Morimasa
Morimasa Ishida, Tokyo JP
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20140141190 | METHOD OF REPAIRING COMPOSITE MATERIAL AND COMPOSITE MATERIAL - A method of repairing a composite material is provided in which a frustum-shaped portion of a composite material is removed, and the composite material and a repair material are bonded with each other while evacuating. The repair method includes step S | 05-22-2014 |
Morimasa Ishida, Aichi JP
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20140295123 | METHOD FOR REPAIRING HONEYCOMB CORE SANDWICH STRUCTURAL BODY AND REPAIRED PRODUCT - A method for repairing a honeycomb core sandwich structural body according to the present invention is a method in which a damaged portion that is formed in a honeycomb core sandwich structural body where a honeycomb structured core is held between a first outer skin and a second outer skin and that reaches the core through the first outer skin is repaired, the method including: a repair material mounting step of mounting a repair material on the damaged portion, the repair material including a patch that covers an opening of the damaged portion, and one or a plurality of braces that support the patch; a patch bonding step of bonding the patch to the first outer skin; and a brace bonding step of bonding the brace to the second outer skin or the core. | 10-02-2014 |
20140295124 | REPAIR METHOD OF REPAIR TARGET PORTION, AND REPAIRED PRODUCT OBTAINED FROM REPAIRING - The present invention relates to a repair method using a pre-cured repairing patch, and a repaired product obtained from repairing using the repairing patch, and the present invention securely bonds a repairing patch, where an out-of-plane stiffness is required, to a repair target. In order to cover a repair target portion | 10-02-2014 |
Morimasa Kaminish, Miyagi JP
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20090296768 | VERTICAL CAVITY SURFACE EMITTING LASER (VCSEL), VCSEL ARRAY DEVICE, OPTICAL SCANNING APPARATUS, AND IMAGE FORMING APPARATUS - A vertical cavity surface emitting laser (VCSEL) includes a semiconductor substrate, a lower reflecting mirror formed on the semiconductor substrate, and a mesa structure. The mesa structure includes an active layer, a selective oxidization layer that includes a current confined structure, and an upper reflecting mirror. A lower electrode is connected to the semiconductor substrate, and an upper electrode is connected to the upper reflecting mirror. The VCSEL emits laser light perpendicularly to the plane of the semiconductor substrate when an electric current flows between the upper electrode and the lower electrode. The semiconductor substrate is inclined with respect to (100) plane. The active layer includes a quantum well layer having a compressive strain with respect to the substrate, and a spacer layer. The spacer layer has either a compressive strain or a tensile strain with respect to the semiconductor substrate. | 12-03-2009 |
Morimasa Miyashita, Kanagawa-Ken JP
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20140284864 | SHEET PROCESSING METHOD, SHEET PROCESSING APPARATUS, AND SHEET PROCESSING SYSTEM - According to one embodiment, a sheet processing method of a sheet processing apparatus having a plurality of processing modes includes taking in sheets one by one from a bundle of the sheets in which a batch card having identification information, and the sheets as mediums to be inspected are piled, conveying the sheet which has been taken in, discriminating a kind of the batch card, switching the processing mode of the sheet processing apparatus based on the kind of the batch card which has been discriminated, discriminating and counting the sheets subsequent to the batch card, storing a count result of the sheets in correlation with the identification information, and sorting the sheet into a stacker based on a discrimination result of the sheet. | 09-25-2014 |