Patent application number | Description | Published |
20090111834 | NOVEL FLAVORS, FLAVOR MODIFIERS, TASTANTS, TASTE ENHANCERS, UMAMI OR SWEET TASTANTS, AND/OR ENHANCERS AND USE THEREOF - The present invention relates to the discovery that certain non-naturally occurring, non-peptide amide compounds and amide derivatives, such as oxalamides, ureas, and acrylamides, are useful flavor or taste modifiers, such as a flavoring or flavoring agents and flavor or taste enhancer, more particularly, savory (the “umami” taste of monosodium glutamate) or sweet taste modifiers, —savory or sweet flavoring agents and savory or sweet flavor enhancers, for food, beverages, and other comestible or orally administered medicinal products or compositions. | 04-30-2009 |
20120201763 | NOVEL FLAVORS, FLAVOR MODIFIERS, TASTANTS, TASTE ENHANCERS, UMAMI OR SWEET TASTANTS, AND/OR ENHANCERS AND USE THEREOF - The present invention relates to the discovery that certain non-naturally occurring, non-peptide amide compounds and amide derivatives, such as oxalamides, ureas, and acrylamides, are useful flavor or taste modifiers, such as a flavoring or flavoring agents and flavor or taste enhancer, more particularly, savory (the “umami” taste of monosodium glutamate) or sweet taste modifiers, —savory or sweet flavoring agents and savory or sweet flavor enhancers, for food, beverages, and other comestible or orally administered medicinal products or compositions. | 08-09-2012 |
20150093339 | NOVEL FLAVORS, FLAVOR MODIFIERS, TASTANTS, TASTE ENHANCERS, UMAMI OR SWEET TASTANTS, AND/OR ENHANCERS AND USE THEREOF - The present invention relates to the discovery that certain non-naturally occurring, non-peptide amide compounds and amide derivatives, such as oxalamides, ureas, and acrylamides, are useful flavor or taste modifiers, such as a flavoring or flavoring agents and flavor or taste enhancer, more particularly, savory (the “umami” taste of monosodium glutamate) or sweet taste modifiers,—savory or sweet flavoring agents and savory or sweet flavor enhancers, for food, beverages, and other comestible or orally administered medicinal products or compositions. | 04-02-2015 |
Patent application number | Description | Published |
20130226797 | Transaction Signature for Offline Payment Processing System - Preventing fraud during an offline transaction by encoding a randomly-generated card verification code onto a smart card. The verification code is transmitted to a contactless device during each transaction, wherein it is cross-referenced with the account number to ensure presence of the card. Also, every transaction record is signed by an access key resident on the contactless device and certified by a signing key resident on a remote system. Funds may be deposited onto the card when the contactless device creates a deposit request, signs the request using an access key and transmits it to the remote system, which in turn processes the request and certifies it with a signing key. Funds may be withdrawn when the contactless device creates a withdrawal record and signs it using an access key. The remote system verifies the signatures and certifies the records using a signing key when the records are later transmitted. | 08-29-2013 |
20140258109 | PENDING DEPOSIT FOR PAYMENT PROCESSING SYSTEM - Depositing funds onto smart cards for use during processing of purchases. A device creates a deposit request and transmits the request to a remote system. The remote system processes the request and transmits a deposit record to the device, which in turn transmits the record to the smart card. If the device has network access, it transmits a deposit confirmation to the remote system, which updates the smart card account to include the confirmation. If the device unable to connect to the remote system, the deposit confirmation is transmitted when the smart card is involved in a future transaction. During the future transaction, the smart card transmits its transaction history, which comprises the deposit confirmation, to the device, and the device transmits the transaction history to the remote system. The remote system updates the smart card account to include the deposit confirmation. | 09-11-2014 |
20150220728 | Multiline One Time Password - A credential such as a One Time Password (OTP) can be proffered as a matrix of characters provided by a user. The verifier can accept that credential if it determines that the matrix is rank one. If it determines the matrix is not rank one, it can reject it or treat it as possibly corrupt due to one or more erroneous or missing entries. The verifier can factor the received matrix into two vectors and create a rank one projected matrix that is the product of the two vectors. The verifier can measure the distance between the received and projected matrices and accept the credential if the distance is within a distance threshold. | 08-06-2015 |
20150370859 | CONTEXTUAL SEARCH ON MULTIMEDIA CONTENT - Techniques for contextual search on multimedia content are provided. An example method includes extracting entities associated with multimedia content, wherein the entities include values characterizing one or more objects represented in the multimedia content, generating one or more query rewrite candidates based on the extracted entities and one or more terms in a query related to the multimedia content, providing the one or more query rewrite candidates to a search engine, scoring the one or more query rewrite candidates, ranking the scored one or more query rewrite candidates based on their respective scores, rewriting the query related to the multimedia content based on a particular ranked query rewrite candidate and providing for display, responsive to the query related to the multimedia content, a result set from the search engine based on the rewritten query. | 12-24-2015 |
Patent application number | Description | Published |
20100227305 | KNOWLEDGE ASSESSMENT TOOL - The present description refers in particular to a computer-implemented method, a computer program product, and a computer system for processing and managing test data. The computer-implemented method for processing and managing test data may comprise: | 09-09-2010 |
20110016086 | DATA PROCESSING METHOD, SYSTEM, AND COMPUTER PROGRAM PRODUCT - The present description refers in particular to a data processing method, a computer program product, and a data processing system for obtaining and storing data in an outsourcing environment, the method including providing a user interface on a user computer; determining an indicator which indicates whether there is synchronization data in a user database, wherein the synchronization data is for synchronization with a remote database which is located on a remote computer; obtaining user data with the user interface; and storing the user data in the user database if the indicator indicates that there is synchronization data in the user database. | 01-20-2011 |
20140310242 | DATA PROCESSING METHOD, SYSTEM, AND COMPUTER PROGRAM PRODUCT - The present description refers in particular to a data processing method, a computer program product, and a data processing system for obtaining and storing data in an outsourcing environment, the method including providing a user interface on a user computer; determining an indicator which indicates whether there is synchronization data in a user database, wherein the synchronization data is for synchronization with a remote database which is located on a remote computer; obtaining user data with the user interface; and storing the user data in the user database if the indicator indicates that there is synchronization data in the user database. | 10-16-2014 |
Patent application number | Description | Published |
20090294954 | 3-D ICs WITH MICROFLUIDIC INTERCONNECTS AND METHODS OF CONSTRUCTING SAME - Three dimensional integrated circuits with microfluidic interconnects and methods of constructing same are provided. According to some embodiments, and microfluidic integrated circuit system can comprise a plurality of semiconductor die wafers each having a top and bottom exterior surface. The semiconductor die wafers can form a stack of die wafers. The die wafers can comprise one or more channels formed through the die wafers. The channels can extend generally between top and bottom exterior surfaces of the semiconductor die wafers. A plurality of micro-pipes can be disposed between adjacent semiconductor die wafers in the stack. The micro-pipes can enable the channels to be in fluid communication with each other. A barrier layer can be disposed within at least one of the channels and the micro-pipes. The barrier layer can be adapted to prevent a coolant flowing through the at least one of the channels and the micro-pipes from leeching into the channels and micro-pipes. Other embodiments are also claimed and described. | 12-03-2009 |
20100187683 | 3-D ICs EQUIPPED WITH DOUBLE SIDED POWER, COOLANT, AND DATA FEATURES - Three dimensional integrated circuits with double sided power, coolant, and data features and methods of constructing same are provided. According to some embodiments, an integrated circuit package can generally comprise one or more semiconductor wafers and opposing end substrates. The semiconductor wafers can each have a top exterior surface and a bottom exterior surface. The plurality of semiconductor wafers can form a multi-dimensional wafer stack of die wafers such that adjacent wafers have facing surfaces. Each of the semiconductor wafers can comprise one or more channels formed through the wafers. A portion of the channels can extend generally between the top and bottom exterior surfaces of the semiconductor wafers. A portion of the channels can carry conductors for coupling the wafers and/or coolant for cooling the wafers. The opposing end substrates can be disposed proximate opposing ends of the multi-dimensional stack. The opposing end substrates can be configured to supply power, coolant, and data signals to opposing ends of the multi-dimensional wafer stack. Other embodiments are also claimed and described. | 07-29-2010 |
20120228779 | AIR-GAP C4 FLUIDIC I/O INTERCONNECTS AND METHODS OF FABRICATING SAME - An exemplary embodiment of the present invention provides a chip for use in fabricating a three-dimensional integrated circuit, the chip comprising a wafer, one or more metallic-filled, electrical vias, and one or more hollow, fluidic vias. The wafer can comprise a first surface and a second surface. The one or more metallic-filled, electrical vias can extend through the wafer. Each electrical via can be in electrical communication with an electrical interconnect proximate the first surface, providing electrical communication between chips in the integrated circuit. The one or more hollow, fluidic vias can extend through the wafer. Each fluidic via can be in fluid communication with a fluidic interconnect, providing fluid communication between adjacent chips in the integrated circuit. Each fluidic interconnect can comprise a first end proximate the first surface, a second end, and a cap proximate the second end, defining an air-filled space within the fluidic interconnect. | 09-13-2012 |