Kohmura, JP
Akiko Kohmura, Tokyo JP
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20110279304 | MILLIMETER WAVE RADAR-EQUIPPED HEADLAMP - A millimeter wave radar-equipped headlamp includes a millimeter wave radar that detects an object ahead of a vehicle, and a lighting device unit that irradiates an area ahead of the vehicle. The lighting device unit incorporates an antenna module of the millimeter wave radar. The lighting device unit includes a projection lens, a light source, a reflector, and a shade. The antenna module includes a millimeter wave waveguide, and a millimeter wave reflection mirror. A reflection surface of the millimeter wave reflection mirror is formed by a spheroidal surface having a first focal point located in the vicinity of the opening of the millimeter wave waveguide, and a second focal point located forward of the rear focal point. | 11-17-2011 |
Atsuo Kohmura, Yamaguchi JP
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20110016999 | CYLINDER DEVICE - A cylinder device is capable of heightening the feed accuracy of a screw shaft and stably controlling the feed speed of a conveying unit in a wide speed range. A ball screw shaft is inserted through a hollow shaft motor having an end fixed to a housing, and a decelerator that is a planetary reduction gear unit connected to the hollow shaft motor. Each of a pair of ball screw nuts, which are disposed to face each other and between which the hollow shaft motor and the decelerator are placed, meshes with the ball screw shaft. An internal gear is connected to a spacer disposed at an end of an output gear of the decelerator. An external gear connected to the ball screw nut meshes with the internal gear. The output gear of the decelerator meshes with a connection shaft by splines. | 01-27-2011 |
Hiroki Kohmura, Kanagawa JP
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20100079785 | PRINTING SERVICE PROVIDING METHOD AND PRINTING SERVICE PROVIDING SYSTEM - A client terminal transmits a call request for using a MFP to a call control server. The call control server carries out authentication processing about a user and the MFP in response to the call request. If the authentication processing result is correct, the call control server transfers the call request to the printing service management server. The call request is transferred from the printing service management server to a printing service providing server and then transferred to the MFP via the call control server. Thus, a session of the client terminal and the MFP is established. The printing service providing server carries out processing for providing a predetermined printing service based on the call request from the client terminal. | 04-01-2010 |
Kazuo Kohmura, Iwakuni-Shi, Yamaguchi JP
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20160049343 | METHOD FOR MANUFACTURING COMPOSITE BODY AND COMPOSITION - Provided is a method for manufacturing a composite body, the method containing: a composition preparation process of preparing a composition that contains a polymer having a cationic functional group and having a weight average molecular weight of from 2,000 to 1,000,000, and that has a pH of from 2.0 to 11.0; a composite member preparation process of preparing a composite member that includes a member A and a member B, a surface of the member B having a defined isoelectric point, and that satisfies a relationship: the isoelectric point of a surface of the member B< the pH of the composition02-18-2016 | |
Kazuo Kohmura, Chiba JP
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20090053503 | Precursor composition for porous film and method for preparing the composition, porous film and method for preparing the porous film, and semiconductor device - A precursor composition for porous film comprising at least one member selected from the group consisting of compounds represented by the following general formulas: Si(OR | 02-26-2009 |
20090186210 | PRECURSOR COMPOSITION FOR POROUS THIN FILM, METHOD FOR PREPARATION OF THE PRECURSOR COMPOSITION, POROUS THIN FILM, METHOD FOR PREPARATION OF THE POROUS THIN FILM, AND SEMICONDUCTOR DEVICE - Disclosed is a precursor composition comprising: a compound selected from a compound represented by the formula: Si(OR | 07-23-2009 |
20110018108 | COMPOSITION AND METHOD FOR PRODUCTON THEREOF, POROUS MATERIAL AND METHOD FOR PRODUCTION THEREOF, INTERLAYER INSULATING FILM, SEMICONDUCTOR MATERIAL, SEMICONDUCTOR DEVICE, AND LOW-REFRACTIVE-INDEX SURFACE PROTECTION FILM - Disclosed is a composition comprising a hydrolysate of an alkoxysilane compound, a hydrolysate of a siloxane compound represented by Formula (1), a surfactant, and an element having an electronegativity of 2.5 or less. In Formula (1), R | 01-27-2011 |
20110241210 | COMPOSITION FOR SEALING SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE - The invention provides a composition for sealing a semiconductor, the composition being able to form a thin resin layer, suppress the diffusion of a metal component to a porous interlayer dielectric layer, and exhibit superior adherence with respect to an interconnection material. The composition for sealing a semiconductor contains a resin having two or more cationic functional groups and a weight-average molecular weight of from 2,000 to 100,000; contains sodium and potassium each in an amount based on element content of not more than 10 ppb by weight; and has a volume average particle diameter, measured by a dynamic light scattering method, of not more than 10 nm. | 10-06-2011 |
Kazuo Kohmura, Minato-Ku JP
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20100200990 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE PRODUCED THEREWITH - A semiconductor device (having an interlayer insulating film) which is sufficiently low in the dielectric constant and high in the mechanical strength is provided. | 08-12-2010 |
Kazuo Kohmura, Chiba-Ken JP
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20090206453 | Method for Preparing Modified Porous Silica Films, Modified Porous Silica Films Prepared According to This Method and Semiconductor Devices Fabricated Using the Modified Porous Silica Films - A hydrophobic compound having at least one each of hydrophobic group (an alkyl group having 1 to 6 carbon atoms or a —C | 08-20-2009 |
Kazuo Kohmura, Iwakuni-Shi JP
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20130171826 | SEMICONDUCTOR DEVICE PRODUCTION METHOD AND RINSE - The present invention provides a semiconductor device production method and a rinse used in the production method. The method includes: a sealing composition application process in which a semiconductor sealing layer is formed by applying, to at least a portion of a surface of a semiconductor substrate, a semiconductor sealing composition that includes a resin having a cationic functional group and a weight average molecular weight of from 2,000 to 600,000, wherein a content of sodium and a content of potassium are 10 mass ppb or less on an elemental basis, respectively; and, subsequently, a rinsing process in which the surface of the semiconductor substrate on which the semiconductor sealing layer has been formed is rinsed with a rinse having a pH at 25° C. of 6 or lower. | 07-04-2013 |
20140367868 | SEALING COMPOSITION FOR SEMICONDUCTOR, SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THE SAME, AND POLYMER AND METHOD OF PRODUCING THE SAME - In the invention, a sealing composition for a semiconductor is provided which includes a polymer that includes two or more cationic functional groups including at least one of a tertiary nitrogen atom or a quaternary nitrogen atom, that has a weight average molecular weight of from 2,000 to 1,000,000, and that has a branching degree of 48% or more, wherein a content of sodium and a content of potassium in the sealing composition are each 10 ppb by weight or less on an element basis. | 12-18-2014 |
20150187670 | SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, AND RINSING LIQUID - A method for manufacturing a semiconductor device including: a process of applying a sealing composition for a semiconductor to a semiconductor substrate, to form a sealing layer for a semiconductor on at least the bottom face and the side face of a recess portion of an interlayer insulating layer, the sealing composition including a polymer having a cationic functional group and a weight average molecular weight of from 2,000 to 1,000,000, each of the content of sodium and the content of potassium in the sealing composition being 10 ppb by mass or less on an elemental basis; and a process of subjecting a surface of the semiconductor substrate at a side at which the sealing layer has been formed to heat treatment of from 200° C. to 425° C., to remove at least a part of the sealing layer. | 07-02-2015 |
Naohiro Kohmura, Ibaraki JP
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20090203691 | Novel 1H-indazole compounds - The present invention provides a novel 1H-indazole compound having an excellent JNK inhibitory action. More specifically, it provides a compound represented by the following formula, a salt thereof or a hydrate of them. | 08-13-2009 |
Naoya Kohmura, Kawasaki JP
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20140247735 | NETWORK MONITORING SYSTEM - A monitoring apparatus includes a processor configured to capture a network transmission signal from a monitoring location in a monitoring target network; specify each of a plurality of sessions based on session specifying information contained in the captured network transmission signal; analyze, for specified each of the sessions, the network transmission signal and measure a quality index; transfer the quality index of each of the sessions, which is measured every predetermined period of time, as a quality measurement result to an aggregation apparatus until a predetermined threshold value of a processing capability is reached; and stop, when the predetermined threshold value of the processing capability is exceeded, measuring the quality index of one of the sessions in a high-load state, and in a next cycle, perform the measurement on one of the sessions in the high-load state. | 09-04-2014 |
Takayoshi Kohmura, Tokyo JP
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20120025089 | X-RAY IMAGING DEVICE - An X-ray imaging device | 02-02-2012 |
Toshimi Kohmura, Tsuchiura-Shi JP
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20090294992 | EMBEDDING DEVICE IN SUBSTRATE CAVITY - An embodiment of the present invention is a technique to reduce interconnect length between devices. A cavity is formed in a substrate having a substrate surface. The cavity has a depth. A first device having a device surface and a thickness is placed into the cavity. The thickness matches the depth such that the device surface is approximately planar with the substrate surface. The first device is attached to a second device via bumps on the second device. | 12-03-2009 |
Yoshihiko Kohmura, Nagoya-Shi JP
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20100018892 | CIRCUIT BOARD CASE - A circuit board case including: a cover that includes a cover front wall and a rise wall connected to the cover front wall, the cover being attachable to an attaching object at a position on the rise wall opposite the cover front wall; and a case that houses a circuit board and includes a case front wall and a first wall surface oriented toward a direction opposite the case front wall, the case being housed in the cover such that the case front wall opposes the cover front wall. A fitting that engages the first wall surface is formed in the rise wall of the cover so as to urge the case toward the cover front wall and thus hold the case within the cover. | 01-28-2010 |
20140255668 | RESIN JOINED BODY AND METHOD FOR MANUFACTURING SAME - A method for producing a resin joined body in which a specific region L1 of a welding portion of a second resin member ( | 09-11-2014 |
Yoshinori Kohmura, Ibaraki JP
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20090187028 | Process for preparing Chiral Dipeptidyl Peptidase -IV Inhibitor Intermediates - A novel process is provided for the preparation of chiral trans-2,3-disubstituted 5-oxotetrahydropyrans of structural formula (I): | 07-23-2009 |
20090247770 | PROCESS FOR MAKING LACTAM TACHYKININ RECEPTOR ANTAGONISTS - The present invention is directed to a process for preparing α,α disubstituted γ-lactam derivatives of formula (I) that are useful as neurokinin-1 (NK-1) receptor antagonists, and inhibitors of tachykinin and in particular substance P. The compounds are useful in the treatment of certain disorders, including emesis, urinary incontinence, depression, and anxiety. | 10-01-2009 |