Rhyner
Claudio Rhyner, Davos CH
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20160077089 | Platelet Allo-Antigen Typing And Platelet Antibody Tests - The present invention relates to methods for the detection of human platelet alloantigens (HPAs) on human platelets, methods for the detection of human antibodies against HPAs, and diagnostic test devices for carrying our said methods. | 03-17-2016 |
Daniel J. Rhyner, Lewistown, MT US
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20080233859 | Cold storage doorway with airflow control system and method - A conditioned vestibule, control system, and method are disclosed for use with a cold storage doorway that separates warm and cold sides. A heater warms an air stream discharged across the doorway by the vestibule. A control unit operates the heater to maintain an air stream temperature. The control unit continuously monitors the air stream temperature and operates the heater to maintain the air stream temperature in a non-saturated state based on a humidity ratio. One embodiment calculates first and second temperatures based, respectively, warm and cold side tangent lines to a psychrometric saturation curve and based on the humidity ratio. The tangent lines are based on humidity and temperature sensed on the warm and cold sides. The air stream is warmed to at least the greater of the first and second temperatures. One embodiment controls air flow to adjust the humidity ratio to more efficiently operate the vestibule. | 09-25-2008 |
Kenneth Rhyner, Rockwall, TX US
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20090140419 | EXTENDED PLATING TRACE IN FLIP CHIP SOLDER MASK WINDOW - A flip chip in accordance with an exemplary embodiment of the present invention has a ball grid array and a die disposed on the ball grid array, wherein the ball grid array includes conducting pads disposed under the die. Traces connecting conducting pads under the die are accessible to leads on the die by way of a solder mask window. These traces continue through the solder mask window and extend out to the border of the ball grid array and are used for both signaling purposes and electroplating purposes. | 06-04-2009 |
Kenneth R. Rhyner, Rockwall, TX US
Patent application number | Description | Published |
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20090115072 | BGA Package with Traces for Plating Pads Under the Chip - A semiconductor flip-chip ball grid array package ( | 05-07-2009 |
20090289362 | Low Inductance Ball Grid Array Device Having Chip Bumps on Substrate Vias - A high-frequency BGA device ( | 11-26-2009 |
20100006987 | INTEGRATED CIRCUIT PACKAGE WITH EMI SHIELD - An integrated circuit (IC) device ( | 01-14-2010 |
20120013003 | BGA PACKAGE WITH TRACES FOR PLATING PADS UNDER THE CHIP - A semiconductor flip-chip ball grid array package with one-metal-layered substrate. The sites of a two-dimensional array become usable for attaching solder balls of the signal (non-common net assignment) I/O type to the substrate under the chip area, when the sites can be routed for metal plating. The space to place a maximum number of signal routing traces is opened up by interrupting the periodicity of the site array from the edge of the substrate towards the center under the chip. The periodicity is preferably interrupted by depopulating entire aligned lines and rows of the two-dimensional array. | 01-19-2012 |
20130175684 | Integrated Circuit Packaging With Ball Grid Array Having Differential Pitch To Enhance Thermal Performance - A ball grid array (BGA) includes a plurality of metal balls adapted for connection between an electrical circuit and a substrate. A first portion of the BGA contains a first group of the metal balls arranged according to a first pitch. A second portion of the BGA contains a second group of metal the balls arranged according to a second pitch that is less than the first pitch, to provide increased metal contact area and correspondingly enhanced thermal transfer capability. | 07-11-2013 |
Kenneth Robert Rhyner, Rockwall, TX US
Patent application number | Description | Published |
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20130026642 | INTEGRATED CIRCUIT PACKAGE INCLUDING A DIRECT CONNECT PAD, A BLIND VIA, AND A BOND PAD ELECTRICALLY COUPLED TO THE DIRECT CONNECT PAD - An integrated circuit package including a semiconductor die and a flexible circuit (flex circuit), and a method for forming the integrated circuit package. The flex circuit can include a direct connect pad which is not electrically coupled to an active trace, a blind via electrically coupled to the direct connect pad, and a semiconductor die having a bond pad which is electrically coupled to the direct connect pad using a conductor. The bond pad, the conductor, the direct connect pad, and the blind via can all be vertically aligned, each with the other. | 01-31-2013 |
20130295722 | Method of Forming an Integrated Circuit Package Including a Direct Connect Pad, A Blind Via, and a Bond Pad Electrically Coupled to the Direct Connect Pad - A method for forming an integrated circuit package is disclosed. A flex circuit is form by forming a direct connect pad on a first side of a dielectric layer. After forming the direct connect pad, an opening from a second side of the dielectric layer is formed to expose the direct connect pad. A blind via is formed within the opening in the dielectric layer. A first conductor is formed within the opening. A bond pad of a semiconductor die is electrically coupled with the direct connect pad using a second conductor, wherein the bond pad and the second conductor directly overlie the direct connect pad. | 11-07-2013 |
20150364816 | MILLIMETER WAVE INTEGRATED CIRCUIT WITH BALL GRID ARRAY PACKAGE INCLUDING TRANSMIT AND RECEIVE CHANNELS - A millimeter wave integrated circuit (IC) chip. The IC chip comprises an IC die and a wire bond ball grid array package encapsulating the IC die. The wire bond ball grid array package comprises a solder ball array, a millimeter wave transmit channel, and a millimeter wave receive channel, wherein each millimeter wave transmit and receive channel electrically couples the IC die to a signal ball of the solder ball array and is configured to resonate at an operating frequency band of the millimeter wave IC chip. | 12-17-2015 |
Stefan Rhyner, Buchs CH
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20130340940 | RF FEED LINE - This disclosure relates to a flexible triplate stripline that can operate in temperatures of 150 C-250 C, flexible to move up/down with the top of a plasma reactor, and prevent plasma generation near the power transmission line in the stripline. The transmission line may be exposed to ambient conditions. The risk of generating plasma near the transmission line may be minimized by optimizing the height and width of the air gap adjacent to the transmission line and decreasing the voltage in a portion of the stripline by widening the transmission line. | 12-26-2013 |
Steven J. Rhyner, Maplewood, MN US
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20140265295 | FLEXIBLE HINGE MATERIAL COMPRISING CROSS-LINKED POLYURETHANE MATERIAL - An article may include a biodata page defining a perimeter including an edge and a hinge layer attached to at least a portion of the biodata page. The hinge layer comprises a cross-linked polyurethane. In some examples, the hinge layer may include a cross-linked thermoset polyurethane. | 09-18-2014 |
Urs Rhyner, Schindellegi CH
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20100007248 | ELECTROCHEMICAL METHODS, DEVICES, AND STRUCTURES - The present invention provides devices and structures and methods of use thereof in electrochemical actuation. This invention provides electrochemical actuators, which are based, inter-alia, on an electric field-driven intercalation or alloying of high-modulus inorganic compounds, which can produce large and reversible volume changes, providing high actuation energy density, high actuation authority and large free strain. | 01-14-2010 |
20120025671 | ELECTROCHEMICAL METHODS, DEVICES, AND STRUCTURES - The present invention provides devices and structures and methods of use thereof in electrochemical actuation. This invention provides electrochemical actuators, which are based, inter-alia, on an electric field-driven intercalation or alloying of high-modulus inorganic compounds, which can produce large and reversible volume changes, providing high actuation energy density, high actuation authority and large free strain. | 02-02-2012 |
20130020903 | ELECTROCHEMICAL METHODS, DEVICES, AND STRUCTURES - The present invention provides devices and structures and methods of use thereof in electrochemical actuation. This invention provides electrochemical actuators, which are based, inter-alia, on an electric field-driven intercalation or alloying of high-modulus inorganic compounds, which can produce large and reversible volume changes, providing high actuation energy density, high actuation authority and large free strain. | 01-24-2013 |