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20100238439 | SPECTROSCOPIC MODULE - The spectroscopy module | 09-23-2010 |
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20110299077 | SPECTROSCOPY MODULE - In a spectroscopy module | 12-08-2011 |
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20120187517 | PHOTODETECTOR - In a photodetector | 07-26-2012 |
20120276287 | SPECTROSCOPIC MODULE - In the spectroscopy module | 11-01-2012 |
20140104687 | PRODUCTION METHOD FOR OPTICAL COMPONENT AND OPTICAL COMPONENT - A method for manufacturing a light transmissive optical component, includes a first etching process of forming a depressed portion by applying etching to a silicon region of a plate-shaped member, a thermal oxidation process of forming a silicon oxide film by thermally oxidizing an inner side surface of the depressed portion, and a nitride film formation process of forming a silicon nitride film that covers the silicon oxide film. Accordingly, it is possible to realize a manufacturing method for an optical component which is capable of uniformly forming a silicon oxide film on a semi-transmissive reflecting surface which is largely inclined (or nearly vertical) with respect to a substrate surface, and an optical component produced by this method. | 04-17-2014 |
20140139924 | OPTICAL MODULE AND PRODUCTION METHOD FOR SAME - An optical module includes a first plate-shaped member having a light transmissive optical component which is formed by applying etching to a silicon region, and a second plate-shaped member having light reflective optical components (mirrors) for reflecting light transmitting through the light transmissive optical component. The first and second plate-shaped members are bonded to one another, and an optical path for light transmitting through the light transmissive optical component is along a component forming surface of the first plate-shaped member and a principal surface of the second plate-shaped member. Thereby, realizing an optical module in which it is possible to dispose the light reflective optical component and the light transmissive optical component close to one another, and a manufacturing method for the optical module. | 05-22-2014 |
20140263975 | LIGHT DETECTION DEVICE - A semiconductor light detection element includes a plurality of avalanche photodiodes operating in Geiger mode and formed in a semiconductor substrate, quenching resistors connected in series to the respective avalanche photodiodes and arranged on a first principal surface side of the semiconductor substrate, and a plurality of through-hole electrodes electrically connected to the quenching resistors and formed so as to penetrate the semiconductor substrate from the first principal surface side to a second principal surface side. A mounting substrate includes a plurality of electrodes arranged corresponding to the respective through-hole electrodes on a third principal surface side. The through-hole electrodes and the electrodes are electrically connected through bump electrodes, and a side surface of the semiconductor substrate and a side surface of a glass substrate are flush with each other. | 09-18-2014 |
20140291486 | LIGHT DETECTION DEVICE - A light detection device | 10-02-2014 |
20140327100 | LIGHT DETECTION DEVICE - A semiconductor light detection element has a plurality of channels, each of which consists of a photodiode array including a plurality of avalanche photodiodes operating in Geiger mode, quenching resistors connected in series to the respective avalanche photodiodes, and signal lines to which the quenching resistors are connected in parallel. A mounting substrate is configured so that a plurality of electrodes corresponding to the respective channels are arranged on a third principal surface side and so that a signal processing unit for processing output signals from the respective channels is arranged on a fourth principal surface side. In a semiconductor substrate, through-hole electrodes electrically connected to the signal lines are formed for the respective channels. The through-hole electrodes and the electrodes are electrically connected through bump electrodes. | 11-06-2014 |