Patent application number | Description | Published |
20090171013 | WHITE HEAT-CURABLE SILICONE RESIN COMPOSITION, OPTOELECTRONIC PART CASE, AND MOLDING METHOD - A silicone resin composition comprising (A) a heat-curable organopolysiloxane having a melting point of 40-130° C., (B) a white pigment, (C) an inorganic filler, and (D) a curing catalyst is transfer or compression moldable at elevated temperatures into a cured product having white color, heat resistance, light resistance and minimal yellowing. The cured product is suited as a case in which an optoelectronic part is enclosed. | 07-02-2009 |
20090239997 | WHITE THERMOSETTING SILICONE RESIN COMPOSITION FOR MOLDING AN OPTICAL SEMICONDUCTOR CASE AND OPTICAL SEMICONDUCTOR CASE - A white thermosetting silicone resin composition for molding an optical semiconductor case and a case for an optical semiconductor such as LED are provided. The composition comprises (A) a thermosetting organopolysiloxane, (B) a white pigment, (C) an inorganic filler (excluding the white pigment), (D) a condensation catalyst, and (E) a coupling agent represented by the following formula: R | 09-24-2009 |
20090304961 | WHITE HEAT-CURABLE SILICONE RESIN COMPOSITION AND OPTOELECTRONIC PART CASE - A white heat-curable silicone resin composition comprising (A) a heat-curable organopolysiloxane, (B) a white pigment, (C) an inorganic filler, and (D) a condensation catalyst cures into a white uniform product having heat resistance, light resistance and minimal yellowing. The cured composition has a reflectance of at least 80% at wavelength 350-400 nm. The composition is useful for forming cases on optoelectronic parts, typically LED. | 12-10-2009 |
20090306263 | WHITE HEAT-CURABLE SILICONE RESIN COMPOSITION AND OPTOELECTRONIC PART CASE - A white heat-curable silicone resin composition comprising (A) a heat-curable organopolysiloxane, (B) a white pigment, (C) an inorganic filler, and (D) a condensation catalyst cures into a white uniform product having heat resistance, light resistance and minimal yellowing. The cured composition has a thermal conductivity of 1-10 W/mK. The composition is useful for forming cases on optoelectronic parts, typically LED. | 12-10-2009 |
20100001311 | HEAT-CURABLE SILICONE RESIN-EPOXY RESIN COMPOSITION, AND PREMOLDED PACKAGE MOLDED FROM SAME - A heat-curable silicone resin-epoxy resin composition that is ideal as a premolded package for a high-brightness LED or solar cell. The composition contains (A) a heat-curable silicone resin, (B) a combination of a triazine derivative epoxy resin and an acid anhydride, or a prepolymer obtained by reaction of them, (C) an inorganic filler, and (D) a curing accelerator. The composition exhibits excellent curability, and yields a uniform cured product that displays excellent retention of heat resistance and light resistance over long periods of time, and suffers minimal yellowing. | 01-07-2010 |
20100081748 | SILICONE RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR DEVICES - The present invention provides a silicone resin composition for an optical semiconductor device, comprising | 04-01-2010 |
20100125116 | HEAT-CURABLE RESIN COMPOSITION - A heat-curable resin composition that yields a cured product having excellent heat resistance and light resistance, and a premolded package molded using the composition. The heat-curable resin composition comprises components (A) to (E) listed below: (A) an isocyanuric acid derivative containing at least one epoxy group within each molecule, in an amount of 100 parts by mass, (B) a silicone resin containing at least one epoxy group within each molecule, in an amount of 10 to 1,000 parts by mass, (C) an acid anhydride curing agent, in an amount such that the ratio of [total epoxy group equivalents within component (A) and component (B)/carboxyl group equivalents within component (C)] is within a range from 0.6 to 2.2, (D) a curing accelerator, in an amount within a range from 0.05 to 5 parts by mass per 100 parts by mass of the combined mass of components (A), (B) and (C), and (E) an inorganic filler, in an amount of 200 to 1,000 parts by mass per 100 parts by mass of the combined mass of components (A), (B) and (C). | 05-20-2010 |
20100148380 | THERMOSETTING EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE - A thermosetting epoxy resin composition comprising (A) a reaction mixture of a triazine derivative epoxy resin and an acid anhydride at a ratio of the epoxy group equivalent to the acid anhydride equivalent of 0.6 to 2.0; (B) an internal mold release agent; (C) a reflective material; (D) an inorganic filler; and (E) a curing catalyst. The internal mold release agent of component (B) comprises a carboxylate ester represented by: | 06-17-2010 |
20100273927 | SILICONE RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR DEVICES AND AN OPTICAL SEMICONDUCTOR DEVICE - Silicone resin composition for optical semiconductor devices, providing cured product wherein warpage in the devices is reduced and whiteness, heat-resistance, and light resistance are improved. The composition comprises: (A) an organopolysiloxane of the formula | 10-28-2010 |
20110054072 | WHITE HEAT-CURABLE SILICONE/EPOXY HYBRID RESIN COMPOSITION FOR OPTOELECTRONIC USE, MAKING METHOD, PREMOLDED PACKAGE, AND LED DEVICE - A white heat-curable silicone/epoxy hybrid resin composition is provided comprising (A) a heat-curable silicone resin, (B) a triazine derived epoxy resin composition, (C) a white pigment, (D) an inorganic filler, and (E) an antioxidant. Antioxidant (E) is a phosphite compound having formula: P(OR | 03-03-2011 |
20110065872 | UNDERFILL COMPOSITION AND AN OPTICAL SEMICONDUCTOR DEVICE - A purpose of the present invention is to provide an underfill composition for optical semiconductor devices which can provide a cured product whose moldability, adhesiveness to a gold bump, heat-resistance, and light resistance are better. The present invention is an underfill composition, comprising (A) 60 to 99 parts by weight of a branched organopolysiloxane having a weight average molecular weight of from 500 to 20000, reduced to polystyrene, and represented by the average compositional formula (1); (B) 250 to 1000 parts by weight of an inorganic filler; (C) 0.01 to 10 parts by weight of a condensation catalyst; (D) 1 to 40 parts by weight of an organopolysiloxane having a linear diorganopolysiloxane moiety, represented by the formula (2), provided that a total amount of component (A) and component (D) is 100 parts by weight; and (E) 0.2 to 2.0 parts by weight of silane coupling agent. | 03-17-2011 |
20110241048 | RESIN COMPOSITION, REFLECTOR FOR LIGHT-EMITTING SEMICONDUCTOR DEVICE, AND LIGHT-EMITTING SEMICONDUCTOR UNIT - Disclosed herein is a resin composition including 100 parts by weight of an organic resin and 50 to 1,000 parts by weight of an inorganic filler, wherein 10 to 100% of the inorganic filler is composed of an oxide of a rare earth element. | 10-06-2011 |
20130026522 | SURFACE-MOUNT LIGHT EMITTING DEVICE - A surface-mount light emitting device is provided comprising a light emitting element ( | 01-31-2013 |
20130312906 | Surface-Mount Light Emitting Device - A surface-mount light emitting device is provided comprising a light emitting element ( | 11-28-2013 |