Patent application number | Description | Published |
20120175690 | SI PHOTODIODE WITH SYMMETRY LAYOUT AND DEEP WELL BIAS IN CMOS TECHNOLOGY - A silicon photodiode with symmetry layout and deep well bias in CMOS technology is provided. The silicon photodiode includes a substrate, a deep well, and a PN diode structure. The deep well is disposed on the substrate, where an extra bias is applied to the deep well. The region surrounded by the deep well forms the main body of the silicon photodiode. The PN diode structure is located in the region surrounded by the deep well, where the silicon photodiode has a symmetry layout. The deep well is adopted when fabricating the silicon photodiode, and the extra bias is applied to the deep well to eliminate the interference and effect of the substrate absorbing light, and further greatly improve speed and bandwidth. Furthermore, the silicon photodiode has a symmetry layout, so that uniform electric field distribution is achieved, and the interference of the substrate noise is also reduced. | 07-12-2012 |
20130026604 | LATERAL AVALANCHE PHOTODIODE STRUCTURE - A lateral avalanche photodiode structure including a substrate, a PN diode and a metal layer is provided. The substrate has at least one first electrode area, at least one light receiving area, and at least one second electrode area which are arranged horizontally. The first electrode area is also an avalanche area, and the light receiving area is between the first electrode area and the second electrode area. The PN diode is disposed in the substrate in the first electrode area. The metal layer is disposed on the substrate and covers the first electrode area and the second electrode area, but does not cover the light receiving area. | 01-31-2013 |
Patent application number | Description | Published |
20090002584 | ACTIVE MATRIX SUBSTRATE AND LIQUID CRYSTAL DISPLAY PANEL THEREOF - An active matrix substrate is provided, which includes a substrate, a plurality of scan lines, data lines, pixel unites, and pre-charge components. The scan lines, data lines and pixel units are all disposed on the substrate. The pixel units are electrically connected with the corresponding scan lines and data lines. Each pixel unit includes an active device and a pixel electrode. The active devices are electrically connected with the scan lines, the data lines and the pixel electrodes. Each pre-charge component is electrically connected with one of the scan lines and two adjacent pixel electrodes controlled by the next scan line. When the pre-charge component is turned on via the scan line electrically connected therewith, the two adjacent pixel electrodes electrically connected with each pre-charge component have the same voltage level so that the two adjacent pixel units are pre-charged. | 01-01-2009 |
20090091670 | PIXEL CIRCUIT STRUCTURE - A pixel circuit structure applied in an LCD panel, which has a common voltage and includes at least one data line, is provided. The pixel circuit structure includes a first and a second circuit. The first circuit includes a first switch and a first capacitor. The second circuit includes a second switch, a third switch and a second capacitor. One end of the first capacitor receives the common voltage. Two ends of the first switch are respectively coupled to the data line and the other end of the first capacitor. The second and the third switch are coupled serially between the data line and a voltage source. One end of the second capacitor receives the common voltage, and the other end is coupled between the second and the third switch. The potential difference between the two ends of the first capacitor is different from that of the second capacitor. | 04-09-2009 |
20090115923 | LIQUID CRYSTAL DISPLAY PANEL AND LIQUID CRYSTAL DISPLAY DEVICE USING THE SAME - A LCD panel includes a data line, first and second scan lines, first and second pixels and an auxiliary electrode. The first pixel has a first pixel electrode, first and second switches. The first switch has an input terminal coupled to the data line, a control terminal coupled to the first scan line and an output terminal coupled to the first pixel electrode. The second switch has an input terminal coupled to the data line and a control terminal coupled to the first scan line. The second pixel has a second pixel electrode and a third switch. The third switch has an input terminal coupled to the data line, a control terminal coupled to the second scan line and an output terminal coupled to the second pixel electrode. The auxiliary electrode coupled to an output terminal of the second switch is adjacent to the second pixel electrode. | 05-07-2009 |
20090135324 | LIQUID CRYSTAL DISPLAY PANEL AND DRIVING MEHTOD THEREOF AND LIQUID CRYSTAL DISPLAY DEVICE USING THE SAME - A liquid crystal display panel including a data line, a first, a second and a third scan line, a first, a second and a third switch, and a first, a second and a third pixel electrode is provided. These scan lines are sequentially disposed next to each other. Each switch has a control end, an input end and an output end. These control ends are respectively coupled to these scan lines. These input ends are coupled to the data line. These output ends are respectively coupled to the pixel electrodes. A first extending electrode of the first pixel electrode is near the second pixel electrode, a second extending electrode of the second pixel electrode is near the third pixel electrode, and a third extending electrode of the third pixel electrode is near the first extending electrode. | 05-28-2009 |
20090244463 | LIQUID CRYSTAL DISPLAY PANEL - An LCD panel includes a first polarizer, a second polarizer, an active device array substrate, an opposite substrate, a plurality of alignment structures and a liquid crystal layer. The first polarizer has a first absorption axis. The active device array substrate has a plurality of pixel regions. The alignment structures are disposed on a side of the active device array substrate adjacent to the opposite substrate or on a side of the opposite substrate adjacent to the active device array substrate, and respectively correspond to the pixel regions. Within each of the pixel region, a first included angle between an extending direction of a part of the alignment structures and the first absorption axis is not equal to a second included angle between an extending direction of another part of the alignment structures and the first absorption axis. | 10-01-2009 |
20100060837 | COLOR WASHOUT REDUCING LIQUID CRYSTAL DISPLAY PANEL AND LCD DEVICE USING THE SAME - A color washout reducing LCD panel including a first substrate, a second substrate and a liquid crystal layer sealed between the first and second substrates is provided. The first substrate includes several thin film transistors (TFTs) arranged in an array and several pixel electrodes each electrically connected to one TFT. Each pixel electrode has a first and a second electrode blocks. The first electrode block has several first slits, wherein a first interval of the first electrode block is perpendicular to the first slits, and a first width of the first electrode block is between any two neighboring first slits. The second electrode block has several second slits, wherein a second interval of the second electrode block is perpendicular to the second slit and not equal to the first interval, and a second width of the second electrode block is between any two neighboring second slits. | 03-11-2010 |
20130187865 | DISPLAY APPARATUS - A display apparatus includes a transparent substrate, a transparent matrix layer, a black matrix layer and a conductive layer. The transparent matrix layer is disposed above the transparent substrate. The black matrix layer is disposed below the transparent substrate. The conductive layer is disposed between the transparent substrate and the black matrix layer. | 07-25-2013 |
20130328052 | PIXEL STRUCTURE, METHOD OF MANUFACTURING PIXEL STRUCTURE, AND ACTIVE DEVICE MATRIX SUBSTRATE - A pixel structure, a method of manufacturing the pixel structure, and an active device matrix substrate are provided. The pixel structure includes a first patterned metal layer having a common line and a gate; a first insulation layer; a semiconductor pattern; a second patterned metal layer having a source and a drain both electrically connected to the semiconductor pattern; a second insulation layer having a contact opening exposing the drain; and an electrode layer having a common electrode, and a pixel electrode connected to the drain through the contact opening. The common line, the first insulation layer, and the pixel electrode constitute a first storage capacitor. The common line, the drain, and the common electrode constitute a sandwich structure. | 12-12-2013 |
20140015775 | TOUCH MODULE WITH LIQUID CRYSTAL LENS AND DISPLAY APPARATUS HAVING THE SAME - The present disclosure provides a touch module with liquid crystal lens that includes only two transparent substrates, a touch sensing conductive pattern, a liquid crystal light valve conductive pattern, a shielding conductive layer, an insulating layer and a liquid crystal layer. The touch sensing conductive pattern is formed on the lower surface of the first transparent substrate. The liquid crystal light valve conductive pattern is formed on the upper surface of the second transparent substrate. The shielding conductive layer is formed under the first transparent substrate. The insulating layer is formed between the first transparent substrate and the shielding conductive layer and covers the touch sensing conductive pattern to insulate the touch sensing conductive pattern from the shielding conductive layer. The liquid crystal layer is positioned between the shield conductive layer and the second transparent substrate. | 01-16-2014 |
20140036207 | LIQUID CRYSTAL DISPLAY PANEL - An LCD panel including an active device array substrate (ADA substrate), an opposite substrate, a black matrix pattern, a liquid crystal layer (LC layer), a first alignment layer and multiple spacers is provided. The black matrix pattern is disposed on the opposite substrate and has multiple first and second bar-shape patterns. The first alignment layer is disposed between the ADA substrate or opposite substrate and the LC layer. A rubbing direction of the first alignment layer is parallel to the extension direction of the first bar-shape patterns. The spacers are disposed between the first alignment layer and the ADA substrate or opposite substrate. The orthogonal projections of the spacers and the first bar-shape patterns on the ADA substrate are overlapped with each other, and the orthogonal projections of multiple rubbing dragging traces surrounding the spacers and the corresponding first bar-shape patterns on the ADA substrate are overlapped with each other. | 02-06-2014 |
20140111470 | THREE-DIMENSIONAL TOUCH DISPLAY PANEL AND METHOD FOR OPERATING THE SAME - The present invention provides a three-dimensional touch display panel including a display panel and an integrated panel. The integrated panel is disposed on the display panel, and the integrated panel includes a first transparent substrate, a first patterned transparent conductive layer disposed on the first transparent substrate, a second transparent substrate disposed opposite to the first transparent substrate, a second patterned transparent conductive layer disposed between the first transparent substrate and the second transparent substrate, a first plate-shaped transparent conductive layer disposed on the second transparent substrate, and a liquid crystal layer disposed between the first patterned transparent conductive layer and the first transparent conductive layer. The first patterned transparent conductive layer includes a plurality of first electrode stripes sequentially arranged along a first direction. The second patterned transparent conductive layer includes a plurality of second electrode stripes sequentially arranged along a second direction different from the first direction. | 04-24-2014 |
Patent application number | Description | Published |
20080268355 | METHOD OF FABRICATING COLOR FILTER - A method of fabricating a color filter is provided. First, a substrate having a light shielding layer formed thereon is provided, wherein the light shielding layer is adopted for defining a plurality of sub-pixel regions on the substrate. Next, a hydrophobic layer is formed on the light shielding layer by stencil printing, or a surface silylation treatment is carried out to clean the light shielding layer by inkjet printing. Next, a color filter layer is formed in the sub-pixel regions. Thus, fabrication method of the present invention is capable of reducing the possibility of intermixing the color ink between adjacent sub-pixel regions. | 10-30-2008 |
20090239163 | COLOR FILTER AND METHOD OF FABRICATING THE SAME - A color filter fabricated by an ink jet process is disclosed. The color filter includes a substrate, a plurality of pixel regions positioned on the surface of the substrate, and a plurality of colored photoresists. Each pixel region includes a plurality of sub-pixel regions, and each colored photoresist is positioned in each sub-pixel region. The colored photoresists include a plurality of hydrophile photoresists and a plurality of hydrophobic photoresists. The hydrophile photoresists and the hydrophobic photoresists are alternately arranged to prevent an overflow of the colored photoresists. | 09-24-2009 |
20100035188 | METHOD OF MANUFACTURING ORGANIC ELECTRO-LUMINESCENCE DEVICE - A manufacturing method of an organic electro-luminescence device is disclosed. The manufacturing method of an organic electro-luminescence device includes sequential steps of: providing a substrate first; forming a first electrode layer on the substrate; forming an insulating layer on the substrate, wherein the insulating layer includes a plurality of openings for exposing the first layer; forming a conducting layer on the sidewall of the insulating layer and on the first electrode layer in the openings; forming a light-emitting layer on the conducting layer in the openings; and finally forming a second electrode layer on the light-emitting layer. The organic electro-luminescence device formed by the above manufacturing method is capable of providing the light-emitting layer with a uniform thickness and therefore raising of yield of the fabricating process and improving of the displaying quality of the organic electro-luminescence device. | 02-11-2010 |
Patent application number | Description | Published |
20140327055 | REPLACEMENT GATE PROCESS AND DEVICE MANUFACTURED USING THE SAME - A replacement gate process is disclosed. A substrate and a dummy gate structure formed on the substrate is provided, wherein the dummy gate structure comprises a dummy layer on the substrate, a hard mask layer on the dummy layer, spacers at two sides of the dummy layer and the hard mask layer, and a contact etch stop layer (CESL) covering the substrate, the spacers and the hard mask layer. The spacers and the CESL are made of the same material. Then, a top portion of the CESL is removed to expose the hard mask layer. Next, the hard mask layer is removed. Afterward, the dummy layer is removed to form a trench. | 11-06-2014 |
20140349452 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES - A method for manufacturing a semiconductor device is provided. A first stack structure and a second stack structure are formed to respectively cover a portion of a first fin structure and a second fin structure. Subsequently, a spacer is respectively formed on the sidewalls of the fin structures through an atomic layer deposition process and the composition of the spacers includes silicon carbon nitride. Afterwards, a interlayer dielectric is formed and etched so as to expose the hard mask layers. A mask layer is formed to cover the second stack structure and a portion of the dielectric layer. Later, the hard mask layer in the first stack structure is removed under the coverage of the mask layer. Then, a dummy layer in the first stack structure is replaced with a conductive layer. | 11-27-2014 |
20150129980 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF - A semiconductor structure comprises a substrate, a plurality of fins, an oxide layer and a gate structure. The fins protrude from the substrate and are separated from each other by the oxide layer. The surface of the oxide layer is uniform and even plane. The gate structure is disposed on the fins. The fin height is distance between the top of the fins and the oxide layer, and at least two of the fins have different fin heights. | 05-14-2015 |
Patent application number | Description | Published |
20090303748 | LIGHT GUIDE DEVICE AND BACKLIGHT MODULE - A light guide device and a backlight module. The backlight module comprises a light guide device and a plurality of light sources. The light guide device comprises a housing, comprising a frame around the housing; and a light guide plate, integrated inside the frame and comprising a light-emitting surface on one side of the light guide plate inside the frame and a light-receiving surface on one edge of the light guide plate, wherein a plurality of slots are disposed between the light guide plate and the frame and on other edges different from the edge whereon the light-receiving surface is disposed, and each of a plurality of barriers is disposed on an inner side of the light guide plate while being adjacent to one of the plurality of slots. The barriers are capable of reflecting the light traveling toward the frame back to the backlight module to improve the light efficiency. | 12-10-2009 |
20110292625 | BONDING PAD STRUCTURE - A bonding pad structure is disclosed, which is composed of two bonding pad units that are symmetrically disposed with respect to an axial line. Each bonding pad units is further composed of at least two bonding pads, i.e. each bonding pad unit is composed of at least one first bonding pad and at least one second bonding pad. In an embodiment, the first bonding pad is arranged next to the axial line and the second bonding pad is arranged at a side of the corresponding first bonding pad away from the axial line while enabling the first bonding pad and the corresponding second bonding pad to be interconnected to each other by a first neck portion. Thereby, a plurality of solder areas of different sizes can be formed by the interconnecting of the at least two bonding pad units that can be used for soldering electronic components of different sizes. | 12-01-2011 |
20140139468 | TOUCH DISPLAY PANEL MODULE AND ASSEMBLY METHOD THEREOF - A touch display panel module includes a display panel module, a touch panel module, and a combining unit. The display panel module is for displaying images, and the display panel module has a first side, a second side opposite to the first side and a plurality of lateral sides between the first side and the second side. The touch panel module is disposed on the first side of the display panel module for sensing touch input. The combining unit includes an anti-permeation tape and an optical adhesive layer. The anti-permeation tape continuously covers on at least one of edges around the first side of the display panel module. The optical adhesive layer is formed between the display panel module and the touch panel module for combining the display panel module and the touch panel module. | 05-22-2014 |
20140321672 | ELECTRONIC DEVICE WITH SPEAKERPHONE AND MICROPHONE - An electronic device with speakerphone and microphone is provided. The electronic device comprises a housing, a sound input unit, a sound output unit, an audio signal receiving terminal, an acoustic processing unit, a signal line and a sealing member. The housing has a microphone shell, a speaker shell and a soundproof structure. The soundproof structure is connected between the microphone shell and the speaker shell. The soundproof structure has a line output hole. The acoustic processing unit connects the sound input unit and the audio signal receiving terminal respectively to receive and mix two audio signals so as to generate an audio output signal. The audio output signal is transmitted to the sound output unit through a signal line. The sealing member is disposed around the line output hole and seals the line output hole. | 10-30-2014 |
20150070601 | ELECTRONIC DEVICE - An electronic device includes a first component, a second component and a combining unit. The first component is disposed correspondingly to the second component, and the combining unit is disposed between the first component and the second component so as to combine the first component with the second component. The combining unit includes a plurality of spacing structures. The spacing structures are used to define an accommodation space between the first component and the second component. Each of the spacing structures has a first end and a second end opposite to the first end. A width of the first end is wider than a width of the second end. | 03-12-2015 |
Patent application number | Description | Published |
20120112898 | PROGRAMMABLE TIRE-CONDITION SENSOR HAVING A FLEXIBLE SHELL, ITS INSTALLATION METHOD AND A TIRE CARRYING SAME - A programmable tire-condition sensor includes a control module, which includes a circuit board carrying a battery, a power switch, a processor, a memory, a pressure sensor, a temperature sensor, an acceleration sensor, a voltage sensor, a transmission interface unit and a connection port, and a flexible shell that has a surface area greater than the circuit board, an uplifted area on the middle, an opening, a switch accommodation hole for accommodating the power switch and a connection port accommodation hole for accommodating the connection port. A vehicle tire is also disclosed having installed therein the programmable tire-condition sensor, and a method is still also disclosed for installing the programmable tire-condition sensor in a vehicle tire. | 05-10-2012 |
20130141229 | EASY-TO-USE TIRE PRESSURE MONITORING DEVICE - An easy-to-use tire pressure monitoring device includes a housing having an air valve at one end thereof, and a circuit board mounted inside the housing and carrying a processor and memory unit, a pressure sensor electrically coupled to the processor and memory unit, a temperature sensor electrically coupled to the processor and memory unit, an acceleration sensor electrically coupled to the processor and memory unit, a low-frequency transmitter interface and a radio-frequency transmitter interface electrically coupled to the processor and memory unit, a battery pack and a trigger sensor coupled to the air valve and the processor and memory unit. | 06-06-2013 |
20130204486 | TOUCH-CONTROL TIRE PRESSURE SENSOR DEVICE AND ITS SETTING METHOD - A touch-control tire pressure sensor device includes a housing holding an air nozzle at one side thereof, a circuit board accommodated in the housing and carrying a processor and memory unit having electrically coupled thereto a pressure sensor unit, a temperature sensor unit, an acceleration sensor unit, a LF transmission interface and a RF transmission interface for transmitting a sensed signal to an on-vehicle main unit, a battery pack providing the circuit board with the necessary working voltage, and a conducting plate having one end connected to the touch sensor IC and an opposite end kept in contact with the air nozzle. | 08-08-2013 |
20140361884 | TPMS Setting Tool - A TPMS setting tool includes a housing carrying a display unit and an input device on the outside and a circuit hoard and a power supply device on the inside, the power supply device and the circuit board being electrically coupled together to provide the TPMS setting tool with the necessary working power supply. The housing has a receptacle provided at one side thereof and a connection port with multiple pins mounted inside the receptacle for the connection of a TPMS, enabling the desired communication protocol and ID code to be written into the inserted TPMS. | 12-11-2014 |
20150097662 | FLEXIBLE BOARD TYPE TIRE PRESSURE SENSOR DEVICE - A flexible board type tire pressure sensor device includes a flexible PC board having a first surface bonded to an inside wall of a tire of a vehicle wheel and a second surface opposite to the first surface, a sensor module installed in the second surface of the flexible PC board for sensing a variety of statuses of the vehicle wheel, a transmission terminal set installed in the second surface of the flexible PC board and electrically connected with the sensor module for allowing transmission of a communication program to the sensor module, and an antenna installed in the second surface of the flexible PC board and electrically connected with the sensor module for sending out a sensor signal generated by the sensor module. Thus, the flexible board type tire pressure sensor device has excellent structural stability to provide accurate sensing results. | 04-09-2015 |
20150210125 | TIRE PRESSURE SENSOR DEVICE SETTING METHOD - A tire pressure sensor device setting method is disclosed to use a setting tool to encode the tire pressure sensor device to be set and to simultaneously write the location information of the tire pressure sensor device into the communication protocol during encoding, enabling the tire pressure sensor device to actively send out a location signal. | 07-30-2015 |
20150239308 | METHOD FOR SETTING MULTIPLE TPMS SENSORS - A TPMS (tire pressure monitoring system) sensor setting method is disclosed to use a setting tool for selecting the ID codes of multiple TPMS sensors and burning a communication protocol into the multiple selected TPMS sensors at a time, significantly shortening the operation time. | 08-27-2015 |
20150343859 | TPMS SENSOR POSITION SETTING METHOD - A TPMS (tire pressure monitoring system) sensor setting method is disclosed and performed by: using a setting tool to input a location code into the TPMS sensor to be set so that the TPMS sensor can feed the location code and its ID to the on-vehicle main unit for enabling the on-vehicle main unit to establish the relationship between the ID of the TPMS sensor and its location. | 12-03-2015 |
Patent application number | Description | Published |
20150035161 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A singulated semiconductor structure comprises a molding compound; a first conductive post in the molding compound having a first geometric shape in a top view; a second conductive post or an alignment mark in the molding compound having a second geometric shape in a top view, wherein the second geometric shape is different from the first geometric shape. The second conductive post or an alignment mark can be positioned at the corner, the center, the edge, or the periphery of the singulated semiconductor structure. The second geometric shape can be any geometric construct distinguishable from the first geometric shape. The second conductive post or an alignment mark can be placed at an active area or a non-active area of the singulated semiconductor structure. | 02-05-2015 |
20150061116 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device includes a carrier, an under bump metallurgy (UBM) pad on the carrier, and a post on a surface of the UBM pad. In some embodiments, a height of the post to a longest length of the UBM pad is between about 0.25 and about 0.7. A method of manufacturing a semiconductor device includes providing a carrier, disposing a UBM pad on the carrier and forming a post on the UBM pad. | 03-05-2015 |
20150130020 | SEMICONDUCTOR PACKAGING AND MANUFACTURING METHOD THEREOF - The present disclosure provides a semiconductor package, which includes a substrate, a passivation layer, a post-passivation interconnect (PPI) having a top surface; and a conductive structure. The top surface of the PPI includes a first region receiving the conductive structure, and a second region surrounding the first region. The second region includes metal derivative transformed from materials made of the first region. The present disclosure provide a method of manufacturing a semiconductor package, including forming a first flux layer covering a portion of a top surface of a PPI; transforming a portion of the top surface of the PPI uncovered by the first flux layer into a metal derivative layer; removing the first flux layer; forming a second flux layer on the first region of the PPI; dropping a solder ball on the flux layer; and forming electrical connection between the solder ball and the PPI. | 05-14-2015 |
20150162288 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME - A semiconductor device having a semiconductor substrate is provided. The semiconductor substrate includes an integrated circuit, which includes multi-layer structured metallization and inter-metal dielectric. The integrated circuit is below a passivation, which is over a metal structure. The metal structure includes a metal pad and an under bumper metallurgy, which is over and aligned with the metal pad. The metal pad is electrically connected to the integrated circuit, and the under bumper metallurgy is configured to electrically connect to a conductive component of another semiconductor device. The integrated circuit further includes a conductive trace, which is below and aligned with the metal structure. The conductive trace is connected to a power source such that an electromagnetic field is generated at the conductive trace when an electric current from the power source passes through the conductive trace. | 06-11-2015 |
20150162291 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME - A semiconductor device having a semiconductor substrate is provided. The semiconductor device has a metal structure over the semiconductor substrate. The metal structure is configured to receive a bump. The semiconductor device further has a conductive trace between the semiconductor substrate and the metal structure. The conductive trace is configured to connect to a power source. When an electric current from the power source passes through the conductive trace, an electromagnetic field is generated at the conductive trace. The position of the bump is adjusted in response to the electromagnetic field. | 06-11-2015 |
20150200173 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF - A semiconductor structure includes a conductive bump for disposing over a substrate and an elongated ferromagnetic member surrounded by the conductive bump, including a first end and a second end, and extending from the first end to the second end, the elongated ferromagnetic member is disposed substantially orthogonal to the substrate to dispose the conductive bump at a predetermined orientation and at a predetermined position of the substrate. Further, a method of manufacturing a semiconductor structure includes providing a substrate, forming a conductive trace within the substrate, applying an electric current passing through the conductive trace to generate an electromagnetic field and disposing a conductive bump including an elongated ferromagnetic member in a predetermined orientation and at a predetermined position above the substrate in response to the electromagnetic field generated by the conductive trace. | 07-16-2015 |
20150348923 | SEMICONDUCTOR DEVICE HAVING TRENCH ADJACENT TO RECEIVING AREA AND METHOD OF FORMING THE SAME - In some embodiments in accordance with the present disclosure, a semiconductor device including a semiconductor substrate is received. An interconnect structure is provided over the semiconductor substrate, and a passivation is provided over the interconnect structure. The passivation includes an opening such that a portion of the interconnect structure is exposed. Moreover, a dielectric is provided over the passivation, and a post-passivation interconnect (PPI) is provided over the dielectric. The PPI is configured to connect with the exposed portion of the interconnect structure through an opening in the dielectric. Furthermore, the PPI includes a receiving area for receiving a conductor, and a trench adjacent to the receiving area. In certain embodiments, the receiving area is defined by the trench. | 12-03-2015 |