Patent application number | Description | Published |
20110031012 | PROTECTING APPARATUS FOR SOLID STATE DRIVE - A protecting apparatus includes a receiving box for receiving a solid state drive, and a cover pivotably connected to the receiving box. The receiving box includes a base. Two feet protrude down from a bottom of the base for fixing the receiving box to a motherboard. A through hole is defined in the base for allowing a connector of the motherboard to extend into the receiving box to electrically connect to the solid state drive. The protecting apparatus can protect the solid state drive from knock and loose. | 02-10-2011 |
20110053485 | SERVER RACK WITH BAFFLE DEVICE - A server rack for receiving a plurality of modules includes two parallel side plates, a clapboard, and a baffle device. The clapboard is disposed between the two side plates substantially perpendicular to the two side plates to form a receiving space. The receiving space defines an air inlet and a module entry opposite to the air inlet. The baffle device is received in the receiving space. The baffle device includes two resisting assemblies installed on the two side plates oppositely. Each resisting assembly includes a baffle. The baffle includes a securing portion and a latching portion opposite to the securing portion. The securing portion of each baffle is rotatably secured on the corresponding side plate. A total length of the two baffles is larger than the width of the receiving space. The two baffles are inclined toward the air inlet. The two latching portions of the two baffles are latched facing the air inlet, to cover the module entry when no module is received in the receiving space. | 03-03-2011 |
20110237121 | CONNECTOR AND PRINTED CIRCUIT BOARD ASSEMBLY - A connector and printed circuit board assembly includes a printed circuit board, a connector fixed on the printed circuit board, and a fixing board fixed on the connector, the fixing board defining a through hole, a connecting member fixed on the printed circuit board adjacent to the connector, a threaded retainer, and a threaded post securely connected with the connecting member. The threaded post passes through the through hole and seats the threaded retainer to lock the connector onto the printed circuit board. | 09-29-2011 |
20120108088 | ELECTRONIC APPARATUS AND COVER MECHANISM - An electronic apparatus includes an enclosure defining a connector port, and a cover mechanism. The cover mechanism includes a bracket mounted to the enclosure, a cover rotatably mounted to the bracket to cover or uncover the connector port. The cover includes an elastic lock. When the cover is rotated to cover the connector port, the elastic lock is engaged with a sidewall of the connector port. | 05-03-2012 |
Patent application number | Description | Published |
20080230913 | Stackable semiconductor device and fabrication method thereof - The invention provides a stackable semiconductor device and a fabrication method thereof, including providing a wafer having a plurality of dies mounted thereon, both the die and the wafer having an active surface and a non-active surface opposing one another respectively, wherein each die has a plurality of solder pads formed on the active surface thereof and a groove formed between adjacent solder pads to form a first metal layer therein that is electrically connected to the solder pads; subsequently thinning the non-active surface of the wafer to where the grooves are located to expose the first metal layer therefrom, and forming a second metal layer on the non-active surface of the wafer for electrically connecting with the first metal layer; and separating the dies to form a plurality of stackable semiconductor devices. Thereby, the first and second metal layers formed on the active surface and the non-active surface of the semiconductor device can be stacked and connected to constitute a multi-die stack structure, thereby increasing integration without increasing the area of the stacked dies. Further, the problems known in the prior art of poor electrical connection, complicated manufacturing process and increased cost as a result of using wire bonding and TSV can be avoided. | 09-25-2008 |
20080251937 | Stackable semiconductor device and manufacturing method thereof - A stackable semiconductor device and a manufacturing method thereof are disclosed. The method includes providing a wafer comprised of a plurality of chips, wherein a plurality of solder pads are formed on the active surface of each chip, and a plurality of grooves are formed between the solder pads of any two adjacent ones of the chips; forming a dielectric layer on regions between the solder pads of any two adjacent ones of the chips ; forming a metal layer on the dielectric layer electrically connected to the solder pads and forming a connective layer on the metal layer, wherein the width of the connective layer is smaller than that of the metal layer; cutting along the grooves to break off the electrical connection between adjacent chips; thinning the non-active surface of the wafer to the extent that the metal layer is exposed from the wafer; and separating the chips to form a plurality of stackable semiconductor devices. Accordingly, a multi-chip stack structure can be obtained by stacking and electrically connecting a plurality of semiconductor devices through the electrical connection between the connective layer of a semiconductor device and the metal layer of another semiconductor device, thereby effectively integrating more chips without having to increase the stacking area, and further the problems of poor electrical connection, complicated manufacturing processes and high costs known in the prior art can be avoided. | 10-16-2008 |
20090014860 | Multi-chip stack structure and fabricating method thereof - A multi-chip stack structure and a manufacturing method thereof are provided. The fabrication method includes the steps of: providing a chip carrier having a first surface and a second surface opposing thereto and at least a first chip and a second chip mounted on the first surface; electrically connecting the chips to the chip carrier by a plurality of bonding wires; and stacking at least a third chip on the first and second chips by a film deposed therebetween, wherein the third chip is stepwise stacked on the first chip and at least a part of the bonding wire connected to the second chip is covered by the film, and electrically connecting the third chip and the chip carrier by a bonding wire, thereby enabling a plurality of chips to be stacked on the chip carrier to enhance the electrical performance of electronic products. | 01-15-2009 |