Patent application number | Description | Published |
20090261483 | ADHESIVE COMPOSITION, ADHESIVE COMPOSITION FOR CIRCUIT CONNECTION, CONNECTED BODY SEMICONDUCTOR DEVICE - An adhesive composition containing: (a) a thermoplastic resin; (b) a radical-polymerizable compound including two or more (meth)acryloyl groups; (c) a curing agent that generates a radical by photoirradiation of 150 to 750 nm and/or heating at 80 to 200° C.; and (d) a liquid rubber having a viscosity of 10 to 1000 Pa·s at 25° C. | 10-22-2009 |
20100314783 | PHOTOSENSITIVE ADHESIVE COMPOSITION, AND OBTAINED USING THE SAME, ADHESIVE FILM, ADHESIVE SHEET, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND ELECTRONIC PART - A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator. | 12-16-2010 |
20110065043 | PHOTOSENSITIVE ADHESIVE COMPOSITION, AND OBTAINED USING THE SAME, ADHESIVE FILM, ADHESIVE SHEET, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND ELECTRONIC PART - A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator. | 03-17-2011 |
20110065260 | PHOTOSENSITIVE ADHESIVE COMPOSITION, AND OBTAINED USING THE SAME, ADHESIVE FILM, ADHESIVE SHEET, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND ELECTRONIC PART - A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator. | 03-17-2011 |
20110079927 | PHOTOSENSITIVE ADHESIVE COMPOSITION, AND OBTAINED USING THE SAME, ADHESIVE FILM, ADHESIVE SHEET, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND ELECTRONIC PART - A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator. | 04-07-2011 |
20120063109 | ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTING STRUCTURE FOR CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE - The adhesive composition of the invention comprises a thermoplastic resin, a radical polymerizing compound, a radical polymerization initiator and a radical polymerization regulator. According to the present invention it is possible to provide an adhesive composition, a circuit connecting material, a connection structure for a circuit member and a semiconductor device whereby curing treatment can be carried out with sufficient speed at low temperature, curing treatment can be carried out with a wide process margin, and adequately stable adhesive strength can be obtained. | 03-15-2012 |
20120227786 | CONDUCTIVE ADHESIVE, SOLAR CELL, METHOD FOR MANUFACTURING SOLAR CELL, AND SOLAR CELL MODULE - A conductive adhesive comprising conductive particles including metal, a thermosetting resin, a flux activator, and preferably a rheology control agent is provided. A melting point of the conductive particles is preferably 220° C. or lower. The conductive adhesive is used for electrically connecting and adhering wiring members | 09-13-2012 |
20120248632 | PHOTOSENSITIVE ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE - The present invention relates to a photosensitive adhesive composition that has thermal press bondability to an adherent after being patterned by exposure and development and enables alkali development, wherein a storage elastic modulus at 110° C. after exposure and further heat curing is not less than 10 MPa. | 10-04-2012 |
20120248634 | METHOD FOR MANUFACTURING FILM-LIKE ADHESIVE, ADHESIVE SHEET, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - The method for manufacturing a film-like adhesive according to the present invention includes: applying an adhesive composition comprising (A) a radiation-polymerizable compound, (B) a photoinitiator and (C) a thermosetting resin, and having a solvent content of 5% by mass or lower and being liquid at 25° C., on a base material to thereby form an adhesive composition layer; and irradiating the adhesive composition layer with light to thereby form the film-like adhesive. | 10-04-2012 |
20120256326 | ADHESIVE COMPOSITION, SEMICONDUCTOR DEVICE MAKING USE THEREOF, AND PRODUCTION METHOD THEREOF - Disclosed is an adhesive composition used for adhesion of a semiconductor chip which contains a radiation polymerizable compound, a photoinitiator, and a thermosetting resin. When the adhesive composition forming an adhesive layer is brought to a B-stage by irradiation with light, the surface of the adhesive layer has a tack force of 200 gf/cm | 10-11-2012 |
20120263946 | SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR WAFER PROVIDED WITH ADHESIVE LAYER - Disclosed is a method for manufacturing a semiconductor device which includes the steps of: forming an adhesive layer by forming an adhesive composition into a film on a surface opposite to the circuit surface of a semiconductor wafer; bringing the adhesive layer to a B-stage by irradiation with light; cutting the semiconductor wafer together with the adhesive layer brought to the B-stage into a plurality of semiconductor chips; and making the semiconductor chip to adhere to a supporting member or another semiconductor chip by performing compression bonding, with the adhesive layer sandwiched therebetween. | 10-18-2012 |
20120273974 | ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE OF CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE - The adhesive composition of the invention comprises a radical generator, a thermoplastic resin and a urethane (meth)acrylate having two or more radical-polymerizing groups in the molecule and a weight-average molecular weight of 3000-30,000. | 11-01-2012 |
20140144481 | SOLAR CELL MODULE - Provided is a solar cell module in which a plurality of solar cells and a wiring member for electrically connecting the solar cells are connected via connecting portions and, wherein a plurality of finger electrodes are formed on a light receiving surface of a photoelectric conversion body of the solar cell, the wiring member is arranged so as to intersect with the plurality of finger electrodes, and the connecting portion on a light receiving surface side comprises a metal portion which is formed by allowing conductive particles containing a metal having a melting temperature of 200° C. or less to melt and aggregate in a resin and connects the individual finger electrodes and the wiring member; and a resin portion which is composed of the resin and surrounds the metal portion to bond the photoelectric conversion body and the wiring member. | 05-29-2014 |
Patent application number | Description | Published |
20090309220 | ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE OF CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE - The adhesive composition of the invention comprises a radical generator, a thermoplastic resin and a urethane (meth)acrylate having two or more radical-polymerizing groups in the molecule and a weight-average molecular weight of 3000-30,000. | 12-17-2009 |
20100143673 | PHOTOSENSITIVE ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD - The photosensitive adhesive composition of the invention comprises (A) an alkali-soluble resin, (B) an epoxy resin, (C) a radiation-polymerizable compound and (D) a photoinitiator, wherein the (D) photoinitiator contains at least (D1) a photoinitiator that exhibits a function which promotes polymerization and/or curing reaction of the epoxy resin by exposure to radiation. | 06-10-2010 |
20100239858 | FILM-LIKE ADHESIVE, ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE USING SAME - An object of the present invention is to provide a film-like adhesive capable of achieving a superior combination of processability and reflow resistance. A film-like adhesive of the present invention is used for bonding a semiconductor element to an adherend, and includes an adhesive layer comprising at least one resin selected from the group consisting of polyurethaneimide resins, polyurethaneamideimide resins and polyurethaneimide-polyurethaneamideimide resins. | 09-23-2010 |
20100295190 | PHOTOSENSITIVE ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, METHOD FOR FORMING ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A photosensitive adhesive composition comprising (A) an alkali-soluble polymer, (B) a thermosetting resin, (C) one or more radiation-polymerizable compounds and (D) a photoinitiator, wherein the 5% weight reduction temperature of the mixture of all of the radiation-polymerizable compounds in the composition is 200° C. or higher. | 11-25-2010 |
20110031631 | PHOTOSENSITIVE ADHESIVE, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A method for manufacturing a semiconductor device | 02-10-2011 |
20110045639 | PHOTOSENSITIVE ADHESIVE - A photosensitive adhesive capable of alkali development, the photosensitive adhesive exhibiting adhesion property for an adherend after it has been patterned by light exposure and development, the photosensitive adhesive being used in a method for producing a semiconductor device | 02-24-2011 |
20110121435 | PHOTOSENSITIVE ADHESIVE COMPOSITION, FILMY ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE, AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE - A photosensitive adhesive composition that comprises (A) a resin with a carboxyl and/or hydroxyl group, (B) a thermosetting resin, (C) a radiation-polymerizable compound and (D) a photoinitiator, wherein the 3% weight reduction temperature of the entire photoinitiator mixture in the composition is 200° C. or greater. | 05-26-2011 |
20110151195 | PHOTOSENSITIVE ADHESIVE COMPOSITION, AND FILM ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER AND SEMICONDUCTOR DEVICE USING THE PHOTOSENSITIVE ADHESIVE COMPOSITION - There is provided a photosensitive adhesive composition having a lowest melt viscosity at 20° C. to 200° C. after pattern formation of 30,000 Pa·s or lower. | 06-23-2011 |
20110159238 | PHOTOSENSITIVE ADHESIVE COMPOSITION, PHOTOSENSITIVE FILM ADHESIVE, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE, SEMICONDUCTOR DEVICE AND ELECTRONIC COMPONENT - A photosensitive adhesive composition that can form an adhesive layer on an adherend and allows an adhesive pattern to be formed by exposure treatment with radiation and developing treatment with a developing solution, the photosensitive adhesive composition having solubility and developability, and the film thickness T | 06-30-2011 |
20110176288 | ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTING STRUCTURE FOR CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE - The adhesive composition of the invention comprises a thermoplastic resin, a radical polymerizing compound, a radical polymerization initiator and a radical polymerization regulator. According to the present invention it is possible to provide an adhesive composition, a circuit connecting material, a connection structure for a circuit member and a semiconductor device whereby curing treatment can be carried out with sufficient speed at low temperature, curing treatment can be carried out with a wide process margin, and adequately stable adhesive strength can be obtained. | 07-21-2011 |
20110187009 | ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET AND SEMICONDUCTOR DEVICE - The adhesive composition of the invention comprises (A) a thermoplastic resin with a Tg of no higher than 100° C. and (B) a thermosetting component, wherein the (B) thermosetting component includes (B1) a compound with an allyl group and (B2) a compound with a maleimide group. | 08-04-2011 |
20110223397 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - The invention provides a semiconductor device comprising a semiconductor element and an adherend, thermocompression bonded via a patterned photosensitive film adhesive, wherein the water content of the patterned photosensitive film adhesive just before thermocompression bonding is no greater than 1.0 wt %, with the aim of providing a semiconductor device exhibiting excellent heat resistance. | 09-15-2011 |
20120282547 | PHOTOSENSITIVE ADHESIVE - A photosensitive adhesive capable of alkali development, the photosensitive adhesive exhibiting adhesion property for an adherend after it has been patterned by light exposure and development, the photosensitive adhesive being used in a method for producing a semiconductor device | 11-08-2012 |
20130062787 | PHOTOSENSITIVE ADHESIVE COMPOSITION, AND OBTAINED USING THE SAME, ADHESIVE FILM, ADHESIVE SHEET, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND ELECTRONIC PART - A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator. | 03-14-2013 |
20130140083 | ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, CIRCUIT CONNECTION STRUCTURE, METHOD FOR CONNECTING CIRCUIT MEMBERS, USE OF ADHESIVE COMPOSITION, USE OF FILM-LIKE ADHESIVE AND USE OF ADHESIVE SHEET - An adhesive composition for bonding a first circuit member including a first circuit electrode formed on a first circuit substrate and a second circuit member including a second circuit electrode formed on a second circuit substrate, the first circuit electrode and the second circuit electrode being electrically connected, wherein at least one substrate among the first circuit substrate and the second circuit substrate includes a thermoplastic resin having a glass transition temperature of not more than 200° C. The adhesive composition contains core-shell type silicon particles having a core layer and a shell layer provided for coating the core layer. | 06-06-2013 |
20140322635 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING PATTERNED CURED FILM, AND ELECTRONIC COMPONENT - There is provided a photosensitive resin composition containing (A) an alkali-soluble resin, (B) a compound which generates an acid when exposed to light, (C) a thermal crosslinking agent, and (D) a nitrogen-containing aromatic compound represented by the following formula (1): | 10-30-2014 |
20150024173 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING PATTERNED CURED FILM, AND ELECTRONIC COMPONENT - The invention provides a photosensitive resin composition comprising (A) an alkali-soluble resin having a phenolic hydroxyl group, (B) a compound that generates an acid by light, and (C) an acrylic resin having a group that crosslinks with the component (A), as well as a method for manufacturing a patterned cured film, and an electronic component prepared therewith. | 01-22-2015 |
Patent application number | Description | Published |
20120133061 | PHOTOSENSITIVE ADHESIVE, AND FILM ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, AND SEMICONDUCTOR DEVICE, WHICH ARE MADE USING SAME - To provide a photosensitive adhesive which is sufficiently excellent in terms of all the properties of attachment, pattern formability, thermocompression bondability and high-temperature adhesion, and which has thermocompression bondability for adherends after patterning by exposure and development, and is capable of alkali development, as well as a film adhesive, an adhesive sheet, an adhesive pattern, a semiconductor wafer with an adhesive layer and a semiconductor device, which employ the same. A photosensitive adhesive comprising (A) an imide group-containing resin with a fluoroalkyl group, (B) a radiation-polymerizable compound, (C) a photoinitiator and (D) a thermosetting component. | 05-31-2012 |
20130075142 | ADHESIVE COMPOSITION, USE THEREOF, CONNECTION STRUCTURE FOR CIRCUIT MEMBERS, AND METHOD FOR PRODUCING SAME - An adhesive composition for connection between a first circuit member having a first connecting terminal on the main surface and a second circuit member having a second connecting terminal on the main surface, wherein the first circuit member and/or second circuit member are made of a base material containing a thermoplastic resin with a glass transition temperature of no higher than 200° C., the first connecting terminal and/or second connecting terminal are made of ITO and/or IZO, and the adhesive composition includes a phosphate group-containing compound, the free phosphate concentration of the cured adhesive composition being no greater than 100 ppm by mass. | 03-28-2013 |
20130340813 | SOLAR CELL MODULE AND METHOD OF MANUFACTURING THEREOF - Provided is a method of manufacturing a solar cell module including: a step (A) of applying a conductive adhesive composition comprising conductive particles having metal, or the like; a step (B) of disposing wiring members so as to face with electrodes of the solar battery cells with the applied conductive adhesive composition interposed therebetween; a step (C) of heating the solar battery cells with the wiring members obtained in the step (B); and a step (D) of laminating sealing resins onto both surfaces of the solar battery cells with the wiring members obtained in the step (C), laminating protection glass onto a light-receiving surface of the solar battery cell and a protection film onto a rear surface of the solar battery cell, and performing heating, in which a melting point of the metal in the conductive particles is or lower than the heating temperature in the step (C). | 12-26-2013 |
20140120462 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN-CURED FILM USING PHOTOSENSITIVE RESIN COMPOSITION, AND ELECTRONIC COMPONENT - A photosensitive resin composition including: (a) a polybenzoxazole precursor; (b) a photosensitizer; (c) a solvent; (d) a cross-linking agent; and (e) a heterocyclic compound including a hydroxyl group, an alkoxy group or a carboxyl group within a molecule. | 05-01-2014 |