Ying, Singapore
Jackie Yi Ru Ying, Singapore SG
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20130236377 | APPARATUS FOR PERFORMING A REACTION IN A DROPLET AND METHOD OF USING THE SAME - An apparatus for processing a biological and/or chemical sample in a liquid droplet is provided. The apparatus includes a processing compartment, a base and at least one circumferential wall. The processing compartment is defined by at least a part of the base, at least a part of the circumferential wall and an inlet member. The inlet member is located on top of the processing compartment, and includes at least one droplet inlet channel, which extends through the inlet member and includes a contraction between the inlet opening of the droplet inlet channel to the environment and the outlet opening to the processing compartment. | 09-12-2013 |
Ji-Feng Ying, Singapore SG
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20140023823 | DIRECT DATA CONNECTORS FOR A SEALED DEVICE AND METHODS FOR FORMING A DIRECT DATA CONNECTOR FOR A SEALED DEVICE - According to various embodiments, a method for forming a direct data connector for a sealed device may be provided. The method may include: providing a substrate with a hole; and filling the hole with a filling material using a plating process. | 01-23-2014 |
Jin Ying, Singapore SG
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20090315125 | SEMICONDUCTOR DEVICES AND METHODS WITH BILAYER DIELECTRICS - A semiconductor device is disclosed that includes: a substrate; a first dielectric layer formed over the substrate and formed of a first high-k material, the first high-k material selected from the group consisting of HfO | 12-24-2009 |
20110001194 | Hybrid Process for Forming Metal Gates - A semiconductor structure and methods for forming the same are provided. The semiconductor structure includes a first MOS device of a first conductivity type and a second MOS device of a second conductivity type opposite the first conductivity type. The first MOS device includes a first gate dielectric on a semiconductor substrate; a first metal-containing gate electrode layer over the first gate dielectric; and a silicide layer over the first metal-containing gate electrode layer. The second MOS device includes a second gate dielectric on the semiconductor substrate; a second metal-containing gate electrode layer over the second gate dielectric; and a contact etch stop layer having a portion over the second metal-containing gate electrode layer, wherein a region between the portion of the contact etch stop layer and the second metal-containing gate electrode layer is substantially free from silicon. | 01-06-2011 |
Law Kung Ying, Singapore SG
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20090235517 | Progressive and transfer die stamping - Numerous embodiments of a method to form a base plate for a hard disk drive are described. In one embodiment, a blank base plate is advanced through plurality of die stations and parts of the base plate are press worked to form a disk drive base plate. In one embodiment, the blank base plate may be press worked by stamping the base plate with a progressive die assembly. In an alternative embodiment, the blank base plate may be press worked by stamping the base plate with a transfer die assembly. | 09-24-2009 |
Ming Ying, Singapore SG
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20090309207 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DIE AND PACKAGE COMBINATION - An integrated package system with die and package combination includes forming a leadframe having internal leads and external leads, encapsulating a first integrated circuit on the leadframe, and encapsulating a second integrated circuit over the first integrated circuit. | 12-17-2009 |
20090309237 | SEMICONDUCTOR PACKAGE SYSTEM WITH SUBSTRATE HAVING DIFFERENT BONDABLE HEIGHTS AT LEAD FINGER TIPS - A semiconductor package system is provided. A substrate having a die attach paddle is provided. A first plurality of leads is provided around the die attach paddle having a first plurality of lead tips. A second plurality of leads is provided around the die attach paddle interleaved with the first plurality of leads, at least some of the second plurality of leads having a plurality of depression lead tips. A first die is attached to the die attach paddle. The die is wire bonded to the first plurality of leads and the second plurality of leads. The die is encapsulated. | 12-17-2009 |
20110233744 | INTEGRATED CIRCUIT PROTRUDING PAD PACKAGE SYSTEM AND METHOD FOR MANUFACTURING THEREOF - A method for manufacturing an integrated circuit package system includes: providing a leadframe; forming a protruding pad on the leadframe; attaching a die to the leadframe; electrically connecting the die to the leadframe; and encapsulating at least portions of the leadframe, the protruding pad, and the die in an encapsulant. | 09-29-2011 |
Ming Hua Ying, Singapore SG
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20090203988 | Apparatus And Method For Non-Invasively Sensing Pulse Rate And Blood Flow Anomalies - The present invention provides an apparatus and method for non-invasively sensing pulse rate and blood flow anomalies using a localized, uni-directional, and constant magnetic field. The apparatus comprises a magnetic source for producing the magnetic field, a signal acquisition module with a magnetic sensor for detecting the modulations of the magnetic field caused by the blood flow; and a signal processing module for processing the acquired signals so as to produce data of pulse rate and blood flow anomalies. The method senses pulse rate and blood flow anomalies by providing a localized, uni-directional, and constant magnetic field in proximity to a blood vessel; detecting the variations of the magnetic field caused by the flow of pulsatile blood within the blood vessel; and processing the signals of the detected variations so as to monitor the blood flow. | 08-13-2009 |
Ning Ying, Singapore SG
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20090220629 | MOLDING APPARATUS INCORPORATING PRESSURE UNIFORMITY ADJUSTMENT - A molding apparatus comprises first and second mold chases that are configured to clamp an electronic device therebetween, and a driving mechanism which drives the first and second mold chases to apply a clamping force onto the electronic device. A pressure adjustment mechanism communicates with at least one of the mold chases and applies an additional clamping pressure onto one or more portions of the mold chase. The pressure adjustment mechanism comprises movable supports that are displaceable in directions which are substantially perpendicular to the direction of the clamping force so as to transmit and apply the said additional clamping pressure onto the mold chase, and also a plurality of piezoelectric actuators which are operative to apply displacement forces to the movable supports in their displacement directions. | 09-03-2009 |
Sea Mang Ying, Singapore SG
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20140362394 | Apparatus and Methods for Dispensing At Least One Segment of a Printed Media Sheet with a Plurality of Segments - There is provided an apparatus and a method for dispensing printed labels from a printer. The printed labels may be prepared on a need basis, such that each printed label is either held in the apparatus or ejected from the apparatus. Some advantages of the apparatus and method include prolonging a lifespan for a print head, and minimisation of transition error on a media used for printing. | 12-11-2014 |
Wong Tak Ying, Singapore SG
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20090096489 | HIGH VOLTAGE TOLERANT OVER-CURRENT DETECTOR - A system comprising an over-current detector configured to receive a switching voltage signal and to produce a first and a second current signal; an current-to-voltage converter configured to convert the first and second current signals into a first and a second voltage signal; and a current mirror amplifier configured to utilize the first and second voltage signals to output an over-current condition signal when the switching signal has exceeded a threshold value. | 04-16-2009 |
Y. Jackie Ying, Singapore SG
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20100000304 | Apparatus For Performing a Reaction In a Droplet and Method of Using the Same - An apparatus for processing a biological and/or chemical sample in a liquid droplet ( | 01-07-2010 |