Patent application number | Description | Published |
20090301689 | Fastening device and heat-dissipating module having the same - The invention discloses a fastening device for fasten a heat sink onto a base board. The fastening device comprises a first fastening member, a second fastening member and a third fastening member. When assembling the fastening device to the base board, the second fastening member has to be pivoted with the third fastening member first. Afterwards, the first fastening member is attached to the base board. Finally, the second and third fastening members, which have been assembled, are engaged with the first fastening member, so as to press the heat sink tightly. Accordingly, the heat sink will be fastened on the base board easily and stably. | 12-10-2009 |
20090316348 | Electronic apparatus and hinge thereof - The invention discloses a hinge including a first support, a second support, and a sensor. The first support includes a first electrical connection part. The second support includes a second electrical connection part and a protrusion part, and the protrusion part is insulated from the second electrical connection part. The second support is engaged to the first support, and the second electrical connection part detachably and electrically contacts the first electrical connection part. The sensor is respectively and electrically connected to the first electrical connection part and the second electrical connection part. When the first support rotates to a specific position relative to the second support, the first support and the protrusion part are detached. Meanwhile, the sensor correspondingly transmits a signal. | 12-24-2009 |
20100142141 | ELECTRONIC DEVICE AND ASSEMBLY STRUCTURE THEREOF - An assembly structure includes a first body, a second body and a third body. The second body detachably disposed on the first body includes a first positioning portion and a first acting portion. The third body coupled between the first and second bodies includes a second positioning portion and a second acting portion. When the third body is switched to a first predetermined position, the second positioning portion of the third body is pressed against the first positioning portion of the second body along a reference direction, thereby positioning the second body at a first reference position. When the third body is switched from the first predetermined position to a second predetermined position, the second acting portion of the second body is pressed against the first acting portion of the second body, thereby moving the second body from the first reference position to a second reference position. | 06-10-2010 |
20140030907 | DETACHABLE HANDLE AND ELECTRONIC DEVICE USING THE SAME - A detachable handle includes a body, a connector, a pivot joint, and a transmission element. The body includes a plurality of I/O ports. The pivot joint connects the body to the connector for switching a rotational angle between the body and the connector. The transmission element embedded in the body electrically connects the I/O ports to the connector. The pivot joint includes a first pivot plate and a second pivot plate pivoted to each other. A terminal of the first pivot plate is fixed to the body, and a terminal of the second pivot plate is fixed to the connector. An electronic device using the detachable handle is also disclosed. | 01-30-2014 |
20150160692 | POSITIONING FRAME FOR A TOUCH PAD FILM AND METHOD FOR ADHERING A FILM TO A TOUCH PAD - The disclosure provides a positioning frame for a touch pad. The positioning frame includes a main frame and a positioning wall. The positioning wall is located at a side of the main frame and is connected to the main frame. An inner surface of the main frame and the positioning wall define an opening. An area of the opening is approximately the same as an area of a film to be adhered to the touch pad. The positioning wall is configured to insert into a gap between the touch pad and a front cover of a system body. | 06-11-2015 |
Patent application number | Description | Published |
20080203700 | Bicycle frame assembly having a replaceable shock absorber - A bicycle frame assembly includes at least one frame member having a connecting portion, and at least one shock absorber formed as a looped plate member disposed detachably in the connecting portion. The looped plate member has two resilient plate portions each having two opposite ends, and an intermediate portion between the opposite ends. The resilient plate portions are interconnected at the opposite ends. The intermediate portions of the resilient plate portions extend away from each other. | 08-28-2008 |
20080214322 | GOLF CLUB HEAD - A golf club head includes a hollow head body, a metal plate, and a compression resistant plate. The hollow head body is formed with an opening. The metal plate is fixed to the hollow head body, covers the opening, and has a thickness ranging from 0.1 to 0.5 mm. The compression resistant plate is bonded to an inner surface of the metal plate and spans the opening. | 09-04-2008 |
20110117872 | Case for an electronic device with a wireless communicationfunction and method for forming the same - A method for forming a case of an electronic device with a wireless communication function includes: (a) providing a pair of outer prepreg layers, each containing a fiber that permits permeation of an electromagnetic wave; (b) providing a plurality of inner prepreg layers, each of which includes: a first prepreg sheet that contains a first fiber, which permits permeation of an electromagnetic wave; and a second prepreg sheet containing a second fiber that prevents permeation of an electromagnetic wave and that has a strength higher than that of the first fiber; (c) stacking and pressing the inner prepreg layers to obtain an inner laminate; (d) disposing the inner laminate between the outer prepreg layers; and (e) forming the outer prepreg layers and the inner laminate in a mold. A case for an electronic device with a wireless communication function is also disclosed. | 05-19-2011 |
20120115631 | GOLF CLUB - A golf club includes a golf club head, and a shaft extending from one side of the golf club head. The shaft and the golf club head are made as a one-piece body from a prepreg sheet including a fiber structure impregnated with a resin. The fiber structure extends continuously from the shaft to the golf club head. | 05-10-2012 |
Patent application number | Description | Published |
20130024078 | VEHICLE POWER GENERATION SYSTEM AND METHOD THEREOF - The vehicle power generation system includes: a power generation unit, a power supply unit, a clutch mechanism, and a control unit. The power generation unit includes generator, power input shaft, and a power output unit. The clutch mechanism includes a speed increasing unit and a motor controller for attaching the speed increasing unit to the crankshaft or detaching the speed increasing unit from the crankshaft. The control unit is electrically connected to the motor controller, and includes a power generation condition determining unit. | 01-24-2013 |
20130133322 | COOLING SYSTEM FOR AN EXHAUST PIPE OF A VEHICLE - A cooling system for an exhaust pipe of a vehicle has an engine, an exhaust discharging device connected to the engine, a generator driven by the engine and a cooling guide device. Even when the vehicle is idle, the cooling guide device still guides cool air from the generator to the exhaust discharging device to dissipate heat of the exhaust discharging device. Therefore, the heat of the exhaust discharging device is efficiently dissipated. | 05-30-2013 |
20130136580 | COOLING SYSTEM FOR A GENERATOR OF A VEHICLE - A cooling system for a generator of a vehicle has an engine, a generator and a wind collection box. The generator has a rotor driven by the engine and a fan synchronously rotating with the rotor. The wind collection box is connected to the generator via a first guiding tube. The fan draws exterior air from the wind collection box and the first guiding tube to allow the exterior air to flow through the generator. Thus, heat in the generator that is mounted in an airtight engine compartment is dissipated. | 05-30-2013 |
20160069283 | POWER GENERATOR CONTROL APPARATUS OF VEHICLE AND CONTROL METHOD THEREOF - Disclosed are a vehicle power generation control method and an apparatus thereof, wherein, when conditions: a gear is in a target gear state, the gear is in a locked state, a handbrake is in a parking state, opening of an accelerator is in a zero state, an emergency stop switch is in a state of sending a signal, and a temperature of a generator is in a state of a working temperature are established at the same time, the vehicle awaits orders to switch to the power generation mode, otherwise a warning signal is sent. After the vehicle enters into the power generation mode to make the generator generate power to supply power, when the conditions aforementioned are established at the same time, the power generation action is continuously performed, and electricity is cut off from the vehicle when any one of the conditions is not established. | 03-10-2016 |
20160069454 | GEAR POSITION LOCKING MECHANISM OF VEHICLE - A gear position locking mechanism of a vehicle is presented. The vehicle has a gear lever unit and a gear box. The gear box is provided with a gear position sensor. The gear position locking mechanism of the vehicle includes a driving unit and a rocker arm. After receiving a target position signal sensed by the gear position sensor, the driving unit drives the rocker arm to automatically lock the gear lever unit, so that a gear lever of the gear lever unit cannot be shifted by hand. As the rocker arm is provided to prevent a gear position from being directly shifted by hand, the structural design inside the gear lever unit or the gear box does not need to be changed. | 03-10-2016 |
Patent application number | Description | Published |
20120068208 | MICRO-STRUCTURE PHOSPHOR COATING - An optical emitter includes micro-structure phosphor coating on a light-emitting diode die mounted on a package substrate. The micro-structures are transferred onto a micro-structure phosphor coating precursor by patterning and curing the precursor or by curing the precursor through a mold. The micro-structures are half spheroids, three-sided pyramids, or six-sided pyramids. | 03-22-2012 |
20120097986 | WAFER LEVEL REFLECTOR FOR LED PACKAGING - An optical emitter is fabricated by bonding a Light-Emitting Diode (LED) die to a package wafer, electrically connecting the LED die and the package wafer, forming a phosphor coating over the LED die on the package wafer, molding a lens over the LED die on the package wafer, molding a reflector on the package wafer, and dicing the wafer into at least one optical emitter. | 04-26-2012 |
20120113621 | BATWING BEAM BASED LED AND BACKLIGHT MODULE USING THE SAME - A batwing beam is produced from an LED package having a primary LED lens by molding the LED lens directly over an LED on a package substrate. The LED lens includes a cavity over a center of the LED. The cavity surface reflects light from the LED through total internal reflection (TIR) or through a reflectivity gel coating. The cavity may be a cone or a pyramid. | 05-10-2012 |
20130140591 | STRUCTURE AND METHOD FOR LED WITH PHOSPHOR COATING - The present disclosure provides a light emitting diode (LED) apparatus. The LED apparatus includes an LED emitter having a top surface; and a phosphor feature disposed on the LED emitter. The phosphor feature includes a first phosphor film disposed on the top surface of the LED emitter and having a first dimension defined in a direction parallel to the top surface of the LED emitter; a second phosphor film disposed on the first phosphor film and having a second dimension defined in the direction; and the second dimension is substantially less than the first dimension. | 06-06-2013 |
20130299855 | Wafer Level Reflector for LED Packaging - An optical emitter is fabricated by bonding a Light-Emitting Diode (LED) die to a package wafer, electrically connecting the LED die and the package wafer, forming a phosphor coating over the LED die on the package wafer, molding a lens over the LED die on the package wafer, molding a reflector on the package wafer, and dicing the wafer into at least one optical emitter. | 11-14-2013 |
20140054616 | Method and Apparatus for Fabricating Phosphor-Coated LED Dies - The present disclosure involves a method of packaging a light-emitting diode (LED). According to the method, a group of metal pads and a group of LEDs are provided. The group of LEDs is attached to the group of metal pads, for example through a bonding process. After the LEDs are attached to the metal pads, each LED is spaced apart from adjacent LEDs. Also according to the method, a phosphor film is coated around the group of LEDs collectively. The phosphor film is coated on top and side surfaces of each LED and between adjacent LEDs. A dicing process is then performed to slice through portions of the phosphor film located between adjacent LEDs. The dicing process divides the group of LEDs into a plurality of individual phosphor-coated LEDs. | 02-27-2014 |
20140091329 | LED Emitter with Improved White Color Appearance - The present disclosure involves a lighting instrument. The lighting instrument includes a board or substrate, for example, a printed circuit board substrate. The lighting instrument includes a plurality of light-emitting diode (LED) dies disposed on the substrate. The LED dies are spaced apart from one another. Each LED die is covered with a respective individual phosphor coating that is coated around the LED die conformally. Due at least in part to the individual phosphor coatings, the LED dies and the lighting instrument may assume a substantially white appearance in an off state. The lighting instrument also includes an encapsulation structure disposed over the substrate. The encapsulation structure may be a diffuser cap that encapsulates the light-emitting dies within. A diffuser gel fills the space between the encapsulation structure and the LED dies. | 04-03-2014 |
20140103372 | METHOD AND APPARATUS FOR PACKAGING PHOSPHOR-COATED LEDS - The present disclosure involves a method of packaging light-emitting diodes (LEDs). According to the method, a plurality of LEDs is provided over an adhesive tape. The adhesive tape is disposed on a substrate. In some embodiments, the substrate may be a glass substrate, a silicon substrate, a ceramic substrate, and a gallium nitride substrate. A phosphor layer is coated over the plurality of LEDs. The phosphor layer is then cured. The tape and the substrate are removed after the curing of the phosphor layer. A replacement tape is then attached to the plurality of LEDs. A dicing process is then performed to the plurality of LEDs after the substrate has been removed. The removed substrate may then be reused for a future LED packaging process. | 04-17-2014 |
20140106488 | STRUCTURE AND METHOD FOR LED WITH PHOSPHOR COATING - The present disclosure provides a light emitting diode (LED) apparatus. The LED apparatus includes an LED emitter having a top surface; and a phosphor feature disposed on the LED emitter. The phosphor feature includes a first phosphor film disposed on the top surface of the LED emitter and having a first dimension defined in a direction parallel to the top surface of the LED emitter; a second phosphor film disposed on the first phosphor film and having a second dimension defined in the direction; and the second dimension is substantially less than the first dimension. | 04-17-2014 |
20140151725 | Method and Apparatus for Fabricating Phosphor-Coated LED Dies - The present disclosure involves a method of packaging a light-emitting diode (LED). According to the method, a group of metal pads and a group of LEDs are provided. The group of LEDs is attached to the group of metal pads, for example through a bonding process. After the LEDs are attached to the metal pads, each LED is spaced apart from adjacent LEDs. Also according to the method, a phosphor film is coated around the group of LEDs collectively. The phosphor film is coated on top and side surfaces of each LED and between adjacent LEDs. A dicing process is then performed to slice through portions of the phosphor film located between adjacent LEDs. The dicing process divides the group of LEDs into a plurality of individual phosphor-coated LEDs. | 06-05-2014 |
20140151740 | Micro-Structure Phosphor Coating - An optical emitter includes micro-structure phosphor coating on a light-emitting diode die mounted on a package substrate. The micro-structures are transferred onto a micro-structure phosphor coating precursor by patterning and curing the precursor or by curing the precursor through a mold. The micro-structures are half spheroids, three-sided pyramids, or six-sided pyramids. | 06-05-2014 |
20140231836 | STRUCTURE AND METHOD FOR LED WITH PHOSPHOR COATING - The present disclosure provides a light emitting diode (LED) apparatus. The LED apparatus includes an LED emitter having a top surface; and a phosphor feature disposed on the LED emitter. The phosphor feature includes a first phosphor film disposed on the top surface of the LED emitter and having a first dimension defined in a direction parallel to the top surface of the LED emitter; a second phosphor film disposed on the first phosphor film and having a second dimension defined in the direction; and the second dimension is substantially less than the first dimension. | 08-21-2014 |
20140264268 | METHOD AND APPARATUS FOR FABRICATING PHOSPHOR-COATED LED DIES - The present disclosure involves lighting apparatus. The lighting apparatus includes a first doped semiconductor layer. A light-emitting layer is disposed over the first doped semiconductor layer. A second doped semiconductor layer is disposed over the light-emitting layer. The second doped semiconductor layer has a different type of conductivity than the first doped semiconductor layer. A photo-conversion layer is disposed over the second doped semiconductor layer and over side surfaces of the first and second doped semiconductor layers and the light-emitting layer. The photo-conversion layer has an angular profile. | 09-18-2014 |
20140291610 | METHOD AND APPARATUS FOR FABRICATING PHOSPHOR-COATED LED DIES - The present disclosure involves lighting apparatus. The lighting apparatus includes a light-emitting device. The light-emitting device includes a first doped semiconductor layer. A light-emitting layer is disposed over the first doped semiconductor layer. A second doped semiconductor layer is disposed over the light-emitting layer. The second doped semiconductor layer has a different type of conductivity than the first doped semiconductor layer. A photo-conversion layer is coated around the light-emitting device. A lens houses the light-emitting device and the photo-conversion layer within. The lens includes a first sub-layer and a second sub-layer. The first and second sub-layers have different characteristics. | 10-02-2014 |
20140291611 | METHOD AND APPARATUS FOR FABRICATING PHOSPHOR-COATED LED DIES - The present disclosure involves lighting apparatus. The lighting apparatus includes a first doped semiconductor layer. A light-emitting layer is disposed over the first doped semiconductor layer. A second doped semiconductor layer is disposed over the light-emitting layer. The second doped semiconductor layer has a different type of conductivity than the first doped semiconductor layer. A first conductive terminal and a second conductive terminal are each disposed below the first doped semiconductor layer. A photo-conversion layer is disposed over the second doped semiconductor layer and on side surfaces of the first and second doped semiconductor layers and the light-emitting layer. A bottommost surface of the photo-conversion layer is located closer to the second doped semiconductor layer than bottom surfaces of the first and second conductive terminals. | 10-02-2014 |
20140293615 | WIDE ANGLE BASED INDOOR LIGHTING LAMP - The present disclosure provides one embodiment of an illumination structure. The illumination structure includes a substrate. A light-emitting diode (LED) is disposed over the substrate. A first lens is disposed over the LED. A second lens is disposed over the first lens. The first lens and the second lens are configured to refract light that is emitted by the LED backward. | 10-02-2014 |
20140295593 | METHOD AND APPARATUS FOR FABRICATING PHOSPHOR-COATED LED DIES - The present disclosure involves a method. The method includes providing a substrate having a layer disposed thereon. A plurality of light-emitting devices is attached to the layer. A gel is applied over the substrate. The gel covers the plurality of light-emitting devices. The gel is shaped into a plurality of lenses. The lenses each cover a respective one of the light-emitting devices. The light-emitting devices are separated from one another. The substrate and the layer are removed. | 10-02-2014 |
20160072024 | LIGHTING APPARATUS - A lighting apparatus includes a substrate, a plurality of light-emitting dies disposed on the substrate and spaced apart from one another, a continuous structure disposed over the substrate and covering the light-emitting dies within, and a filler. The light-emitting dies each are covered with an individual phosphor coating and the filler is between the continuous structure and the phosphor coating for each of the light-emitting dies. The lighting apparatus has a substantially white appearance when the plurality of light-emitting dies is turned off. | 03-10-2016 |
Patent application number | Description | Published |
20120236048 | LIQUID CRYSTAL DISPLAY AND CONTROLLER AND DRIVING METHOD OF PANEL THEREOF - A liquid crystal display (LCD), a controller and a driving method of a panel thereof are provided. Before the controller drives each data line, the driving polarity of the data lines is adjusted according to the display property of the sub-frame data signal. A first inversion driving method is employed for adjusting the data lines when the display property of the sub-frame data signal is a black frame, and a second inversion driving method is employed for adjusting when the display property of the sub-frame data signal is a color frame. Accordingly, power consumption can be lowered during the process of driving pixels, thereby achieving the purpose of power saving while not affecting the display quality. | 09-20-2012 |
20130257926 | DRIVING METHOD FOR DRIVER CHIP AND DISPLAY METHOD FOR STEREOSCOPIC DISPLAY DEVICE - The present invention provides a display method for a stereoscopic display device. First, a frame formed by a left-eye frame with a first color and a right-eye frame with a second color different from the first color is generated with a liquid crystal panel. A first light source emitting a first light beam of the first color and a second light source emitting a second light beam of the second color of the stereoscopic display device are turned on. The first light beam and the second light beam are guided separately toward the liquid crystal panel with the directional light guide plate. When the liquid crystal panel generates the frame, the first light beam and the second light beam penetrate the liquid crystal panel separately, and the left-eye frame and the right-eye frame are displayed at a first view angle and a second view angle respectively. | 10-03-2013 |
20140043448 | AUTO-STEREOSCOPIC THREE-DIMENSIONAL DISPLAY AND DRIVING METHOD THEREOF - An auto-stereoscopic three-dimensional (3D) display including a display module and a driving module is provided. The display module includes a display panel and a barrier unit. The display panel has odd-column pixels and even-column pixels. The barrier unit coordinates with a left-eye image and a right-eye image displayed by the display panel to switch vertically and alternatively arranged slits and barriers, so as to produce a stereoscopic image in a viewer's eyes through parallax. The driving module provides left-eye image data and right-eye image data to drive the display module. The driving module drives the odd-column and even-column pixels respectively according to different driving timings, so as to respectively and sequentially enables the odd-column and even-column pixels during a plurality of corresponding frame periods to receive the left-eye image data and the right-eye image data and allow the display panel to display the left-eye and right-eye images. | 02-13-2014 |
20140055333 | LIQUID CRYSTAL DISPLAY AND SHIFT REGISTER DEVICE THEREOF - A liquid crystal display (LCD) and a shift register device thereof are disclosed. The shift register device includes a plurality of serially connected shift registers for sequentially generating a plurality of scan signals. Each of the shift registers generates one of the scan signals according to a predetermined activating signal and a plurality of clock signals. The shift registers are categorized into a first group, a second group, and a third group. The first group of shift registers and the second group of shift registers have different circuit structures. The second group of shift registers and the third group of shift registers have different circuit structures. The first group of shift registers and the third group of shift registers have different circuit structures. | 02-27-2014 |
20140078270 | LOCAL STEREO IMAGE DISPLAY SYSTEM, LOCAL STEREO IMAGE DISPLAY METHOD AND ADJUSTING METHOD THEREOF - A local stereo image display system controls an image output in a display area which includes a planar image frame and a stereo image frame. The planar image frame has a planar image region. The stereo image frame is disposed between two adjacent planar image frames and has a stereo image region. The planar image frame and the stereo image frame are outputted orderly with a display frequency. When the planar image frame is outputted, only the planar image region has image content, and when the stereo image frame is outputted, only the stereo image region has image content. An optical grating control signal is outputted according to the sequence of the planar image frame and the stereo image frame and is synchronized to the display frequency. | 03-20-2014 |
20140198277 | LIQUID CRYSTAL DISPLAY - A liquid crystal display includes a bottom substrate, at least one thin film transistor, an overcoat layer, a bottom common electrode, at least one pixel electrode and a liquid crystal layer. The thin film transistor is disposed on the bottom substrate, including a gate electrode, a source electrode and a drain electrode. The overcoat layer is disposed above the thin film transistor. The bottom common electrode is disposed on the overcoat layer. The pixel electrode is disposed above the bottom common electrode and electrically connected to the drain electrode. The liquid crystal layer is disposed above the pixel electrode. | 07-17-2014 |
20140232964 | INTEGRATED GATE DRIVER CIRCUIT AND LIQUID CRYSTAL PANEL - An integrated gate driver circuit includes a control circuit, a plurality of drive stages and a plurality of discharge transistors. The control circuit is configured to output a plurality of clock signals within a frame period and to output a discharge enabling signal within a blanking period of the frame period. Each of the drive stages receives the clock signals and includes an output terminal configured to output a gate driving signal. Each of the discharge transistors is coupled to the output terminal of one of the drive stages and discharges the output terminal according to the discharge enabling signal thereby eliminating the voltage fluctuation of the output terminal in the blanking period. | 08-21-2014 |
20150042628 | Gate Driver - A gate driver is used to drive scan lines, a first scan line to a m | 02-12-2015 |
Patent application number | Description | Published |
20130039751 | CENTRIFUGAL FAN - A centrifugal fan is provided. The centrifugal fan includes a housing, a driving device, and blades. The housing includes a circular base and at least two struts. Each of the struts physically connects the circular base and the remainder of the housing, and each of the struts includes two peripheral edges. The driving device is placed on the circular base. Each of the blades has an arc shape and the blades are located in the housing. The driving device rotates the blades. The two peripheral edges of each of the struts form orthogonal curves with the blades. | 02-14-2013 |
20130039752 | CENTRIFUGAL FAN MODULE, HEAT DISSIPATION DEVICE HAVING THE SAME AND ELECTRIC DEVICE HAVING THE HEAT DISSIPATION DEVICE - A centrifugal fan module, a heat dissipation device having the same and an electric device having the heat dissipation device are provided, in which the heat dissipation device includes a fin module and a centrifugal fan module including a volute-shaped frame and a centrifugal fan pivoted in the volute-shaped frame. The volute-shaped frame includes an air inlet, a larger air outlet and a smaller air outlet. The air inlet and the smaller air outlet are both on the same surface of the volute-shaped frame. The larger air outlet is coupled to the fin module. The smaller air outlet is arranged correspondingly to a maximum wind-speed flowing path of the centrifugal fan. | 02-14-2013 |
20130195638 | CENTRIFUGAL FAN - A centrifugal fan includes a centrifugal impeller, a first housing, a second housing, an annular guide ring and a driving device. The centrifugal impeller has a hub and blades connected to and disposed around the hub. The first housing and the second housing cooperatively define a hollow chamber and an air outlet. An air inlet is formed in a central section of the second housing. A first arc structure is located on an inner surface around the air inlet of the second housing. Support brackets respectively extend from an end close to a tongue of the second housing and an end away from the tongue of the second housing. The support brackets are perpendicular to the second housing. The annular guide ring has a second arc structure close to an outermost margin of inner surfaces of the blades. The driving device is used for rotating the centrifugal impeller. | 08-01-2013 |
20130216369 | CENTRIFUGAL FAN - A centrifugal fan includes a housing, a driving device, and a fan impeller. The housing has a hollow chamber which has a central axis. The driving device is located at the central axis of the hollow chamber. The fan impeller is disposed in the hollow chamber and includes a hub, several blades, and several fins. The hub is connected with the driving device. The blades are disposed around the hub. Each blade has a windward surface and a leeward surface. Each fin extends from the windward surface of one of the blades, outward by an arc surface from the windward surface starting from a location near the central axis, and further extends to the leeward surface of an adjacent blade. | 08-22-2013 |
20130264033 | HEAT DISSIPATION MODULE - A heat dissipation module includes a centrifugal fan and a heat pipe. The centrifugal fan includes at least one axial air inlet and a radial air outlet, wherein an air channel sidewall of the centrifugal fan has heat dissipation fins in an inner wall thereof. The heat pipe has a heat source contact section and a heat dissipation section, the heat dissipation section is in contact with an outer wall of the air channel sidewall, and the heat source contact section is in contact with a heat source. | 10-10-2013 |
Patent application number | Description | Published |
20120225545 | Method of Fabricating Semiconductor Device - The present invention provides a method of fabricating a semiconductor device. A substrate is provided. A first region and a second region are defined on the substrate. A first interfacial layer, a sacrifice layer and a sacrifice gate layer are disposed on the first region. The sacrifice layer and the sacrifice gate layer are disposed on the second region of the substrate. Next, a first etching step is performed to remove the sacrifice gate layer in the first region and the second region. Then, a second etching step is performed to remove the sacrifice layer in the first region and the second region to expose the substrate of the second region. Lastly, a second interfacial layer is formed on the substrate of the second region. | 09-06-2012 |
20130193577 | STRUCTURE OF ELECTRICAL CONTACT AND FABRICATION METHOD THEREOF - A method of fabricating an electrical contact comprises the following steps. A substrate having at least a silicon region is provided. At least an insulation layer is formed on the substrate, wherein the insulation layer comprises at least a contact hole which exposes the silicon region. A metal layer is formed on sidewalls and bottom of the contact hole. An annealing process is performed to form a first metal silicide layer in the silicon region nearby the bottom of the contact hole. A conductive layer covering the metal layer and filling up the contact hole is then formed, wherein the first metal silicide layer is transformed into a second metal silicide layer when the conductive layer is formed. | 08-01-2013 |
20140017867 | SEMICONDUCTOR DEVICE HAVING METAL GATE AND MANUFACTURING METHOD THEREOF - A method of manufacturing a semiconductor device having metal gate includes providing a substrate having at least a dummy gate, a sacrificial layer covering sidewalls of the dummy gate and a dielectric layer exposing a top of the dummy gate formed thereon, forming a sacrificial layer covering sidewalls of the dummy gate on the substrate, forming a dielectric layer exposing a top of the dummy gate on the substrate, performing a first etching process to remove a portion of the sacrificial layer surrounding the top of the dummy gate to form at least a first recess, and performing a second etching process to remove the dummy gate to form a second recess. The first recess and the second recess construct a T-shaped gate trench. | 01-16-2014 |
20140131804 | SEMICONDUCTOR STRUCTURE - The present invention provides a semiconductor structure, comprising at least two gate electrodes disposed on a substrate, wherein each gate electrode is mushroom-shaped and respectively has a salicide region on a top of the gate electrode, wherein the width of the salicide region is larger than the width of the gate electrode. A recess is disposed between each gate electrode, wherein the recess has a recess extension disposed under the salicide region. A spacer fills the extension of the recess, wherein the profile of each gate electrode is a tapered surface, and a contact etching stop layer (CESL) covers the gate electrodes. | 05-15-2014 |
20150014808 | SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF - A fabrication method for a semiconductor structure at least includes the following steps. First, a pattern mask with a predetermined layout pattern is formed on a substrate. The layout pattern is then transferred to the underneath substrate so as to form at least a fin-shaped structure in the substrate. Subsequently, a shallow trench isolation structure is formed around the fin-shaped structure. Afterwards, a steam oxidation process is carried out to oxidize the fin-shaped structure protruding from the shallow trench isolation and to form an oxide layer on its surface. Finally, the oxide layer is removed completely. | 01-15-2015 |
20150064929 | METHOD OF GAP FILLING - A method of gap filling includes providing a substrate having a plurality of gaps formed therein. Then, an in-situ steam generation oxidation is performed to form an oxide liner on the substrate. The oxide liner is formed to cover surfaces of the gaps. Subsequently, a high aspect ratio process is performed to form an oxide protecting layer on the oxide liner. After forming the oxide protecting layer, a flowable chemical vapor deposition is performed to form an oxide filling on the oxide protecting layer. More important, the gaps are filled up with the oxide filling layer. | 03-05-2015 |
20150069196 | MOUNTING BRACKET FOR SLIDE ASSEMBLY - A mounting bracket for a slide assembly includes a side wall, an end wall, at least one installation member, a stop, and a resilient member. The end wall is substantially perpendicular to the side wall. The at least one installation member is connected to the end wall. The stop is pivotably connected to the side wall and includes a first portion and a middle portion which is connected to the first portion. The middle portion has a first end portion. The resilient member provides a force to the stop to position the first end portion of the stop to be located corresponding to the end wall. | 03-12-2015 |
20150140819 | SEMICONDUCTOR PROCESS - A semiconductor process includes the following steps. A substrate having trenches with different sizes is provided. A first oxide layer is formed to entirely cover the substrate. A prevention layer is formed on the first oxide layer. A first filling layer is formed on the prevention layer and fills the trenches until the first filling layer is higher than the substrate. A first polishing process is performed to polish the first filling layer until exposing the prevention layer. A second polishing process is performed to polish the first filling layer, the prevention layer and the first oxide layer until the substrate is exposed. | 05-21-2015 |
20150147874 | METHOD FOR FORMING A SEMICONDUCTOR STRUCTURE - The present invention provides a manufacturing method for forming a semiconductor structure, in which first, a substrate is provided, a hard mask is disposed on the substrate, the hard mask is then patterned to form a plurality of fin hard masks and a plurality of dummy fin hard masks, afterwards, a pattern transferring process is performed, to transfer the patterns of the fin hard masks and the fin hard masks into the substrate, so as to form a plurality of fin groups and a plurality of dummy fins. Each dummy fin is disposed on the end side of one fin group, and a fin cut process is performed, to remove each dummy fin. | 05-28-2015 |