Patent application number | Description | Published |
20140193431 | ANTI-C-MET ANTIBODY HAVING HGF ACTIVITY AND USE THEREOF - Disclosed are a human antibody comprising a human complementarity-determining region (CDR), which binds specifically to c-Met, and a framework region (FR), a polynucleotide encoding the human antibody, an expression vector comprising the polynucleotide, a transformant transformed with the expression vector, a method of producing the human antibody B7 by culturing the transformant, a wound healing composition comprising the human antibody as an active ingredient, a cell regeneration composition comprising the antibody as an active ingredient, and a drug conjugate comprising a drug linked to the human antibody. The c-Met-specific human antibody can function as an HGF mimic that can be used as a wound healing composition. The antibody can be widely used to determine the treatment and prognosis of various diseases, including neuronal infarction, progressive nephropathy, liver cirrhosis, lung fibrosis, kidney injury, liver injury, lung injury, and ulcerative wounds, which are treated by activation of HGF or c-Met. | 07-10-2014 |
Patent application number | Description | Published |
20100048471 | ANGIOGENESIS INHIBITOR COMPRISING METEORIN AS AN ACTIVE INGREDIENT - The present invention relates to an angiogenesis inhibitor comprising meteorin as an active ingredient that is highly expressed in astrocytes of the brain and retina in the late embryonic stage and after the birth of a mouse. It is in particular highly detected in astrocyte endfeet surrounding blood vessels and promotes the expression of thrombospondin-1/-2 (TSP-1/-2) via autocrine pathway and thus inhibits angiogenesis. The meteorin of the present invention can be effectively used for pharmaceutical compositions and health foods that prevent vascular diseases by inhibiting angiogenesis. | 02-25-2010 |
20100068315 | Composition Comprising an Extract of Gramineae Plant for the Prevention and Treatment of Ischemic Diseases and Degenerative Brain Diseases and the Use Thereof - The present invention relates to a composition comprising extracts of Gramineae plant that improves cell viability under hypoxic conditions by inhibiting apoptosis. Thus, the extract of | 03-18-2010 |
20110123538 | COMPOSITION COMPRISING EXPRESSION OR ACTIVITY INHIBITORS OF NINJURIN 1 FOR THE PREVENTION AND TREATMENT OF INFLAMMATORY DISEASE - The present invention relates to a composition comprising a Ninjurin 1 expression or activity inhibitor for the prevention and treatment of inflammatory disease. Ninjurin 1 protein is specifically expressed in macrophages around blood vessels, increases cell-cell adhesion and cell-matrix adhesion, increases expressions of Wnt7b (Wingless-type MMTV integration site family, member 7B) and Ang2 (angiopoietin-2), but reduces expression of Ang1 to induce apoptosis of vascular endothelial cells. In addition, Ninjurin 1 protein is up-regulated when inflammation is induced and induces iNOS expression as well as increased NO generation. Therefore, the Ninjurin 1 protein expression or activation inhibitor can be effectively used as an active ingredient of a composition for the prevention and treatment of inflammatory disease. | 05-26-2011 |
20110162092 | COMPOSITION COMPRISED OF AKAP12 AND USES OF AKAP12 MUTANT ZEBRAFISH AS AN ANIMAL MODEL - The present invention relates to a composition comprised of AKAP12 (A-Kinase anchoring protein 12) and to uses of AKAP12 mutant zebrafish as an animal model. More particularly, the following characteristics are noted in the present AKAP12 mRNA knockdown zebrafish: crooked or shortened tail, inability to move normally, non-uniform micro-vasculature in the brain, and change in heart shape with non-uniform and weak heartbeats. It also has various circulatory and genetic defects, such as hemorrhage from the ventricles of the heart, brain, and retina. All of these defects can be cured with AKAP12 injection. Therefore, AKAP12 can be used as an active component for a composition to prevent and heal circulatory and genetic defects that are caused by AKAP12 deficiency, and as a hemorrhage inhibitor. Further, the AKAP12 deficient mutant zebrafish can be useful as an animal model for verification of effectiveness of treatment for genetic defects in the circulatory system. | 06-30-2011 |
20110171661 | METHOD FOR DIAGNOSIS OF POST-OPERATIVE RECURRENCE IN PATIENTS WITH HEPATOCELLULAR CARCINOMA - Provided are a method of diagnosing the recurrence or possibility of recurrence of hepa | 07-14-2011 |
20110250193 | COMPOSITION COMPRISING EXPRESSION OR ACTIVITY INHIBITORS OF NINJURIN1 FOR THE PREVENTION AND TREATMENT OF INFLAMMATORY DISEASE - The present invention relates to a composition comprising a Ninjurin1 expression or activity inhibitor for the prevention and treatment of inflammatory disease. Ninjurin1 protein is specifically expressed in macrophages around blood vessels, increases cell-cell adhesion and cell-matrix adhesion, increases expressions of Wnt7 | 10-13-2011 |
20130330361 | Composition Comprising Expression or Activity Regulators of AKAP12 for Treating Central Nerve System Diseases - The invention includes a pharmaceutical composition comprising an expression or activity regulator of AKAP12 (A-kinase anchoring protein 12) as the active ingredient. The compositions of the invention are useful for treating central nervous system diseases. The invention further includes a method of treating central nervous system diseases using a pharmaceutical composition of the invention. The central nervous system diseases contemplated within the invention include post-traumatic stress syndrome, stroke, and spinal injury. | 12-12-2013 |
20140037640 | COMPOSITION COMPRISING EXPRESSION OR ACTIVITY INHIBITORS OF NINJURIN1 FOR THE PREVENTION AND TREATMENT OF INFLAMMATORY DISEASE - The present invention relates to a composition comprising a Ninjurin1 expression or activity inhibitor for the prevention and treatment of inflammatory disease. Ninjurin1 protein is specifically expressed in macrophages around blood vessels, increases cell-cell adhesion and cell-matrix adhesion, increases expressions of Wnt7b (Wingless-type MMTV integration site family, member 7B) and Ang2 (angiopoietin-2), but reduces expression of Ang1 to induce apoptosis of vascular endothelial cells. In addition, Ninjurin1 protein is up-regulated when inflammation is induced and induces iNOS expression as well as increased NO generation. Therefore, the Ninjurin1 protein expression or activation inhibitor can be effectively used as an active ingredient of a composition for the prevention and treatment of inflammatory disease. | 02-06-2014 |
Patent application number | Description | Published |
20090288489 | PURE TONE AUDIOMETER WITH AUTOMATED MASKING - The present invention relates to a pure tone audiometer, and more particularly, to a pure tone audiometer with automated masking which is capable of automatically performing air-conduction and bone-conduction hearing tests and automatically performing a masking test, if necessary, so that a person obtains an accurate pure tone hearing threshold without others' assistance. The pure tone audiometer of the present invention can accurately perform the pure tone hearing test with automated masking without assistance from a doctor or an audiologist. Thus, with the pure tone audiometer, people can easily check their hearing ability for prevention and early detection of hearing loss and take swift action to cure hearing loss. | 11-26-2009 |
20100142935 | Steam generator and washing machine therewith - The present invention relates to a steam generator and a washing machine therewith. The present invention provides a steam generator including a water chamber for holding water actually, the water chamber having a heater mounted thereto for heating the water, and a steam chamber for holding steam generated as the water is heated actually, wherein the water chamber has a vertical direction length (a vertical length) relatively greater than a horizontal direction length (a horizontal length). | 06-10-2010 |
20100324374 | LARYNGEAL STROBOSCOPE USING VOICE SIGNAL - Provided is a laryngeal stroboscope using voice signals. The laryngeal stroboscope includes a photography unit for photographing a patient's vocal cords and a light source for illuminating a part to be photographed, a microphone for sensing the patient's voice, a high-pass filter for passing voice signals of 100 Hz or more among voice signals output from the microphone, a low-pass filter for removing signals of harmonic components from the voice signals output from the high-pass filter and passing only a voice signal in a fundamental frequency band, a peak detector for detecting a peak of the voice signal output from the low-pass filter and obtaining a pitch, and a controller for controlling the light source to intermittently emit light in response to a signal output from the peak detector and controlling the photography unit to operate according to whether or not the light is intermittently emitted. | 12-23-2010 |
Patent application number | Description | Published |
20100092718 | WAFER MOUNT TAPE, WAFER PROCESSING APPARATUS AND METHOD OF USING THE SAME FOR USE IN THINNING WAFERS - A wafer mount tape, a wafer processing apparatus and an associated method of using the wafer mount tape for use in wafer thinning operations is presented. The wafer mount tape includes a tape body, a first adhesive member and a second adhesive member. The tape body has a first region, a second region and a third region. The first region of the tape body is for being disposed onto a wafer. The second region of the tape body is defined along a periphery of the first region. The third region of the tape body is defined along a periphery of the second region. The first adhesive member is disposed at the first region. The second adhesive member is disposed at the third region. | 04-15-2010 |
20110006413 | SUBSTRATE FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND STACK PACKAGE USING THE SEMICONDUCTOR PACKAGE - A substrate for a semiconductor package is provided having first and second core layers defining a cavity having an adhesive member and sized and shaped to receive a semiconductor chip. The semiconductor package further having a connection member formed on a bond finger and connected to a via pattern formed through the first and second core layers. A stack package is also provided having multiple substrates. | 01-13-2011 |
20110189928 | WAFER MOUNT TAPE, WAFER PROCESSING APPARATUS AND METHOD OF USING THE SAME FOR USE IN THINNING WAFERS - A wafer mount tape, a wafer processing apparatus and an associated method of using the wafer mount tape for use in wafer thinning operations is presented. The wafer mount tape includes a tape body, a first adhesive member and a second adhesive member. The tape body has a first region, a second region and a third region. The first region of the tape body is for being disposed onto a wafer. The second region of the tape body is defined along a periphery of the first region. The third region of the tape body is defined along a periphery of the second region. The first adhesive is member is disposed at the first region. The second adhesive member is disposed at the third region. | 08-04-2011 |
20110272798 | CHIP UNIT AND STACK PACKAGE HAVING THE SAME - A chip unit includes: a first semiconductor chip and a second semiconductor chip disposed such that their surfaces for forming first bonding pads and second bonding pads face each other; first and second connection members disposed on the surfaces of the first and second semiconductor chips for forming the first and second bonding pads, and having redistribution lines which have one ends connected with the first and second bonding pads and the other ends projecting beyond one edges of the first and second semiconductor chips and films; an adhesive member interposed between the first connection members and the second connection members; and via patterns passing through the adhesive member and connecting projecting portions of the redistribution lines of the first and second connection members with each other. | 11-10-2011 |
20110272820 | STACKED SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME - A stacked semiconductor package includes a semiconductor package module including a plurality of semiconductor packages each of which has a first surface, a second surface facing away from the first surface, side surfaces connecting the first surface and the second surface and through-holes formed on the side surfaces to pass through the first surface and the second surface and which are stacked such that their through-holes vertically connect with one another, and adhesive members which are formed between the semiconductor packages and attach the semiconductor packages to one another, a main substrate supporting the semiconductor package module and formed, on a third surface thereof facing the semiconductor package module, with main connection pads which are aligned with the through-holes, and conductive connection members formed in the through-holes and electrically connecting the semiconductor packages with the main connection pads. | 11-10-2011 |
20120018879 | STACK PACKAGE AND METHOD FOR MANUFACTURING THE SAME - A stack package includes a cover film, a first package having a first semiconductor chip which is attached to the cover film, a first adhesive member which is formed to seal the first semiconductor chip and a surface of the cover film, and a first circuit pattern which is disposed over the first adhesive member and electrically connected with the first semiconductor chip; a second package disposed over the first package, having a second semiconductor chip which is electrically connected with the first circuit pattern, a second adhesive member which is formed to seal the second semiconductor chip, and a second circuit pattern which is formed over the second adhesive member, and a via formed to pass through the second circuit pattern and the second adhesive member and to be electrically connected with the first circuit pattern and the second circuit pattern. | 01-26-2012 |
20120207971 | BUFFER SUBSTRATE, BUFFER SHEET AND MANUFACTURING METHOD THEREOF - Disclosed herein is a buffer substrate comprising: a first substrate having a first surface and a second surface opposite to the first surface, the first substrate having one or more through-holes formed therein; a first elastic material component filling the through-holes and covering the second surface of the first substrate; and a second substrate arranged on the first elastic material component arranged on the second surface of the first substrate. | 08-16-2012 |
20130256887 | STACKED SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME - A stacked semiconductor package includes a semiconductor package module including a plurality of semiconductor packages each of which has a first surface, a second surface facing away from the first surface, side surfaces connecting the first surface and the second surface and through-holes formed on the side surfaces to pass through the first surface and the second surface and which are stacked such that their through-holes vertically connect with one another, and adhesive members which are formed between the semiconductor packages and attach the semiconductor packages to one another, a main substrate supporting the semiconductor package module and formed, on a third surface thereof facing the semiconductor package module, with main connection pads which are aligned with the through-holes, and conductive connection members formed in the through-holes and electrically connecting the semiconductor packages with the main connection pads. | 10-03-2013 |
20140057369 | METHODS FOR FORMING INTERCONNECTION LINE USING SCREEN PRINTING TECHNIQUE - Methods of forming an interconnection line pattern using a screen printing technique. The method includes preparing a substrate having unevenness, aligning a stencil mask on the substrate, and printing a paste including materials for forming the interconnection line pattern on a convex portion of the unevenness formed on the substrate. | 02-27-2014 |
20140108634 | METHOD, APPARATUS, AND SYSTEM FOR CONTROLLING TERMINAL DEVICE - Disclosed are a method, apparatus, and system for controlling a terminal device. A method of controlling a terminal device is performed by a terminal device control unit included in the terminal device. The method may include determining whether or not to change a state of the terminal device into a terminal device control state based on range information including at least one of a control area and a control period in which the terminal device is controlled and the real-time information of the terminal device, changing the state of the terminal device into the terminal device control state based on a result of the determination, and controlling the terminal device based on the control information in the terminal device control state. | 04-17-2014 |
20140175638 | SEMICONDUCTOR PACKAGES INCLUDING SEMICONDUCTOR CHIPS HAVING PROTRUSIONS AND METHODS OF FABRICATING THE SAME - The semiconductor package includes an upper semiconductor chip stacked on a package substrate and a support layer or a lower semiconductor chip disposed between the upper semiconductor chip and the package substrate. The upper semiconductor chip includes a protrusion downwardly extending from an edge thereof. The protrusion of the upper semiconductor chip is combined with a sidewall of the support layer or the lower semiconductor chip. Related methods are also provided. | 06-26-2014 |
20150062846 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Provided is a printed circuit board, including: a core substrate including an internal circuit pattern on an upper surface or a lower surface; electronic devices which are formed to pass through the core substrate; an external insulating layer which covers the internal circuit pattern and the electronic devices; and an external circuit pattern which is formed on an upper surface of the external insulating layer, wherein a lower surface of the electronic devices protrudes from the lower surface of the core substrate to a lower part. Accordingly, in the embedded printed circuit board in which the electronic devices are embedded, when the electronic devices are mounted, because the insulating layer is formed regardless of a thickness of the electronic devices, the printed circuit board having a desired thickness regardless of the thickness of the electronic devices can be formed. | 03-05-2015 |