Mess
Bjarne Mess, Copenhagen S DK
Patent application number | Description | Published |
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20130031464 | SYSTEM AND COMPUTER-IMPLEMENTED METHOD FOR INCORPORATING AN IMAGE INTO A PAGE OF CONTENT FOR TRANSMISSION OVER A TELECOMMUNICATIONS NETWORK - A system and method provide an image data file encoding said image in accordance with a standard image format and a page of content in a markup language, said page of content being intended for transmission over a telecommunications network from a server to a client for display by a browser running on the client, said page of content including a link or reference to the image data file for incorporating the image within the page of content. The image is converted from said standard image format into a format in which the image is encoded using said markup language, and the image encoded using said markup language is incorporated into the page of content to replace said link or reference to the image data file prior to transmission of the page of content. | 01-31-2013 |
Brigitte Mess, Muenster DE
Patent application number | Description | Published |
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20090001322 | Process for Preparing Alkoxypolyoxyalkylene (Meth) Acrylates - Process for preparing an alkoxypolyoxyalkylene (meth)acrylate in which | 01-01-2009 |
Francis Mess, Smyrna, GA US
Patent application number | Description | Published |
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20090026090 | METHOD AND APPARATUS FOR MEASURING PROPERTIES OF WEAK ELECTROLYTIC, ORGANIC FLUIDS SUCH AS HYDROCARBON-BASED FLUIDS - A method and system for determining chemical properties of a fluid. The method and system include providing a weak electrolyte fluid, a container for the fluid, a detection method performed by a device having at least two electrodes, a detection and amplification device coupled to the electrodes and a sensed current compared to an uncontaminated, base fluid or compared to data characteristic of fluid contaminated or chemically changed in order to monitor and characterize the fluid. | 01-29-2009 |
Helmut Mess, Kirtorf DE
Patent application number | Description | Published |
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20160006199 | Bus connector system for electrical equipment - The invention relates to a bus connector system having a bus circuit board for producing an electrical connection between electrical equipment, the bus circuit board being attached in a removable manner to a housing of the electrical equipment. | 01-07-2016 |
Leonard E. Mess, Boise, ID US
Patent application number | Description | Published |
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20090286356 | STACKED MASS STORAGE FLASH MEMORY PACKAGE - A semiconductor device is formed of two or more dice of similar dimensions and bond pad arrangement, in which bond pads are located in fields along less than three edges of the active surface of each die. A first die is attached to a substrate and subsequent die or dice are attached in a vertical sequence atop the first die, each in an offset configuration from the next lower die to expose the bond pads thereof for conductive bonding to metallization of the substrate. The multiple chip device permits a plurality of dice to be stacked in a high density low profile device. A particularly useful application is the formation of stacked mass storage flash memory package. | 11-19-2009 |
20100078793 | SEMICONDUCTOR DEVICE ASSEMBLIES, ELECTRONIC DEVICES INCLUDING THE SAME AND ASSEMBLY METHODS - A semiconductor device is formed of two or more dice of similar dimensions and bond pad arrangements, in which bond pads are located in fields along less than three edges of the active surface of each die. A first die is attached to a substrate and subsequent die or dice are attached in a vertical sequence atop the first die, each in an offset configuration from the next lower die to expose the bond pads thereof for conductive bonding to metallization of the substrate. The multiple chip device permits a plurality of dice to be stacked in a high-density low-profile device. A particularly useful application is the formation of stacked mass storage flash memory package. | 04-01-2010 |
20100148331 | SEMICONDUCTOR DEVICES INCLUDING SEMICONDUCTOR DICE IN LATERALLY OFFSET STACKED ARRANGEMENT - A semiconductor device assembly includes two or more dice stacked in laterally offset arrangement relative to one another. With such an arrangement, when a second semiconductor die is positioned over a first semiconductor die, bond pads of the first semiconductor die are exposed laterally beyond the second semiconductor die. The semiconductor dice of such an assembly may have similar dimensions and bond pad arrangements. In some embodiments the bond pads of each semiconductor die may be located on the active surface, along a single edge. The multiple chip device enables stacking of a plurality of semiconductor dice in a high density, low profile device. | 06-17-2010 |
Steven H. Mess, Franklin, WI US
Patent application number | Description | Published |
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20110117336 | Floor Marking Tape - A floor marking tape has a total thickness of 5-7 mil (0.127-0.178 mm) and consists of: | 05-19-2011 |
20110296727 | Enhanced Graphic, Anti-Slip Floor Signage - A floor sign comprises: | 12-08-2011 |