Patent application number | Description | Published |
20090302462 | Prepreg, Method for Manufacturing Prepreg, Substrate, and Semiconductor Device - A prepreg which can meet a demand for thickness reduction is provided. The prepreg has first and second resin layers having different applications, functions, capabilities, or properties, and allows an amount of a resin composition in each of the first and second resin layers to be set appropriately depending on a circuit wiring portion to be embedded into the second resin layer. Further, a method for manufacturing the above prepreg, and a substrate and a semiconductor device having the prepreg are also provided. The prepreg according to the present invention includes a core layer including a sheet-shaped base member and having one surface and the other surface which is opposite to the one surface, the first resin layer provided on the one surface of the core layer and formed of a first resin composition, and the second resin layer provided on the other surface of the core layer and formed of a second resin composition, wherein at least one of a requirement that a thickness of the first resin layer is different from that of the second resin layer and a requirement that a constitution of the first resin composition is different from that of the second resin composition is satisfied. | 12-10-2009 |
20100300619 | PREPREG, METHOD FOR MANUFACTURING PREPREG, SUBSTRATE, AND SEMICONDUCTOR DEVICE - A prepreg which can meet a demand for thickness reduction is provided. The prepreg has first and second resin layers having different applications, functions, capabilities, or properties, and allows an amount of a resin composition in each of the first and second resin layers to be set appropriately depending on a circuit wiring portion to be embedded into the second resin layer. Further, a method for manufacturing the above prepreg, and a substrate and a semiconductor device having the prepreg are also provided. The prepreg according to the present invention includes a core layer including a sheet-shaped base member and having one surface and the other surface which is opposite to the one surface, the first resin layer provided on the one surface of the core layer and formed of a first resin composition, and the second resin layer provided on the other surface of the core layer and formed of a second resin composition, wherein at least one of a requirement that a thickness of the first resin layer is different from that of the second resin layer and a requirement that a constitution of the first resin composition is different from that of the second resin composition is satisfied. | 12-02-2010 |
20110256367 | PREPREG, METHOD FOR MANUFACTURING PREPREG, SUBSTRATE, AND SEMICONDUCTOR DEVICE - A prepreg which can meet a demand for thickness reduction is provided. The prepreg has first and second resin layers having different applications, functions, capabilities, or properties, and allows an amount of a resin composition in each of the first and second resin layers to be set appropriately depending on a circuit wiring portion to be embedded into the second resin layer. Further, a method for manufacturing the above prepreg, and a substrate and a semiconductor device having the prepreg are also provided. The prepreg according to the present invention includes a core layer including a sheet-shaped base member and having one surface and the other surface which is opposite to the one surface, the first resin layer provided on the one surface of the core layer and formed of a first resin composition, and the second resin layer provided on the other surface of the core layer and formed of a second resin composition, wherein at least one of a requirement that a thickness of the first resin layer is different from that of the second resin layer and a requirement that a constitution of the first resin composition is different from that of the second resin composition is satisfied. | 10-20-2011 |
Patent application number | Description | Published |
20090108414 | WAFER - A wafer has a rare earth oxide layer disposed, typically sprayed, on a substrate. It is useful as a dummy wafer in a plasma etching or deposition system. | 04-30-2009 |
20090142605 | WAFER - A wafer has a rare earth fluoride coating disposed, typically sprayed on a substrate as an outermost layer, the rare earth fluoride being selected from lanthanoid fluorides, yttrium fluoride, and scandium fluoride. It is useful as a dummy wafer in a plasma etching or deposition system. | 06-04-2009 |
20090324916 | RARE EARTH OXIDE-CONTAINING SPRAYED PLATE AND MAKING METHOD - A rare earth oxide-containing sprayed plate is prepared by thermally spraying a rare earth oxide on a support to a thickness of up to 5 mm and peeling the sprayed coating from the support. Thin plates of rare earth oxide ceramics can be prepared without molding, firing and sintering steps. | 12-31-2009 |
20120088034 | WAFER - A wafer has a rare earth oxide layer disposed, typically sprayed, on a substrate. It is useful as a dummy wafer in a plasma etching or deposition system. | 04-12-2012 |
Patent application number | Description | Published |
20090285614 | IMAGE FORMING APPARATUS - By providing a rib formed to be inclined with respect to the conveyance direction on a guide member provided at the upstream side of the conveyance section where a contact member that cools rapidly the sheet subjected to fixing processing is provided, a problem of the occurrence of uneven gloss on the surface of a toner image by contact between a sheet and a guide member or a conveyance roller in a conveyance section that conveys the sheet subjected to fixing processing is solved. | 11-19-2009 |
20090304427 | IMAGE FORMING APPARATUS - An image forming apparatus includes: an image forming section for forming a toner image on a sheet; a fixing device for fixing the toner image on the sheet with heat; a reversal conveyance section which reverses a conveyance direction of the sheet which has passed through the fixing device; a conveyance member provided at the reversal conveyance section which is changed to be in either one of a conveyance state in which the conveyance member is in contact with an image supporting surface of the sheet, and to be in an evacuated state in which the conveyance member is separated from the image supporting surface of the sheet; and a switching mechanism for switching the conveyance member to be in one of the conveyance state and the evacuated state. | 12-10-2009 |
20110135354 | FIXING DEVICE AND IMAGE FORMING APPARATUS - Provided is an image forming apparatus having a fixing device for fixing an image at a nip portion formed of two rotary members which rotate while facing each other, wherein occurrence of uneven print gloss is prevented. The image forming apparatus having a fixing device for fixing an image at a nip portion formed of two rotary members which rotate while facing each other, wherein one of the two rotary members is a belt which rotates while being stretched around of a plurality of rollers, a roller arranged at the exit of the nip portion out of the plurality of rollers has a crown shape, and a slack absorbing member for absorbing a slack of both ends of the belt caused by the crown-shaped roller is in contact with the belt. | 06-09-2011 |