Tsuduki, JP
Keiichi Tsuduki, Kyoto-Fu JP
Patent application number | Description | Published |
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20110279213 | LAMINATED INDUCTOR - This disclosure provides a laminated inductor capable of suppressing concentration of magnetic gap portions, preventing local magnetic saturation, and obtaining excellent DC superposition characteristics. In an embodiment of a laminated inductor, magnetic layers and coil conductors are alternately laminated. The laminated inductor includes plural first mixed layers and plural second mixed layers. Each first mixed layer includes a first nonmagnetic material portion between ones of the conductive patterns overlapping in a lamination direction and a second nonmagnetic material portion that is inside the coil conductor and connected to the first nonmagnetic material portion. Each second mixed layer includes a nonmagnetic material portion between ones of the conductive patterns overlapping in the lamination direction and a nonmagnetic material portion that is outside the coil conductor and is connected to the first nonmagnetic material portion. The plural first mixed layers and the plural second mixed layers are formed as different layers. | 11-17-2011 |
Koji Tsuduki, Kawasaki-Shi JP
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20090298237 | SEMICONDUCTOR MODULE - A semiconductor module includes a semiconductor chip sealed with an encapsulation resin prevented from overflowing from an inside of the outer edge by a wiring pattern extended portion extending from the wiring pattern along an outer edge of a solder resist pattern at an outside of the outer edge of the solder resist pattern. | 12-03-2009 |
20100155869 | METHOD OF MANUFACTURING SOLID-STATE IMAGE PICKUP DEVICE AND SOLID-STATE IMAGE PICKUP DEVICE - A method includes preparing a cover member; preparing an image pickup element including a substrate including a pixel region including a plurality of photo detectors on a principal surface, a first concavo-convex portion including a plurality of first convex portions configured to concentrate light on the plurality of photo detectors, the first convex portions each having a lens shape, and a second concavo-convex portion surrounding the first concavo-convex portion, the second concavo-convex portion including a plurality of second convex portions; and fixing the cover member to a region of the image pickup element using a fixing member, the region being between the first concavo-convex portion and the second concavo-convex portion. | 06-24-2010 |
20100309354 | SOLID-STATE IMAGE PICKUP DEVICE - A cover member fixed to a pickup element has a non-vertical surface and an upright surface and satisfies H | 12-09-2010 |
20120044415 | IMAGE PICKUP MODULE AND CAMERA - An image pickup module includes a cover member, an image pickup device chip including photodiodes, a fixing member which is arranged around the image pickup device chip and which connects the cover member and the image pickup device chip together, a rewiring substrate arranged on the side opposite to the cover member of the image pickup device chip, connection members for connecting the image pickup device chip with the rewiring substrate, and a space surrounded by the cover member, the image pickup device chip, and the fixing member. The image pickup device chip includes a semiconductor substrate. The semiconductor substrate includes through-hole electrodes penetrating the substrate. When an area corresponding to the fixing member in the orthogonal projection of the image pickup module with respect to the cover module is defined as a fixed area, the through-hole electrodes and the connection members are arranged in the fixed area. | 02-23-2012 |
20120212637 | SOLID-STATE IMAGING APPARATUS, METHOD OF MANUFACTURING SAME, AND CAMERA - A solid-state imaging apparatus, comprising: a semiconductor chip having a principal face including a pixel region; a protruding portion disposed on the principal face to surround the pixel region; a cover member disposed over the pixel region; and an adhesive material surrounding the pixel region and bonding the cover member and the protruding portion, is provided. The protruding portion has top and first side faces facing the space, a first edge line being formed by this two faces. The adhesive material bonds the top face of the protruding portion and the cover member. The adhesive material has a first face facing the interior space, and the first face extends from the first edge line toward the cover member. Perimeters of the interior space, in planes parallel to the principal face become shorter in a direction from the top face of the protruding portion toward the cover member. | 08-23-2012 |
20130083493 | ELECTRONIC COMPONENT, ELECTRONIC MODULE, AND METHOD FOR MANUFACTURING THE SAME - An electronic component includes a unit including an electronic device; and an opposite member opposing the electronic device, wherein the unit and the opposite member are bonded together with an adhering member disposed between the unit and the opposite member and having light-cured resin and inorganic particles dispersed in the light-cured resin; and wherein in a particle-diameter distribution of the inorganic particles by volume, a particle diameter having a cumulative value of distribution of 50% is 0.5 μm or more, and a particle diameter having a cumulative value of distribution of 90% is 5.0 μm or less. | 04-04-2013 |
20130286565 | ELECTRONIC COMPONENT, ELECTRONIC MODULE, THEIR MANUFACTURING METHODS, MOUNTING MEMBER, AND ELECTRONIC APPARATUS - A method of manufacturing an electronic component includes a first step of preparing a mounting member formed by bonding a peripheral region of a base body having an outer terminal connected with a wiring member, and a frame body, while heating the base body and the frame body; a second step of fixing the electronic device to the base body; and a third step of bonding the lid body and the frame body. A condition α | 10-31-2013 |
20130286566 | ELECTRONIC COMPONENT, MOUNTING MEMBER, ELECTRONIC APPARATUS, AND THEIR MANUFACTURING METHODS - A base body includes a fiducial stage part provided with an inner terminal group, and an upper stage part located at a side of an outer edge of a package with respect to the fiducial stage part and protruding with respect to the fiducial stage part through a step part. A frame body is bonded to the upper stage part, and an inner edge of the frame body is located at the side of the outer edge of the package with respect to the step part. | 10-31-2013 |
20130286592 | ELECTRONIC COMPONENT AND ELECTRONIC APPARATUS - A package includes a base body to which an electronic device is fixed, a lid body that faces the electronic device, and a frame body that encloses at least one of a space between the electronic device and the lid body, and the electronic device. The frame body has a first portion located at a side of an inner edge of the frame body with respect to an outer edge of the base body, and a second portion located at a side of an outer edge of the frame body with respect to the outer edge of the base body, in an X direction from the inner edge of the frame body toward the outer edge of the frame body. | 10-31-2013 |
20140240588 | ELECTRONIC COMPONENT AND ELECTRONIC APPARATUS - A ferromagnetic body is provided at a front-surface side of a reference plane and located outside a region that overlaps an electronic device in a direction perpendicular to the reference plane, and a conductor is provided at a back-surface side of the reference plane and that overlaps the electronic device in the direction perpendicular to the reference plane. | 08-28-2014 |
20150116946 | ELECTRONIC COMPONENT, ELECTRONIC APPARATUS, AND METHOD FOR MANUFACTURING THE ELECTRONIC COMPONENT - An electronic component includes an electronic device and a container containing the electronic device. The container includes a base having a first region to which the electronic device is secured and a second region around the first region, a cover facing the electronic device across a space, and a frame secured to the second region to surround the space. The frame includes a first member and a second member having a thermal conductivity lower than those of the first member and the base. The first member has first and second portions on inner and outer edge sides of the frame, respectively, on both sides of an outer edge of the base. The second member is located between the cover and the first member. A shortest distance between the first member and the base is smaller than that between the first member and the cover. | 04-30-2015 |
Masao Tsuduki, Kagamihara-Shi JP
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20130036792 | GAS SENSOR APPARATUS AND CONCENTRATION MEASUREMENT METHOD - A gas sensor apparatus ( | 02-14-2013 |
Seiji Tsuduki, Saitama-Ken JP
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20110182644 | IMAGE FORMING APPARATUS AND DISPLAY CONTROL METHOD - An image forming apparatus includes plural detection parts, a storage part and a display part. The detection parts are respectively installed at specific positions in the image forming apparatus, and respectively detect whether sheet clogging occurs. The storage part stores data of a transmitted image of the image forming apparatus. The display part acquires the data of the transmitted image of the image forming apparatus from the storage part, and displays the data of the transmitted image, and further displays position information indicating installation places of the respective detection parts on the transmitted image, and emphasizes and displays position information corresponding to the detection part which now detects the sheet clogging. | 07-28-2011 |
Seiji Tsuduki, Saitama JP
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20120236340 | IMAGE FORMING APPARATUS AND METHOD OF DISCHARGING SHEET IN THE SAME - Certain embodiments provide an image forming apparatus including: a main body configured to include a front surface and a rear surface; a printing section provided in the main body and configured to form an image on a sheet according to image data and print-output the sheet; an operation panel configured to include a panel surface for giving an operation input to the printing section; a moving mechanism configured to allow the operation panel to move with respect to the main body; and a rotating mechanism configured to rotate the operation panel about a vertical axis over an angle range including a first angle at which the panel surface faces the front direction and a second angle at which the panel surface faces the rear direction. | 09-20-2012 |
Shiro Tsuduki, Yao-Shi JP
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20080257704 | Compound operation input device - A compound operation input device includes: an first operating body that can be pressed in a direction substantially orthogonal to a circuit board; an second operating body of annular shape, disposed around the first operating body and substantially parallel to the circuit board, tilt operable, and rotatably operable; a first switch actuable in response to pressing movement of the first operating body; second switches independently actuable in response to tilt movement of the second operating body; an attachment having an outer portion, the second operating body being provided with the outer portion, and an inner portion facing the second face of the first operating body; and a rotation detector for detecting rotation of the second operating body. The rotation detector is attached to an inner portion of the attachment and disposed in a space between the circuit board and the first operating body and inside the second switches. | 10-23-2008 |
Shiro Tsuduki, Osaka JP
Patent application number | Description | Published |
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20100026532 | Rotary Input Device and Revolution Sensor Using the Same - Disclosed is a device for accurately detecting the direction and angle of rotation independently of ambient environments. The device is provided with an equally-spaced electrode holding plate | 02-04-2010 |
20100200384 | Rotary Switch - A rotary switch includes a body having a fixing surface, a thin-plate-like flexible substrate fixed onto the fixing surface and having a plurality of first electrodes arranged along a first circle on a first electrode placement surface, a thin-plate-like electrode plate having a plurality of second electrodes arranged along a second circle on a second electrode placement surface facing the first electrode placement surface, the electrode plate being rotatable along the second circle, a dial having an operating surface and rotatable along the second circle, and a resilient member interposed between an opposite operating surface of the dial and a resilient member surface. The electrode plate has a plurality of electrode plate protrusions in the circumferential direction on the resilient member surface. The dial has a plurality of dial protrusions in the circumferential direction on the opposite operating surface. | 08-12-2010 |
20130134030 | MOVABLE CONTACT AND CONTACT STRUCTURE INCLUDING THE SAME - The invention provides a movable contact movable on a fixed contact or a resistor. The movable contact includes first and second sliders. The first and second sliders are arranged in such a manner as to slide along different sliding tracks from each other on the fixed contact or the resistor in accordance with movement of the movable contact. | 05-30-2013 |
Tadashi Tsuduki, Kashiwa-Shi JP
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20100248113 | CARRIER COATED WITH RESIN FOR ELECTROPHOTOGRAPHIC DEVELOPER AND ELECTROPHOTOGRAPHIC DEVELOPER USING THE CARRIER COATED WITH RESIN - A carrier coated with a resin for an electrophotographic developer in which a carrier particle surface is coated with the resin and the coating resin contains a lithium salt, and an electrophotographic developer using the carrier coated with the resin. | 09-30-2010 |
Takao Tsuduki, Osaka JP
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20110168440 | BROADBAND ELECTROMAGNETIC WAVE-ABSORBER AND PROCESS FOR PRODUCING SAME - Disclosed is an electromagnetic wave absorbent which exhibits high electromagnetic wave absorption performance over a wide band. The electromagnetic wave absorbent contains a conductive fiber sheet which is obtained by coating a fiber sheet base with a conductive polymer and has a surface resistivity within a specific range. The conductive fiber sheet is formed by impregnating a fiber sheet base such as a nonwoven fabric with an aqueous oxidant solution that contains a dopant, and then bringing the resulting fiber sheet base into contact with a gaseous monomer for a conductive polymer, so that the monomer is oxidatively polymerized thereon. | 07-14-2011 |
Tatsuya Tsuduki, Anjo-Shi JP
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20090095449 | Cooling Device for Electrical Apparatus Mounted on Vehicle - An ECU executes a program including a step of operating a battery cooling fan motor if a battery temperature is higher than a cooling required temperature, a step of sensing a cooling airflow temperature, a step of sensing solar radiation intensity onto a rear package tray, and a step of operating a motor serving as an actuator which closes a rear sunshade identified as a solar radiation blocking tool if the cooling airflow temperature is greater than a temperature threshold value and the solar radiation intensity is greater than a solar radiation intensity threshold value. | 04-16-2009 |
Tetsuo Tsuduki, Kitakyushu-Shi JP
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20130284770 | SLIDING NOZZLE PLATE AND SLIDING NOZZLE DEVICE USING THE SAME - Disclosed is a sliding nozzle plate (composite sliding nozzle plate) ( | 10-31-2013 |
Tetsuo Tsuduki, Fukuoka JP
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20150196954 | METHOD FOR USING UPPER NOZZLE - With a view to adding, to an upper nozzle formed with a bore having a shape capable of creating a less energy loss or smooth (constant) molten steel flow to suppress the occurrence of adhesion of inclusions and metals in molten steel, a gas injection function to thereby further suppress the occurrence of the adhesion, the present invention provides a method of using an upper nozzle configured to have a cross-sectional shape of a wall surface defining the bore, taken along an axis of the bore, comprising a curve represented by the following formula: log(r (z))=(1/n)×log((H+L)/(H+z))+log(r (L)) (n=1.5 to 6), where: L is a length of the upper nozzle; H is a calculational hydrostatic head height; and r (z) is an inner radius of the bore at a position downwardly away from an upper edge of the bore by a distance z. The method comprises using the upper nozzle in such a manner as to satisfy the following relationship: R | 07-16-2015 |
Yoji Tsuduki, Obu-Shi JP
Patent application number | Description | Published |
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20080257419 | FLUID PRESSURE REGULATING DEVICE | 10-23-2008 |