Patent application number | Description | Published |
20090322115 | Slide/Swing-Up Type Automobile Seat - A slide/flip-up type automobile-seat is disclosed. The seat is provided with lock-release restricting mechanisms provided at lower rail members of a slide rail mechanism for keeping slide lock levers in unlockable states with respect to the lower rail members during flipping-up movement of an entire seat or in a state where the entire seat has been flipped up, and for keeping striker locks in states of being unallowable to be unlocked when the lock levers are in states of incompletely locked with respect to the lower rail members. Each of the lock-release mechanisms includes a restricting arm which includes an arm body, a rising-up piece rising up from one end portion of the arm body and having a height reaching a position under a rear end portion of corresponding one of the lock levers, and a retaining piece which is provided at a side edge of the arm body and to which a corresponding one of extension rods extending from the striker locks is connected. The restricting arm is pivotally supported to a corresponding lower rail member with the rising-up piece being inserted through an elongated hole formed in the lower rail member, in such a manner that the rising-up piece is moved between the position just under the rear end portion of the lock lever and a position just behind the rear end portion of the lock lever according to forward and rearward strokes of the extension rod when the striker lock is unlocked and locked. | 12-31-2009 |
20100007188 | Vehicle Seat - A vehicle seat is disclosed which comprises a seat cushion | 01-14-2010 |
20110248540 | FIXING DEVICE FOR HEADREST - A fixing device is provided for a headrest that fixes the headrest at a predetermined position in an unadjustable manner, even after a guide lock is attached or even after a seatback is formed. At least one groove portion is formed by cutting out in a headrest pillar, without inclination in the radial direction. The fixing device has a knob portion, a resin spring portion formed continuously to the knob portion, and an engagement plate arranged in the knob portion, the resin spring portion is formed to extend on one side of the knob portion therefrom, and is provided with a space portion for expanding to surround the headrest pillar. The engagement plate is installed in the knob portion, and is formed in such a manner that part of the engagement plate is exposed in the space portion. | 10-13-2011 |
Patent application number | Description | Published |
20090107625 | Anisotropic Conductive Film - An anisotropic conductive film is provided which can provide high bonding strength and good conduction reliability when anisotropic conductive bonding is made under the compression bonding conditions of a compression bonding temperature of at most 130° C. for a compression bonding time of at most 3 seconds. The anisotropic conductive film contains a polymerizable acrylic compound, a film-forming rein, conductive particles, and a polymerization initiator. The polymerization initiator contains two types of organic peroxides that do not produce oxygen gas resulting from the decomposition thereof and have different one-minute half-life temperatures. Of the two types of organic peroxides, one organic peroxide that has a higher one-minute half-life temperature produces benzoic acid or a derivative thereof when it decomposes. | 04-30-2009 |
20090280332 | Adhesive composition - An adhesive composition is provided which is capable of providing good adhesion strength to the polyimide surface of a flexible circuit board that is exposed on the metal wiring surface and between the traces even when the polyimide surface is relatively smooth. The adhesive composition contains a thermoplastic resin, a polyfunctional acrylate, and a radical polymerization initiator and further contains a monofunctional urethane acrylate having a urethane residue at its terminal end. The monofunctional urethane acrylate is represented by the formula (1): | 11-12-2009 |
20110110066 | ANISOTROPIC CONDUCTIVE FILM - A high adhesive strength and good conduction reliability can be realized when anisotropic connection is performed under compression conditions of a compression temperature of 130° C. and a compression time of 3 seconds using an anisotropic conductive film which uses a polymerizable acrylic compound capable of being cured at a comparatively lower temperature and in a comparatively shorter time than a thermosetting epoxy resin along with a film-forming resin. Consequently, an anisotropic conductive film has a structure in which an insulating adhesive layer and an anisotropic conductive adhesive layer are laminated. The insulating adhesive layer and the anisotropic conductive adhesive layer each contain a polymerizable acrylic compound, a film-forming resin, and a polymerization initiator. The polymerization initiator contains two kinds of organic peroxide having different one minute half-life temperatures. Of the two kinds of organic peroxide, the organic peroxide having the higher one minute half-life temperature produces benzoic acid or a derivative thereof by decomposition. | 05-12-2011 |
20110281119 | Adhesive composition - A connection structure comprising an adhesive composition is provided. The adhesive composition is capable of providing good adhesion strength to the polyimide surface of a flexible circuit board that is exposed on the metal wiring surface and between the traces even when the polyimide surface is relatively smooth. The adhesive composition contains a thermoplastic resin, a polyfunctional acrylate, and a radical polymerization initiator and further contains a monofunctional urethane acrylate having a urethane residue at its terminal end. The monofunctional urethane acrylate is represented by the formula (1): | 11-17-2011 |
20120292082 | ANISOTROPIC CONDUCTIVE FILM - In an anisotropic conductive film formed by laminating an insulating adhesive layer containing a polymerizable acrylic compound, a film-forming resin, and a polymerization initiator and a conductive particle-containing layer containing a polymerizable acrylic compound, a film-forming resin, a polymerization initiator, and conductive particles, the insulating adhesive layer and the conductive particle-containing layer each contain a thiol compound in order not to decrease the adhesion strength to an adherend and to improve connection reliability. Examples of the thiol compound may include pentaerythritol tetrakis(3-mercaptopropionate), tris-[(3-mercaptopropionyloxy)-ethyl]-isocyanurate, trimethylolpropane tris(3-mercaptopropionate), and dipentaerythritol hexakis(3-mercaptopropionate). | 11-22-2012 |