen provided in a surface which is located inside when the information processing apparatus is closed and which is located outside when the information processing apparatus is opened. The taken image display control means displays a taken image on the display screen, and changes a taken image to be displayed between before and after closing and opening the information processing apparatus when the information processing apparatus is closed and opened again. | 12-17-2009 |
20100017732 | COMPUTER-READABLE STORAGE MEDIUM HAVING OBJECT DISPLAY ORDER CHANGING PROGRAM STORED THEREIN AND APPARATUS - An icon line is displayed on a screen. A display order for the icon line can be changed by using switch input means enabling a direction input. When an input in a first direction is made, objects are scrolled so as to sequentially display each object at a specific position or the objects are scrolled across the specific position. When an input in the second direction is made, an object positioned at the specific position is saved at a saving position or an object positioned at the saving position is positioned at the specific position. Thus, a user is allowed to easily change the display order in which a plurality of objects are displayed on a screen. | 01-21-2010 |
20110234857 | INFORMATION PROCESSING APPARATUS AND COMPUTER-READABLE STORAGE MEDIUM RECORDING INFORMATION PROCESSING PROGRAM - An information processing apparatus capable of being opened and closed includes storage means, display means, and taken image display control means. The storage means stores a taken image therein. The display means has a display screen provided in a surface which is located inside when the information processing apparatus is closed and which is located outside when the information processing apparatus is opened. The taken image display control means displays a taken image on the display screen, and changes a taken image to be displayed between before and after closing and opening the information processing apparatus when the information processing apparatus is closed and opened again. | 09-29-2011 |
20110242361 | INFORMATION PROCESSING DEVICE, INFORMATION PROCESSING SYSTEM, AND LAUNCH PROGRAM AND STORAGE MEDIUM STORING THE SAME - A game device according to the present embodiment includes a camera as image pick-up means. An inner camera is accommodated in an upper housing. In addition, a microphone hole is provided in an inner surface of the upper housing so as to sense external sound through a microphone. | 10-06-2011 |
20130289893 | Data-Processing System for Chromatograph Mass Spectrometry - In processing chromatographic data, collected by performing a measurement for each of the segments which respectively define time ranges, a system determines whether there is any boundary sandwiched between two temporally continuous segments whose measurement modes are the same and which has the same m/z value designated by an operator to be displayed. If such a boundary exists, the measurement mode common to the two neighboring segments across that boundary is identified, and the system determines whether the parameter values corresponding to that measurement mode are the same. If they are the same, the partial chromatograms corresponding to the two segments show a temporal change in the intensity of the same kind of ion. Accordingly, the two neighboring measurement points across the boundary are connected by interpolation to create a chromatogram with no missing portion. | 10-31-2013 |
20130297230 | Data-Processing System For Chromatographic Mass Spectrometry - Provided is a system for helping an operator determine the target ion, collision energy and other analysis conditions. A chromatogram selected by an operator is displayed in a chromatogram display area of an MRM measurement parameter determination window. When the operator selects a point on this chromatogram, the name of a target compound which is registered in an event linked with a range of time including the selected point in time is displayed on a compound name display area. A plurality of mass spectra collected at that point in time are also displayed in a mass spectra display area in a vertically arranged form, using the same scale on the mass axis and the same scale on the intensity axis, with the scales of their mass axes aligned with each other in the vertical direction. The operator can then check whether the selected peak corresponds to the target compound. | 11-07-2013 |
Patent application number | Description | Published |
20090026083 | CONTINUOUS COPPER ELECTROPLATING METHOD - A continuous copper electroplating method wherein copper is continuously plated on a workpiece to be placed in a plating vessel accommodating a copper sulfate plating bath containing organic additives by use of a soluble or insoluble anode and a workpiece as a cathode, the method including overflowing the plating bath from the plating vessel in an lo overflow vessel under which the plating bath in the overflow vessel is returned to the plating vessel, providing an oxidative decomposition vessel, and returning a plating bath from the oxidative decomposition vessel through the overflow vessel to the plating vessel to circulate the plating bath between the plating vessel and oxidative decomposition vessel, and metallic copper is immersed in the plating bath in the oxidative decomposition vessel and exposed to air bubbling, so that decomposed/degenerated organic products formed by decomposition or degeneration produced during the copper electroplating can be oxidatively decomposed. | 01-29-2009 |
20090038952 | ELECTROLYTIC COPPER PLATING PROCESS - Disclosed herein is an electrolytic copper plating process for electroplating copper on workpieces in a copper sulfate plating bath filled in a plating tank and containing an organic additive while using a soluble anode or insoluble anode as an anode and the workpieces as cathodes, including the steps of, setting a bath current density at not higher than 5 A/L, immersing metal copper in a region of the copper sulfate plating bath, the region being apart from a region between the anode and the cathode and also from regions adjacent the anode and cathode, respectively, such that a neighborhood of the thus-immersed metal copper can be used as an oxidative decomposition region, setting an immersed area of the metal copper at not smaller than 0.001 dm | 02-12-2009 |
20090229986 | CONTINUOUS COPPER ELECTROPLATING METHOD - Disclosed is a method for a repeated electroplating of a workpiece to be plated as a cathode by using an insoluble anode in a plating vessel accommodating a copper sulfate plating bath, wherein a copper dissolution vessel different from the plating vessel is provided, the plating bath is transferred to the copper dissolution vessel and is returned from the copper dissolution vessel to the plating vessel for circulating the plating bath between the plating vessel and the copper dissolution vessel, copper ion supplying salt is charged into the copper dissolution vessel and dissolved in the plating bath so that copper ions consumed by the plating can be replenished, and the workpiece to be plated is continuously electroplated, characterized in that the plating bath is permitted to transfer between the anode side and the cathode side, and the plating bath is returned to vicinity of the anode in the return of the plating bath from the copper dissolution vessel to the plating vessel. Plating performance impairing components, which are produced when the copper ion supplying salt is dissolved in the plating bath for replenishing the copper ions, are oxidized and decomposed, whereby defective plating due to the presence of the plating performance impairing components can be prevented. | 09-17-2009 |
20100003399 | ELECTROLESS PLATING SOLUTION, METHOD FOR ELECTROLESS PLATING USING THE SAME AND METHOD FOR MANUFACTURING CIRCUIT BOARD - Disclosed is an electroless plating solution exhibiting a good plating metal filling performance even for larger trenches or vias of several to one hundred and tens of μm, in a manner free from voids or seams, and allowing maintenance of stabilized performance for prolonged time. | 01-07-2010 |
20120058254 | ELECTROLESS PLATING SOLUTION, METHOD FOR ELECTROLESS PLATING USING THE SAME AND METHOD FOR MANUFACTURING CIRCUIT BOARD - Disclosed is an electroless plating solution exhibiting a good plating metal filling performance even for larger trenches or vias of several to one hundred and tens of μm, in a manner free from voids or seams, and allowing maintenance of stabilized performance for prolonged time. | 03-08-2012 |
20130056362 | MANUFACTURE METHOD OF BUILDUP CIRCUIT BOARD - A manufacturing method of a buildup circuit board includes forming a wiring layer on an organic polymer insulating layer by copper electroplating and building up other organic polymer insulating layer on the wiring layer, wherein in a final step of the copper electroplating, a surface of the wiring layer is roughened by copper electroplating and the organic polymer insulating layer is formed directly on the roughened surface of the wiring layer. According to the invention, a specific etching step that is essential for enhancing adhesion between the organic polymer insulating layer and the wiring layer can be omitted and no expensive etching apparatus is necessary, thus being good in economy. In addition, if various types of copper sulfate plating baths containing different types of additives used for via fill plating are used as they are, irregularities on the surface can be made in various forms and roughnesses. Thus, it is necessary to select a specific type of etching solution depending on film characteristics ascribed to types of additives. Moreover, it is easy to form surface irregularities in conformity with the type of material and physical properties of the organic polymer insulating layer being built up. | 03-07-2013 |