Patent application number | Description | Published |
20090291314 | ELECTRONIC COMPONENTS MOUNTING ADHESIVE AND ELECTRONIC COMPONENTS MOUNTING STRUCTURE - The invention intends to provide an electronic component mounting adhesive that can inhibit cracks and peelings in an electronic component mounting structure obtained by joining electronic components each other from occurring and an electronic component mounting structure obtained by joining electronic components with such an electronic component mounting adhesive. In an electronic component mounting structure, a first circuit board and a second circuit board are bonded with an electronic component mounting adhesive. Here, the electronic component mounting adhesive is obtained by dispersing metal particles having the melting temperature Mp lower than the glass transition temperature Tg of a cured material of a thermosetting resin in the thermosetting resin. | 11-26-2009 |
20120012645 | ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD - Disclosed are an electronic component mounting system and an electronic component mounting method capable of reducing the space occupied by equipment and equipment cost and ensuring high connection reliability. An electronic component mounting system ( | 01-19-2012 |
20120014084 | ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD - Disclosed are an electronic component mounting system and an electronic component mounting method capable of ensuring high connection reliability. An electronic component mounting system ( | 01-19-2012 |
20120234496 | SUBSTRATE RECEIVING DEVICE AND SUBSTRATE THERMOCOMPRESSION-BONDING DEVICE - A substrate backing device | 09-20-2012 |
20140318837 | CIRCUIT BOARD INTERCONNECTION STRUCTURE AND CIRCUIT BOARD INTERCONNECTION METHOD - Provided is a circuit board interconnection structure including: a first circuit board including a first substrate and a first electrode formed on a surface of the first substrate; a second circuit board including a second substrate and a second electrode formed on a surface of the second substrate; one or more joining portions formed of a metal-containing conductive material for joining the first and second electrodes, interposed between the first and second electrodes; and a reinforcing resin portion for reinforcing the one or more joining portions. The first electrode is a transparent electrode including a metal oxide film. A first abutting portion of the joining portion abutting the first electrode, is formed by adhesional wetting of the first electrode with the conductive material. | 10-30-2014 |
20150047185 | ELECTRODE JOINING METHOD, PRODUCTION METHOD OF ELECTRODE JOINED STRUCTURE, AND PRODUCTION SYSTEM OF ELECTRODE JOINED STRUCTURE - Disclosed is a system for mounting a flexible first substrate having a first connection region provided with a first electrode group, on a second substrate having a second connection region provided with a second electrode group. The system includes: a stage configured to support the second substrate; a unit for supplying a bonding material including conductive particles and a thermosetting resin, to at least one of the first and second electrode groups; a unit for placing the first substrate on the second substrate via the bonding material and a unit for successively performing a joining process by pressing a first electrode toward a second electrode and curing the thermosetting resin, using a heating tool, while moving the tool to a processing position of another first electrode not yet subjected to the joining process. | 02-19-2015 |