Patent application number | Description | Published |
20090034203 | Cr-Cu ALLOY, METHOD FOR PRODUCING THE SAME, HEAT-RELEASE PLATE FOR SEMICONDUCTOR, AND HEAT-RELEASE COMPONENT FOR SEMICONDUCTOR - In a Cr—Cu alloy that is formed by powder metallurgy and contains a Cu matrix and flattened Cr phases, the Cr content in the Cr—Cu alloy is more than 30% to 80% or less by mass, and the average aspect ratio of the flattened Cr phases is more than 1.0 and less than 100. The Cr—Cu alloy has a small thermal expansion coefficient in in-plane directions, a high thermal conductivity, and excellent processability. A method for producing the Cr—Cu alloy is also provided. A heat-release plate for semiconductors and a heat-release component for semiconductors, each utilizing the Cr—Cu alloy, are also provided. | 02-05-2009 |
20120020827 | FERRITIC STAINLESS STEEL WITH EXCELLENT HEAT RESISTANCE - A ferritic stainless steel contains no expensive elements such as Mo and W, is free from the oxidation resistance loss caused by addition of Cu, and thereby has excellent levels of oxidation resistance (including water vapor oxidation resistance), thermal fatigue property, and high-temperature fatigue property. The ferritic stainless steel contains, in mass %, C at 0.015% or less, Si at 0.4 to 1.0%, Mn at 1.0% or less, P at 0.040% or less, S at 0.010% or less, Cr at 16 to 23%, Al at 0.2 to 1.0%, N at 0.015% or less, Cu at 1.0 to 2.5%, Nb at 0.3 to 0.65%, Ti at 0.5% or less, Mo at 0.1% or less, and W at 0.1% or less, the Si and the Al satisfying a relation Si (%)≧Al (%). | 01-26-2012 |
20120125724 | STEEL SHEET FOR BRAKE DISC, AND BRAKE DISC - A steel sheet for a brake disc contains, on a mass percent basis, 0.02% or more and less than 0.10% C, 0.6% or less Si, more than 0.5% and 2.0% or less Mn, 0.06% or less P, 0.01% or less S, 0.05% or less Al, 11.0% to 13.5% Cr, 0.01% to 0.30% Ni, 0.10% to 0.60% Nb, 0.03% or more and less than 0.10% N, more than 0.0010% and 0.0060% or less B, and the balance being Fe and incidental impurities, and the steel sheet after quenching has a hardness of 32 HRC to 40 HRC on a Rockwell hardness scale C (HRC). | 05-24-2012 |
20130126052 | STRUCTURAL STAINLESS STEEL SHEET HAVING EXCELLENT CORROSION RESISTANCE AT WELD AND METHOD FOR MANUFACTURING SAME - A structural stainless steel sheet which can be manufactured at a low cost and with high efficiency, and possesses excellent welded-part corrosion resistance and a manufacturing method thereof are provided. The structural stainless steel sheet has a composition which contains by mass % 0.01 to 0.03% C, 0.01 to 0.03% N, 0.10 to 0.40% Si, 1.5 to 2.5% Mn, 0.04% or less P, 0.02% or less S, 0.05 to 0.15% Al, 10 to 13% Cr, 0.5 to 1.0% Ni, 4×(C+N) or more and 0.3% or less Ti, and Fe and unavoidable impurities as a balance, V, Ca and O in the unavoidable impurities being regulated to 0.05% or less V, 0.0030% or less Ca and 0.0080% or less O, wherein an F value expressed by Cr+2×Si+4×Ti−2×Ni−Mn−30×(C+N) satisfies a condition that F value≦11 and an FFV value expressed by Cr+3×Si+16×Ti+Mo+2×Al−2×Mn−4×(Ni+Cu)−40×(C+N)+20×V satisfies a condition that FFV value≦9.0. | 05-23-2013 |
20130196172 | STAINLESS STEEL FOIL AND CATALYST CARRIER FOR EXHAUST GAS PURIFYING DEVICE USING THE FOIL - A stainless steel foil contains, in percent by mass, 0.05% or less of C, 2.0% or less of Si, 1.0% or less of Mn, 0.003% or less of S, 0.05% or less of P, 25.0% to 35.0% of Cr, 0.05% to 0.30% of Ni, 3.0% to 10.0% of Al, 0.10% or less of N, 0.02% or less of Ti, 0.02% or less of Nb, 0.02% or less of Ta, 0.005% to 0.20% of Zr, 0.02% or less of Ce, 0.03% to 0.20% of REM excluding Ce, 0.5% to 6.0% in total of at least one of Mo and W, and the balance being Fe and incidental impurities. | 08-01-2013 |
20130272912 | FERRITIC STAINLESS STEEL EXCELLENT IN OXIDATION RESISTANCE - An object is to provide a ferritic stainless steel having excellent oxidation resistance, while preventing a deterioration in formability, without adding expensive chemical elements such as Mo and W. Specifically, the ferritic stainless steel excellent in oxidation resistance having a chemical composition containing, by mass%, C: 0.015% or less, Si: 0.40% or more and 1.00% or less, Mn: 1.00% or less, P: 0.040% or less, S: 0.010% or less, Cr: 12.0% or more and 23.0% or less, N: 0.015% or less, Nb: 0.30% or more and 0.65% or less, Ti: 0.150% or less, Mo: 0.10% or less, W: 0.10% or less, Cu: less than 1.00%, Al: 0.20% or more and 1.00% or less, while the relationship Si≧Al is satisfied, and the balance being Fe and inevitable impurities. | 10-17-2013 |
Patent application number | Description | Published |
20090110945 | Adhesive and Laminate Prepared Using the Adhesive - It is an object of the invention to provide a carbodiimide modified polyolefin adhesive having excellent adhesive strength in a room temperature atmosphere and excellent adhesive strength in a high temperature atmosphere even in continuously molding with a practical molding machine. An adhesive (D), i.e., a carbodiimide modified polyolefin adhesive of the present invention which can solve the above problem is obtainable by allowing a polyolefin (A) having a group capable of reacting with a carbodiimide group to react with a carbodiimide group-containing compound (B) in the presence of an unmodified polyolefin (C) and having a ratio of a peak intensity at 2130 to 2140 cm | 04-30-2009 |
20090136774 | Resin Composition Comprising Olefinic Block polymer and Application Thereof - The present invention is to provide a resin composition excellent in mechanical properties and solvent resistance, and the resin composition (C) of the present invention comprises an polyolefin (A1) and an olefinic block polymer (A2), wherein the olefinic block polymer (A2) comprises, as a constitutional unit, a block (a) which is a polyolefin component and a block (b) which is a polymer unit composed of a vinyl monomer having a solubility parameter of from 18 to 25 J/m and the block (a) and the block (b) are bonded each other by a covalent bond. Moreover, another invention of the present invention is to provide a laminated structure having a laminated configuration in which a layer comprising an olefinic polymer layer and a layer comprising other synthetic resins, a metal and the like are strongly bonded through an adhesive layer, wherein the adhesive layer comprises the resin composition (C). | 05-28-2009 |
20090275700 | Propylene-Based Polymer Composition for Adhesive Use and Laminate Thereof - A propylene-based polymer composition for adhesive use and a laminate structure thereof are provided, wherein decrease of bonding strength is prevented when the laminate structure is formed and heat treatment is applied and whitening in bending process is suppressed. | 11-05-2009 |
20100173168 | Adhesive And Laminate Made With The Same - An object of the present invention is to provide polypropylene adhesive excellent in both initial adhesion and adhesion after heat history; and a laminate excellent in adhesion and heat resistance. Provided is a polypropylene-based adhesive having an MFR of 2.7 g/10 min or higher as measured at 230° C. under a load of 2.16 kg, comprising a composition which contains 5-95 parts by weight of (A) an isotactic polypropylene, 95-5 parts by weight of (B) a propylene/ethylene random copolymer, and 0-40 parts by weight of (C) an ethylene/propylene random copolymer, wherein 100 parts by weight of the composition is graft modified with 0.001-5 parts by weight of an unsaturated carboxylic acid and/or a derivative thereof, and wherein (B) is characterized by the following (i) to (iii): (i) the propylene/ethylene random copolymer (B) contains 60-90 mol % units derived from propylene and 10-40 mol % units derived from ethylene; (ii) the melting point (Tm) as measured with a differential scanning calorimeter is in the range of 40-120° C.; and (iii) the molecular weight distribution (Mw/Mn) as determined by gel permeation chromatography (GPC) is in the range of 1.0-3.0. | 07-08-2010 |
Patent application number | Description | Published |
20100022733 | (METH)ACRYLATE COPOLYMER FOR SYRUP AND RESIN COMPOSITION THEREOF - The present invention provides a copolymer for syrup, characterized by being formed from (A) 1 to 60 mass % of at least one (meth)acrylate compound selected from among a (meth)acrylate-modified silicone oil, an alkyl (meth)acrylate, a monoalkylene glycol (meth)acrylate, and a polyalkylene glycol (meth)acrylate, and (B) 99 to 40 mass % of a (meth)acrylate compound having a C≧6 alicyclic hydrocarbon group bonded thereto via an ester bond; a (meth)acrylate composition containing a (meth)acrylate monomer and 1 to 60 mass % of the (meth)acrylate copolymer for syrup; and a cured product of the composition. The (meth)acrylate copolymer for syrup of the present invention has excellent solubility, particularly in a (meth)acrylate compound having an alicyclic ester substituent, and a (meth)acrylate resin composition containing the copolymer provides a stable cured product having high transparency and high resistance to UW rays and heat. Thus, the cured product is suitably used as a material for lenses, illumination devices, automobiles, displays, optical-semiconductors, etc. | 01-28-2010 |
20100200795 | METHOD FOR PRODUCING LITHIUM ION CONDUCTIVE SOLID ELECTROLYTE - A method for producing a lithium ion conductive solid electrolyte including the step of bringing one or more compounds selected from phosphorous sulfide, germanium sulfide, silicon sulfide and boron sulfide into contact with lithium sulfide in a hydrocarbon-based solvent. | 08-12-2010 |
20100234527 | OPTICAL SEMICONDUCTOR ENCAPSULATING MATERIAL - The present invention provides a sealant material for an optical semiconductor containing (A) one or more kinds of a (meth)acrylic compound selected from a (meth)acrylate-modified silicone oil, a long chain alkyl (meth)acrylate, and a polylakylene glycol (meth)acrylate having the number average molecular weight of 400 or more, (B) a (meth)acrylate compound having an ester bond with an alicyclic hydrocarbon group having 6 or more carbon atoms, and (C) a radical polymerization initiator; and an optoelectronic conversion element and an optoelectronic conversion device using thereof. The sealant material for an optical semiconductor of the present invention provides a cured product having excellent characteristics in transparency, stability to UV light and heat, yellowing resistance, and adhesion performance, and thus may be suitably used as a sealant material for a light emitting element, a light receiving element and the like in an optical semiconductor device (semiconductor light emitting device), especially as a transparent sealant material for optical semiconductors such as LED and the like. | 09-16-2010 |
20120009484 | GLASS COMPRISING SOLID ELECTROLYTE PARTICLES AND LITHIUM BATTERY - Glass includes an aggregate of solid electrolyte particles including Li, P, and S, wherein when a Raman spectrum of the glass is repeatedly measured and a peak at 330 to 450 cm | 01-12-2012 |