Patent application number | Description | Published |
20090096843 | INKJET PRINTING DEVICE AND METHOD OF DRIVING THE SAME - An inkjet printing device includes a flow path plate comprising a manifold to supply ink, a pressure chamber filled with the ink supplied from the manifold, and a nozzle via which the ink is ejected, a piezoelectric actuator which is disposed on a top surface of the flow path plate and includes a lower electrode, a piezoelectric layer, and an upper electrode that are stacked sequentially, a first electrostatic electrode to generate an electrostatic field, and a second electrostatic electrode which is disposed a predetermined distance apart from a bottom surface of the flow path plate to generate the electrostatic field between the first electrostatic electrode and the second electrostatic electrode. | 04-16-2009 |
20100128088 | Nozzle plate and method of manufacturing the same - Provided are a nozzle plate and a method of fabricating the nozzle plate. In accordance with an example embodiment of the present invention, a nozzle plate may include a body and at least one nozzle protruding from the body, wherein the at least one nozzle includes a wall having a thickness that increases the farther the wall gets away from an exit of the at least one nozzle. | 05-27-2010 |
20100167433 | PIEZOELECTRIC INKJET PRINTHEAD AND METHOD OF MANUFACTURING THE SAME - A piezoelectric inkjet printhead including an upper substrate formed of a single crystal silicon substrate or an SOI substrate and having an ink inlet therethrough, and a lower substrate formed of an SOI substrate having a sequentially stacked structure with a first silicon layer, an intervening oxide layer, and a second silicon layer in which a manifold, pressure chambers, and dampers are formed in the second silicon layer by wet or dry etching, and nozzles are formed through the intervening oxide layer and the first silicon layer by dry etching, and a method of manufacturing the same. | 07-01-2010 |
20110049095 | METHOD OF FORMING HYDROPHOBIC COATING LAYER ON SURFACE OF NOZZLE PLATE OF INKJET PRINTHEAD - A method of forming a hydrophobic coating layer on a surface of a nozzle plate of an inkjet printhead includes forming a plurality of nozzles in the nozzle plate, each of the nozzles having an exit, stacking a film on the surface of the nozzle plate to cover the exit of each of the nozzles, forming a predetermined metal layer on an inner wall of each of the nozzles and an inner surface of the film covering the exit of each of the nozzles using a plating method, removing the film from the surface of the nozzle plate, forming a hydrophobic coating layer on the surface of the nozzle plate to cover the metal layer exposed through the exit of each of the nozzles, and removing the metal layer formed on the inner wall of each of the nozzles and the hydrophobic coating layer formed on the surface of the metal layer. | 03-03-2011 |
20110091645 | NOZZLE PLATE OF INKJET PRINTHEAD AND METHOD OF MANUFACTURING THE NOZZLE PLATE - A nozzle plate of an inkjet printhead, and a method of manufacturing the nozzle plate. The nozzle plate includes a substrate through which nozzles are formed; an ink-philic coating layer formed on an outer surface of the substrate and inner walls of the nozzles; and an ink-phobic coating layer selectively formed on the ink-philic coating layer disposed around the nozzles. | 04-21-2011 |
20110183478 | Method of manufacturing TFT and array TFT - A method of manufacturing a thin film transistor includes sequentially forming a gate and at least one insulation layer on a substrate, forming a source electrode and a drain electrode on the at least one insulation layer, and forming a channel layer formed of a semiconductor on a part of the source electrode and the drain electrode, wherein the gate, the source electrode, and the drain electrode are formed by using a hybrid inkjet printing apparatus. | 07-28-2011 |
20120120153 | Nozzle Plate And Method Of Manufacturing The Same - A nozzle plate including protruding nozzles and a method of manufacturing the nozzle plate. The nozzle plate may include a body unit and at least one nozzle protruding from the body unit. The at least one nozzle may include an exit part having a constant cross-sectional area and a damper part having a cross-sectional area that decreases in a direction toward the exit part, wherein the damper part of the at least one nozzle includes a plurality of inner wall surfaces having different angles of inclination. | 05-17-2012 |
20130063529 | PRINTING SYSTEM, PRINTING APPARATUSES, AND METHODS OF FORMING NOZZLES OF PRINTING APPARATUSES - A printing apparatus includes: a flow channel plate including, a pressure chamber, a nozzle including an outlet through which ink contained in the pressure chamber is ejected, and a trench disposed around the nozzle, and the outlet extending into the trench; a piezoelectric actuator configured to provide a change in pressure to eject the ink contained in the pressure chamber; and an electrostatic actuator configured to provide an electrostatic driving force to the ink contained in the nozzle. | 03-14-2013 |
20130135392 | INKJET PRINTING APPARATUS AND METHOD OF FORMING NOZZLES - A printing apparatus includes a first nozzle substrate having a first tapered nozzle unit aligned with a pressure chamber and a second nozzle substrate having a second tapered nozzle unit aligned with the first tapered nozzle unit and attached to the bottom of the first nozzle substrate. | 05-30-2013 |
20130164932 | METHODS OF FORMING WIRINGS IN ELECTRONIC DEVICES - A method of forming a wiring may include forming a first wire on a substrate; forming a material layer on the substrate, except on the first wire; forming a surface treatment film on the material layer; and forming a second wire on the first wire. The surface treatment film has physical properties opposite to the first wire. A method of forming a wiring may include forming a first wire on a substrate; forming a material layer on the substrate and the first wire; removing a portion of the material layer from the first wire; forming a surface treatment film on the material layer and the first wire; removing a portion of the surface treatment film from the first wire; and forming a second wire on the first wire. A thickness of the material layer on the substrate is greater than a thickness of the first wire on the substrate. | 06-27-2013 |
20140098160 | INKJET PRINTING DEVICES - Provided is an inkjet printing device. The inkjet printing device includes a passage forming substrate having a plurality of pressure chambers and a nozzle substrate. The nozzle substrate includes a plurality of nozzle blocks extending in a first direction, a plurality of nozzles connected to the pressure chambers and penetrating the nozzle blocks, and a plurality of trenches. Each of the trenches is disposed in a second direction perpendicular to the first direction with respect to the nozzle blocks, recessed from a bottom surface of the nozzle blocks, and extends in the first direction. | 04-10-2014 |
20140138345 | METHODS OF FORMING CONDUCTIVE PATTERNS USING INKJET PRINTING METHODS - A method of forming a conductive pattern includes forming a first partition and a second partition which are spaced apart from each other on a substrate, the first and second partitions defining a trench. The method includes discharging ink into the trench to form ink droplets pinned in a boundary region of the first and second partitions. The method further includes the boundary region including a region between a top side and an outer side of the first and second partitions, the ink including conductive particles. The method includes performing drying and sintering processes to form the conductive pattern in the trench, the conductive pattern including the conductive particles. | 05-22-2014 |
20140141156 | METHOD OF FORMING ELECTRIC WIRING USING INKJET PRINTING - Disclosed is a method of forming an electric wiring using inkjet printing. The method includes forming a main trench and first and second guide trenches on a substrate. The first and second guide trenches are disposed at opposite sides of the main trench. The method includes ejecting ink into the main trench, the ink including a conductive material. The method also includes heating the substrate to sinter the ink such that the electric wiring is formed an upper portion of the main trench, and contract the ink such that a tunnel is formed in a lower portion of the main trench. | 05-22-2014 |
20140160203 | INKJET PRINTING APPARATUSES, INKJET NOZZLES, AND METHODS OF FORMING INKJET NOZZLES - Provided is an inkjet printing apparatus. The inkjet printing apparatus includes a nozzle. The nozzle includes at least two nozzle parts. A first of the at least two nozzle parts has a first tapered shape, and a second of the at least two nozzle parts has a second tapered shape and extends from the first nozzle part. The first and second tapered shapes have a same taper direction. | 06-12-2014 |
20150035911 | PRINTING SYSTEM, PRINTING APPARATUSES, AND METHODS OF FORMING NOZZLES OF PRINTING APPARATUSES - A printing apparatus includes: a flow channel plate including, a pressure chamber, a nozzle including an outlet through which ink contained in the pressure chamber is ejected, and a trench disposed around the nozzle, and the outlet extending into the trench; a piezoelectric actuator configured to provide a change in pressure to eject the ink contained in the pressure chamber; and an electrostatic actuator configured to provide an electrostatic driving force to the ink contained in the nozzle. | 02-05-2015 |
Patent application number | Description | Published |
20110242467 | DISPLAY DEVICE - A display device is disclosed. The display device includes: a display panel including a display surface and a peripheral area surrounding the display surface, a transparent plate covering the display surface and the peripheral area, a resin layer disposed between the display panel and the transparent plate, and hardened by light, and a reflective layer provided between the transparent plate and the resin layer, along the peripheral area of the display panel. | 10-06-2011 |
20120282845 | Substrate processing apparatus and method of operating the same - Provided is a substrate processing apparatus including a first conduit configured to supply a processing solution to a substrate loaded on a supporter, and a second conduit in fluid communication with the first conduit, the second conduit configured to supply a gas to the first conduit to be mixed with the processing solution, wherein the first conduit includes an opening to permit the processing solution mixed with the gas to be injected onto the substrate. | 11-08-2012 |
20120299888 | DISPLAY PANEL - Embodiments may be directed to a display panel includes a base substrate including a display region having a plurality of pixels and a non-display region adjacent to the display region, a connecting line in the non-display region and including at least a first input pad, a second input pad, and an output pad, and an insulating layer on the connecting line. The insulating layer includes at least one first contact hole exposing at least a portion of the first input pad, at least one second contact hole exposing at least a portion of the second input pad, and at least one third contact hole between the first contact hole and the second contact hole. A first contact electrode, a second contact electrode, and a dummy contact electrode are disposed at the first, second and third contact holes, respectively. | 11-29-2012 |
20130002145 | DISPLAY DEVICE - A display device which adjusts luminance of a display panel is disclosed. The display device senses light which leaks from a display area to a non-display area and adjusts the luminance of the display panel according to the sensed light. | 01-03-2013 |