Patent application number | Description | Published |
20100068514 | METHOD FOR ENCAPSULATING AN ELECTRONIC ARRANGEMENT - The present invention relates to a method for encapsulating an electronic arrangement against permeants, in which a pressure-sensitive adhesive composition based on vinylaromatic block copolymers is provided, and in which the pressure-sensitive adhesive composition is applied onto and/or around the regions of the electronic arrangement which are to be encapsulated. | 03-18-2010 |
20100148127 | Method For Encapsulating An Electronic Arrangement - A method for encapsulating an electronic, optionally optoelectronic, arrangement against permeants, in which a pressure-sensitive adhesive composition based on a partly crystalline polyolefin is applied onto and/or around the regions of the electronic arrangement which are to be encapsulated, wherein the polyolefin has a density between 0.86 and 0.89 g/cm and a crystallite melting point of at least 90° C. | 06-17-2010 |
20110036623 | METHOD OF ENCAPSULATING AN ELECTRONIC ARRANGEMENT - The present invention relates to as method of encapsulating an electronic arrangement with respect to permeants, in which an at least partly crosslinked hotmelt adhesive based on acid-modified or acid-anhydride-modified vinylaromatic block copolymers is provided and in which the pressure-sensitive adhesive is applied to and/or around the regions of the electronic arrangement that are to be encapsulated. | 02-17-2011 |
20110121356 | METHOD FOR ENCAPSULATING AN ELECTRONIC ARRANGEMENT - Method for encapsulating an electronic arrangement against permeates wherein a pressure-sensitive adhesive mass based on butylene block copolymers is applied to and around the areas of the electronic arrangement to be encapsulated. | 05-26-2011 |
20120064318 | TRANSPARENT BARRIER LAMINATES - A novel, transparent, non-substrate-based permeation barrier film for encapsulating electronic, more particularly optoelectronic, assemblies consists of a first polymer layer ( | 03-15-2012 |
20130040136 | HEAT-RESISTANT LASER-INSCRIBABLE FILM - Laser-inscribable film, comprising a contrast layer based on a cured acrylate coating composition and, arranged above the contrast layer, an engraving layer, where the cured acrylate coating composition is based on a composition comprising from 30 to 80% by weight of a trifunctional oligomer A, from 0 to 20% by weight of a trifunctional monomer B, from 1 to 30% by weight of a difunctional monomer C, and from 2 to 40% by weight of a colorant pigment. | 02-14-2013 |
20130264724 | ADHESIVE COMPOUND AND METHOD FOR ENCAPSULATING AN ELECTRONIC ARRANGEMENT - The invention relates to a method for encapsulating an electronic arrangement against permeants, wherein an electronic arrangement is made available on a substrate, wherein, in a vacuum, that area of the substrate which embraces that region of the electronic arrangement which is to be encapsulated, preferably said area and that region of the electronic arrangement which is to be encapsulated, is brought into contact with a sheet material comprising at least one adhesive compound and a composite is produced therefrom. The invention also relates to an apparatus for implementing the method and to an encapsulated electronic arrangement produced thereby. | 10-10-2013 |
20150064462 | TEMPERATURE-STABLE CROSS-LINKABLE ADHESIVE COMPOUND WITH HARD AND SOFT BLOCKS - Temperature-stable adhesive compound, comprising (i) block copolymers having a construction A-B-A, (A-B) | 03-05-2015 |
20150079389 | CROSS-LINKABLE ADHESIVE COMPOUND WITH HARD AND SOFT BLOCKS AS A PERMEANT BARRIER - Adhesive compound as a permeant barrier, comprising (i) block copolymers having a construction A-B-A, (A-B) | 03-19-2015 |
20150099081 | COMPOSITE SYSTEM FOR ENCAPSULATING ELECTRONIC ARRANGEMENTS - An adhesive strip, with improved barrier effect, encapsulates electronic arrangements against permeates, whereby the composite system comprises at least (a) an adhesive strip containing at least one pressure-sensitive adhesive substance for direct application on a substrate; and (b) at least one release liner which lies directly upon the pressure-sensitive adhesive substance, wherein the surface of the release liner, that faces the pressure-sensitive adhesive substance, has a surface roughness of less that 100 nm, measured as an arithmetic mean Sa as per ISO/FDIS 25178-2:2011 of the amounts of at least 10,000 height values of the profile of a partial surface of at least 200 μm×200 μm. A method produces a release liner with a smooth surface for equipping barrier adhesive strips by removing the liner in order to encapsulate electronic arrangements with the adhesive strip. | 04-09-2015 |
20150162568 | ADHESIVE TAPE FOR ENCAPSULATING AN ORGANIC ELECTRONIC ARRANGEMENT - The invention relates to a method for protecting an electronic arrangement which is disposed on a substrate and comprises organic constituents, where a cover is applied to the electronic arrangement in such a way that the electronic arrangement is at least partly covered by the cover, the cover being bonded at least over a partial area to the substrate and/or to the electronic arrangement, the adhesive bond being produced by means of at least one layer of an adhesive in an adhesive tape, characterized in that the adhesive comprises a getter material which is capable of at least one permeable substance, the getter material being present in the adhesive in a proportion of not more than 2 wt %, based on the adhesive with the getter material. | 06-11-2015 |
20150240134 | PRESSURE-SENSITIVE ADHESIVE MATERIAL PARTICULARLY FOR ENCASING AN ELECTRONIC ARRANGEMENT - Pressure-sensitive adhesive material for encasing an electronic arrangement to prevent permeate, which material comprises at least 70 percent by weight of a mixture of at least one fluorine-containing thermoplastic elastomer and at least one fluorine-containing liquid elastomer, wherein the mass ratio of the fluorine-containing liquid elastomer to the fluorine-containing thermoplastic elastomer is between 5:95 to 55:45 | 08-27-2015 |
20150337174 | Adhesive Tape Containing Getter Material - The aim of the invention is to effectively protect a flat adhesive compound from permeates originating from the surroundings as well as from permeates trapped during lamination, winding, stacking or other processing steps. For this purpose, the adhesive tape comprises at least the following layers in the indicated order: a first outer adhesive compound layer A, a layer B, which contains at least one inorganic getter material, and a second outer adhesive compound layer C. The invention also relates to the use of said adhesive tape as an encapsulation material. | 11-26-2015 |
Patent application number | Description | Published |
20090287009 | METHOD FOR EVAPORATING COMPONENTS OF A LIQUID - Mixtures containing high boiling and low boiling components, at least one component being dissociatable into ions, are separated effectively by heating by passing an alternating electrical current through the mixture. The process is particularly effective in the workup of crude alkylchlorosilanes from the direct synthesis. | 11-19-2009 |
20090295361 | Apparatus For Converting Electrical Energy For Conductively Heating Semiconductor Material In Rod Form - The present invention relates to an apparatus for converting electrical energy for conductively heating rod-shaped semiconductor materials. The apparatus is particularly useful to control the temperature of electrically heated rods in the Siemens process for deposition of silicon by chemical vapor deposition. | 12-03-2009 |
20110024266 | Method For Conveying Silicon Granules In An Encapsulated Conveying Channel - Silicon granules are conveyed in an encapsulated conveying channel by swaying movement of the channel produced by a permanent magnet excited by an external alternating electromagnetic field. | 02-03-2011 |
20120327543 | ELECTRODE AND METHOD FOR SUPPLYING CURRENT TO A REACTOR - Disclosed is a method for supplying current to a reactor, wherein electrode(s) of an electrical energy network (EEN), which is DC-isolated from ground potential, is/are fed through a reactor wall and connected to an electrically conductive element (ECE) so that an operating voltage is applied to the ECE and electrical current flows through it. A seal of electrically insulating material is provided between the wall and the electrode. The EEN is monitored for insulation faults. A fall below a particular insulation resistance triggers shutdown of the electrical energy supply. The switching threshold is determined by taking into account at least one of the following parameters: seal geometry, seal material, supply voltage and maximum possible electrical energy input into the seal immediately before shutdown, triggered by the maximum theoretically possible leakage current through the seal. A device and an electrode having respective seals are also disclosed. | 12-27-2012 |
20120328269 | DEVICE AND METHOD FOR THE THERMAL TREATMENT OF CORROSIVE GASES - A device for thermal treatment of corrosive gases includes a chamber for heating gases in which there are at least four heating elements or four groups of heating elements including an electrically conductive material, wherein each heating element or group is connected to a separately regulatable and/or controllable subsystem of an electrical energy network and can thereby be heated by direct current flow, wherein each heating element or group can be controlled or regulated with respect to at least one either identical or different value of a parameter selected from the group consisting of temperature, heating power, current, voltage and resistance, or with respect to another heating element process variable, which can be influenced by the device, and wherein at least four regulatable and/or controllable subsystems are DC-isolated from ground potential. The invention also relates to a corresponding method for the thermal treatment of corrosive gases. | 12-27-2012 |
20140105805 | PROCESS FOR HYDROGENATING SILICON TETRACHLORIDE TO TRICHLOROSILANE - The invention provides a process for hydrogenating silicon tetrachloride in a reactor, in which reactant gas containing hydrogen and silicon tetrachloride is heated to a temperature of greater than 900° C. at a pressure between 4 and 15 bar, first by means of at least one heat exchanger made from graphite and then by means of at least one heating element made from SiC-coated graphite, the temperature of the heating elements being between 1150° C. and 1250° C., wherein the reactant gas includes at least one boron compound selected from the group consisting of diborane, higher boranes, boron-halogen compounds and boron-silyl compounds, the sum of the concentrations of all boron compounds being greater than 1 ppmv based on the reactant gas stream. | 04-17-2014 |