Patent application number | Description | Published |
20100243459 | ELECTRODE FOR A CHARGE STORAGE DEVICE AND METHOD OF MANUFACTURE - An electrode for a charge storage device and a method for forming the electrode. The electrode comprises an electrode body having an essentially continuous phase of an active material, an essentially continuous phase of an electroconductive material, and an essentially continuous phase of void space. The active material is oxidized by applying a potential to the electrode body in the charge storage device so as to transform the active material to an oxide species thereof. The resulting oxide species of the active material has a higher active surface area than the active material prior to the oxidizing. | 09-30-2010 |
20110250512 | METAL-AIR ELECTROCHEMICAL CELL WITH HIGH ENERGY EFFICIENCY MODE - The present invention relates to a metal-air electrochemical cell with a high energy efficiency mode. | 10-13-2011 |
20130049694 | ELECTROCHEMICAL CELL, AND PARTICULARLY A CELL WITH ELECTRODEPOSITED FUEL - The present invention relates to a method for charging the cell by electrodeposition of metal fuel on the anode thereof | 02-28-2013 |
20130115525 | EXTERNAL PTFE LAYER REINFORCEMENT FOR OXIDANT ELECTRODE - An oxidant electrode for an electrochemical cell utilizing a fuel electrode comprising a metal fuel and a liquid ionically conductive medium configured to conduct ions between the fuel electrode and the oxidant electrode to support electrochemical reactions at the fuel and oxidant electrodes, includes an active layer configured to participate in electrochemical reactions with the fuel electrode. The oxidant electrode also includes a solvophobic layer between an oxidant-facing side of the oxidant electrode, and the active layer. The solvophobic layer is configured to prevent permeation of the liquid ionically conductive medium therethrough, but permit permeation of a gaseous oxidant therethrough. The oxidant electrode further includes a reinforcement layer at the oxidant-facing side, configured to prevent a distortion of the solvophobic layer therethrough, towards the oxidant-facing side. The reinforcement layer is permeable to the gaseous oxidant. | 05-09-2013 |
20130115526 | AIR CATHODE WITH GRAPHITE BONDING/BARRIER LAYER - An electrochemical cell includes a housing, a fuel electrode comprising a metal fuel; an oxidant electrode spaced from the fuel electrode, having fuel electrode and oxidant facing sides, and a liquid ionically conductive medium for conducting ions between the fuel and oxidant electrodes to support electrochemical reactions thereat. The fuel and oxidant electrodes are configured to, during discharge, oxidize the metal fuel at the fuel electrode and reduce a gaseous oxidant at the oxidant electrode to generate a discharge potential difference therebetween for application to a load. The oxidant electrode includes an active layer configured to participate in the electrochemical reactions, and a current collector electrically coupled to the active layer. The oxidant electrode further includes a graphite layer comprising a mixture of graphite particles and solvophobic binder, the graphite layer providing a surface thereof for exposure to a sealant that adheres the oxidant electrode to the housing. | 05-09-2013 |
20130115532 | INTERNAL CONVECTION CELL - An electrochemical cell includes a permeable fuel electrode configured to support a metal fuel thereon, and an oxidant reduction electrode spaced from the fuel electrode. An ionically conductive medium is provided for conducting ions between the fuel and oxidant reduction electrodes, to support electrochemical reactions at the fuel and oxidant reduction electrodes. A charging electrode is also included, selected from the group consisting of (a) the oxidant reduction electrode, (b) a separate charging electrode spaced from the fuel and oxidant reduction electrodes, and (c) a portion of the permeable fuel electrode. The charging electrode is configured to evolve gaseous oxygen bubbles that generate a flow of the ionically conductive medium. One or more flow diverters are also provided in the electrochemical cell, and configured to direct the flow of the ionically conductive medium at least partially through the permeable fuel electrode. | 05-09-2013 |
20140262760 | CONCAVE GAS VENT FOR ELECTROCHEMICAL CELL - The invention provides an electrochemical cell system comprising: a fuel electrode, an oxidant electrode for absorbing and reducing a gaseous oxidant, and an interior cell chamber configured to contain a volume of ionically conductive liquid therein. The ionically conductive liquid conducts ions between the fuel and oxidant electrodes. The oxidant electrode separates the ionically conductive liquid from the gaseous oxidant. A gas vent is configured to separate gas in the cell from a mist comprising the ionically conductive liquid and is positioned generally above the volume of ionically conductive liquid. The gas vent comprises a filter body portion comprised of at least one layer so as to absorb a portion of the ionically conductive liquid. The body portion is formed in a concave shape with an apex positioned towards the top of the cell in its upright orientation, and with body surfaces extending downwardly from said apex so as to drain absorbed ionically conductive medium back into the interior chamber. The body portion contains pores so as to permit permeation of the gas therethrough. | 09-18-2014 |
20150030941 | INTERNAL CONVECTION CELL - An electrochemical cell includes a permeable fuel electrode configured to support a metal fuel thereon, and an oxidant reduction electrode spaced from the fuel electrode. An ionically conductive medium is provided for conducting ions between the fuel and oxidant reduction electrodes, to support electrochemical reactions at the fuel and oxidant reduction electrodes. A charging electrode is also included, selected from the group consisting of (a) the oxidant reduction electrode, (b) a separate charging electrode spaced from the fuel and oxidant reduction electrodes, and (c) a portion of the permeable fuel electrode. The charging electrode is configured to evolve gaseous oxygen bubbles that generate a flow of the ionically conductive medium. One or more flow diverters are also provided in the electrochemical cell, and configured to direct the flow of the ionically conductive medium at least partially through the permeable fuel electrode. | 01-29-2015 |
Patent application number | Description | Published |
20090017342 | FUEL CELL WITH SWITCHING ELECTRODES - A fuel cell includes a fuel source, an oxidizer source, and a plurality of electrodes each having a surface provided with an electrolyte. Relative movement is permitted between the electrodes and the fuel and oxidizer sources such that, when the electrodes are coupled to a load, each electrode is switched between (a) an anode condition wherein the electrode communicates with the fuel source for oxidizing the fuel and conducting electrons from the oxidized fuel to the load, and (b) a cathode condition wherein the electrode communicates with the oxidizer source and receives electrons from the load for reducing the oxidizer. The fuel cell also includes a driver to affect the relative movement between the electrodes and the fuel and oxidizer sources so as to continuously switch the electrodes between the anode and cathode conditions. | 01-15-2009 |
20090284229 | Electrochemical cell, and particularly a cell with electrodeposited fuel - The present invention relates to a method for charging the cell by electrodeposition of metal fuel on the anode thereof. | 11-19-2009 |
20100119883 | FUEL CELL WITH TRANSPORT FLOW ACROSS GAP - The present invention relates to a fuel cell with a gap for transport flow of an electrolyte containing charge carrying ions from either a fuel or an oxidizer between anode and a cathode. | 05-13-2010 |
20100316935 | ELECTROCHEMICAL CELLS CONNECTED IN FLUID FLOW SERIES - An electrochemical cell system for generating electrical power is disclosed. The electrochemical cell system comprises a plurality of fluidly connected electrochemical cells. Each electrochemical cell comprises an anode and a cathode. The anode is configured to permit a fluid comprising at least an electrolyte to flow in contact therewith to oxidize a fuel. The cathode is permeable to an oxidizer and is configured to receive electrons to reduce the oxidizer. The cathode and the anode are spaced apart to define a gap therebetween for receiving the fluid flow. The plurality of electrochemical cells are connected in fluid flow series such that, for each pair of fluidly connected electrochemical cells, the fluid flows from a first cell of the pair of cells to a second cell of the pair of cells. The plurality of electrochemical cells are connected electrically in series such that, for each pair of fluidly connected electrochemical cells, the cathode of the first cell of the pair is electrically connected to the anode of the second cell of the pair. | 12-16-2010 |
20110039181 | Electrochemical cell, and particularly a metal fueled cell with non-parallel flow - The present invention relates to an electrochemical cell with a gap between an anode and a cathode for transport flow of an electrolyte containing charge carrying ions from a solid fuel and an oxidizer. | 02-17-2011 |
20120202127 | ELECTROCHEMICAL CELL SYSTEM WITH SHUNT CURRENT INTERRUPT - An electrochemical cell system is configured to utilize an ionically conductive medium flowing through a plurality of electrochemical cells. One or more disperser chambers are provided to disrupt or minimize electrical current flowing between the electrochemical cells, such as between the cathode of one cell and the anode of a subsequent cell by dispersing the ionically conductive medium. Air is introduced into the disperser chamber to prevent the formation of foamed ionically conductive medium, which may reconnect the dispersed ionically conductive medium, allowing the current to again flow therethrough. | 08-09-2012 |
20130001098 | METHOD AND APPARATUS FOR AMMONIA (NH3) GENERATION - Various apparatuses and methods for producing ammonia are provided. One embodiment has uses a plurality of environments and an electrode configured to be exposed to the plurality of environments. The electrode is configured to receive hydrogen while being exposed to one of the environments, reduce nitrogen while being exposed to another environment, and allow the hydrogen and nitrogen to react with each other to form ammonia. Other embodiments provide for simultaneous hydrogen oxidation and nitrogen reduction at the same electrode, which in turn react for formation of ammonia. | 01-03-2013 |
Patent application number | Description | Published |
20080213770 | Method of Determining The Nucleotide Sequence of Oligonucleotides and DNA Molecules - The present invention relates to a novel method for analyzing nucleic acid sequences based on real-time detection of DNA polymerase-catalyzed incorporation of each of the four nucleotide bases, supplied individually and serially in a microfluidic system, to a reaction cell containing a template system comprising a DNA fragment of unknown sequence and an oligonucleotide primer. Incorporation of a nucleotide base into the template system can be detected by any of a variety of methods including but not limited to fluorescence and chemiluminescence detection. Alternatively, microcalorimetic detection of the heat generated by the incorporation of a nucleotide into the extending template system using thermopile, thermistor and refractive index measurements can be used to detect extension reactions. | 09-04-2008 |
20080213853 | Magnetofluidics - Magnetofluidic systems and techniques. In one aspect, a magnetofluidic device includes a superhydrophobic surface and a fluid sample in physical contact with the superhydrophobic surface, the fluid sample comprising a collection of particles coated with a passivating layer. The particles are magnetically active in that they respond to an applied magnetic field. | 09-04-2008 |
20100209922 | METHOD OF DETERMINING THE NUCLEOTIDE SEQUENCE OF OLIGONUCLEOTIDES AND DNA MOLECULES - The present invention relates to a novel method for analyzing nucleic acid sequences based on real-time detection of DNA polymerase-catalyzed incorporation of each of the four nucleotide bases, supplied individually and serially in a microfluidic system, to a reaction cell containing a template system comprising a DNA fragment of unknown sequence and an oligonucleotide primer. Incorporation of a nucleotide base into the template system can be detected by any of a variety of methods including but not limited to fluorescence and chemiluminescence detection. Alternatively, microcalorimetic detection of the heat generated by the incorporation of a nucleotide into the extending template system using thermopile, thermistor and refractive index measurements can be used to detect extension reactions. | 08-19-2010 |
20110183321 | METHOD OF DETERMINING THE NUCLEOTIDE SEQUENCE OF OLIGONUCLEOTIDES AND DNA MOLECULES - The present invention relates to a novel method for analyzing nucleic acid sequences based on real-time detection of DNA polymerase-catalyzed incorporation of each of the four nucleotide bases, supplied individually and serially in a microfluidic system, to a reaction cell containing a template system comprising a DNA fragment of unknown sequence and an oligonucleotide primer. Incorporation of a nucleotide base into the template system can be detected by any of a variety of methods including but not limited to fluorescence and chemiluminescence detection. Alternatively, microcalorimetic detection of the heat generated by the incorporation of a nucleotide into the extending template system using thermopile, thermistor and refractive index measurements can be used to detect extension reactions. | 07-28-2011 |
20110183322 | METHOD OF DETERMINING THE NUCLEOTIDE SEQUENCE OF OLIGONUCLEOTIDES AND DNA MOLECULES - The present invention relates to a novel method for analyzing nucleic acid sequences based on real-time detection of DNA polymerase-catalyzed incorporation of each of the four nucleotide bases, supplied individually and serially in a microfluidic system, to a reaction cell containing a template system comprising a DNA fragment of unknown sequence and an oligonucleotide primer. Incorporation of a nucleotide base into the template system can be detected by any of a variety of methods including but not limited to fluorescence and chemiluminescence detection. Alternatively, microcalorimetic detection of the heat generated by the incorporation of a nucleotide into the extending template system using thermopile, thermistor and refractive index measurements can be used to detect extension reactions. | 07-28-2011 |
20110183323 | METHOD OF DETERMINING THE NUCLEOTIDE SEQUENCE OF OLIGONUCLEOTIDES AND DNA MOLECULES - The present invention relates to a novel method for analyzing nucleic acid sequences based on real-time detection of DNA polymerase-catalyzed incorporation of each of the four nucleotide bases, supplied individually and serially in a microfluidic system, to a reaction cell containing a template system comprising a DNA fragment of unknown sequence and an oligonucleotide primer. Incorporation of a nucleotide base into the template system can be detected by any of a variety of methods including but not limited to fluorescence and chemiluminescence detection. Alternatively, microcalorimetic detection of the heat generated by the incorporation of a nucleotide into the extending template system using thermopile, thermistor and refractive index measurements can be used to detect extension reactions. | 07-28-2011 |
20110201511 | SYSTEM AND METHOD FOR AUTOMATED BIOPARTICLE RECOGNITION - The invention relates to a method for identifying the source of shed bioparticles and an apparatus that implements the method. The method involves collecting a sample of bioparticles from the environment, selecting from that sample the bioparticles most effective in identifying their source, and gathering data from those bioparticles to form bioparticle signatures. The bioparticle signatures are then processed into a multi-dimensional vector which is then compared to the multi-dimensional vector derived from a standard using a pattern recognition strategy that identifies the source. The apparatus has a particle collection device to collect the sample, a transfer device that selects information-rich bioparticles and a detector that restricts the movement of the information-rich bioparticles. The restricted movement is then translated into a bioparticle signature. | 08-18-2011 |
20110294115 | METHOD OF DETERMINING THE NUCLEOTIDE SEQUENCE OF OLIGONUCLEOTIDES AND DNA MOLECULES - The present invention relates to a novel method for analyzing nucleic acid sequences based on real-time detection of DNA polymerase-catalyzed incorporation of each of the four nucleotide bases, supplied individually and serially in a microfluidic system, to a reaction cell containing a template system comprising a DNA fragment of unknown sequence and an oligonucleotide primer. Incorporation of a nucleotide base into the template system can be detected by any of a variety of methods including but not limited to fluorescence and chemiluminescence detection. Alternatively, microcalorimetic detection of the heat generated by the incorporation of a nucleotide into the extending template system using thermopile, thermistor and refractive index measurements can be used to detect extension reactions. | 12-01-2011 |
20120015353 | METHOD OF DETERMINING THE NUCLEOTIDE SEQUENCE OF OLIGONUCLEOTIDES AND DNA MOLECULES - The present invention relates to a novel method for analyzing nucleic acid sequences based on real-time detection of DNA polymerase-catalyzed incorporation of each of the four nucleotide bases, supplied individually and serially in a microfluidic system, to a reaction cell containing a template system comprising a DNA fragment of unknown sequence and an oligonucleotide primer. Incorporation of a nucleotide base into the template system can be detected by any of a variety of methods including but not limited to fluorescence and chemiluminescence detection. Alternatively, microcalorimetic detection of the heat generated by the incorporation of a nucleotide into the extending template system using thermopile, thermistor and refractive index measurements can be used to detect extension reactions. | 01-19-2012 |
20120258449 | METHOD OF DETERMINING THE NUCLEOTIDE SEQUENCE OF OLIGONUCLEOTIDES AND DNA MOLECULES - The present invention relates to a novel method for analyzing nucleic acid sequences based on real-time detection of DNA polymerase-catalyzed incorporation of each of the four nucleotide bases, supplied individually and serially in a microfluidic system, to a reaction cell containing a template system comprising a DNA fragment of unknown sequence and an oligonucleotide primer. Incorporation of a nucleotide base into the template system can be detected by any of a variety of methods including but not limited to fluorescence and chemiluminescence detection. Alternatively, microcalorimetic detection of the heat generated by the incorporation of a nucleotide into the extending template system using thermopile, thermistor and refractive index measurements can be used to detect extension reactions. | 10-11-2012 |
20130288235 | METHOD OF DETERMINING THE NUCLEOTIDE SEQUENCE OF OLIGONUCLEOTIDES AND DNA MOLECULES - The present invention relates to a novel method for analyzing nucleic acid sequences based on real-time detection of DNA polymerase-catalyzed incorporation of each of the four nucleotide bases, supplied individually and serially in a microfluidic system, to a reaction cell containing a template system comprising a DNA fragment of unknown sequence and an oligonucleotide primer. Incorporation of a nucleotide base into the template system can be detected by any of a variety of methods including but not limited to fluorescence and chemiluminescence detection. Alternatively, microcalorimetic detection of the heat generated by the incorporation of a nucleotide into the extending template system using thermopile, thermistor and refractive index measurements can be used to detect extension reactions. | 10-31-2013 |
20130295560 | METHOD OF DETERMINING THE NUCLEOTIDE SEQUENCE OF OLIGONUCLEOTIDES AND DNA MOLECULES - The present invention relates to a novel method for analyzing nucleic acid sequences based on real-time detection of DNA polymerase-catalyzed incorporation of each of the four nucleotide bases, supplied individually and serially in a microfluidic system, to a reaction cell containing a template system comprising a DNA fragment of unknown sequence and an oligonucleotide primer. Incorporation of a nucleotide base into the template system can be detected by any of a variety of methods including but not limited to fluorescence and chemiluminescence detection. Alternatively, microcalorimetic detection of the heat generated by the incorporation of a nucleotide into the extending template system using thermopile, thermistor and refractive index measurements can be used to detect extension reactions. | 11-07-2013 |
20140371102 | SYSTEM AND METHOD FOR AUTOMATED BIOPARTICLE RECOGNITION - Disclosed are embodiments of methods, apparatus, systems, compositions, and articles of manufacture relating to identifying the source of bioparticles, such as bioparticles shed by an organism. In embodiments, a method may include collecting a sample of bioparticles from the environment, selecting from that sample the bioparticles most informative for identifying their source, and gathering data from those bioparticles to form bioparticle signatures; the bioparticle signatures may be processed into a multi-dimensional vector which may be compared to a multi-dimensional vector derived from a standard using a pattern recognition strategy. In embodiments, an apparatus may include a particle collection device to collect a sample, a transfer device to select bioparticles, and a detector that restricts the movement of the bioparticles; the restricted movement may be used to produce a bioparticle signature. | 12-18-2014 |
Patent application number | Description | Published |
20090243629 | METHOD AND APPARATUS FOR MINI MODULE EMI SHIELDING EVALUATION - A method for mini module EMI shielding effectiveness evaluation comprises providing a test vehicle including at least one test platform. The test platform includes at least one mini emitter, a mini receiver with a reference shield, and a mini receiver with a shield under test. EMI shielding effectiveness transmission signals are applied to the at least one mini emitter. Signals received by the mini receiver with a shield under test and the mini receiver with the reference shield are evaluated. The mini emitter, mini receiver with the reference shield, and mini receiver with the shield under test comprise components fabricated concurrently and under fabrication conditions used for fabrication of the test platform of the test vehicle. As used herein, a mini emitter and mini receiver may be interchanged according to the requirements of a given EMI shielding effectiveness evaluation. | 10-01-2009 |
20100006988 | Integrated Conformal Shielding Method and Process Using Redistributed Chip Packaging - An integrated conformal electromagnetic interference (EMI) and/or electromagnetic radiation shield is formed on a plurality of encapsulated modules by attaching a plurality of modules ( | 01-14-2010 |
20100148357 | METHOD OF PACKAGING INTEGRATED CIRCUIT DIES WITH THERMAL DISSIPATION CAPABILITY | 06-17-2010 |
20110119910 | METHOD AND SYSTEM FOR RELEASING A MICROELECTRONIC ASSEMBLY FROM A CARRIER SUBSTRATE - Methods and system for forming a microelectronic assembly ( | 05-26-2011 |
20110217814 | METHOD FOR SINGULATING ELECTRONIC COMPONENTS FROM A SUBSTRATE - Methods for forming electronic assemblies are provided. A device substrate having a plurality of electronic components embedded therein is provided. The device substrate is attached to a carrier substrate using an adhesive material. A plurality of cuts are formed through the device substrate to divide the device substrate into a plurality of portions. Each of the plurality of portions includes at least one of the electronic components. A force is applied to each of the plurality of portions in a direction away from the carrier substrate to remove the plurality of portions from the carrier substrate. | 09-08-2011 |
20110241181 | SEMICONDUCTOR DEVICE WITH A CONTROLLED CAVITY AND METHOD OF FORMATION - A semiconductor device includes a first cap wafer having a first opening extending through the first cap wafer, and a second cap wafer bonded to the first cap wafer, wherein the second cap wafer has a second opening extending through the second cap wafer, and wherein the first opening is misaligned with respect to the second opening. The second cap wafer is bonded to a device wafer, wherein a cavity is formed between the device wafer and the second cap wafer, and wherein the device wafer comprises at least one semiconductor device in the cavity. A vacuum sealing layer is formed over the first cap wafer, wherein the sealing layer vacuum seals the first opening. | 10-06-2011 |
20120021565 | METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE - A method is used to form a packaged semiconductor device. A semiconductor device, which has an active surface, is placed in an opening of a circuit board. The circuit board has a first major surface and a second major surface having the opening, first vias that extend between the first major surface and the second major surface, first contact pads terminating the vias at the first major surface, and second contact pads terminating the vias at the second major surface. A dielectric layer is applied over the semiconductor device and the second major surface of the circuit board. An interconnect layer is formed over the dielectric layer. The interconnect layer has second vias electrically connected to the second contact pads, third vias that are electrically connected to the active surface of the semiconductor device, an exposed surface, and third contact pads at the exposed surface. | 01-26-2012 |
20130015566 | APPARATUS AND METHODS FOR QUAD FLAT NO LEAD PACKAGINGAANM GONG; ZHIWEIAACI ChandlerAAST AZAACO USAAGP GONG; ZHIWEI Chandler AZ USAANM Xu; JianwenAACI San DiegoAAST CAAACO USAAGP Xu; Jianwen San Diego CA USAANM Gao; WeiAACO USAAGP Gao; Wei USAANM Hayes; Scott M.AACI ChandlerAAST AZAACO USAAGP Hayes; Scott M. Chandler AZ US - A method for fabricating a semiconductor package is disclosed that includes providing a supply of lead elements, mounting a plurality of the lead elements on a lead frame until a predetermined number of lead elements are placed on the lead frame, and connecting other components on the lead frame to the lead elements. | 01-17-2013 |
20130049217 | SEMICONDUCTOR DEVICE PACKAGING HAVING PRE-ENCAPSULATION THROUGH VIA FORMATION USING DROP-IN SIGNAL CONDUITS - A semiconductor device package having pre-formed and placed through vias and a process for making such a package is provided. One or more signal conduits are placed in a holder that is subsequently embedded in an encapsulated semiconductor device package. The ends of the signal conduits are exposed and the signal conduits are then used as through package vias, providing signal-bearing pathways between interconnects or contacts on the bottom and top of the package. Holders can be provided in a variety of geometries and materials, depending upon the nature of the application. Further, multiple holders with signal conduits can be provided in a single package to provide for more complex interconnect configuration demands in, for example, system-in-a-package applications. | 02-28-2013 |
20130049218 | SEMICONDUCTOR DEVICE PACKAGING HAVING PRE-ENCAPSULATION THROUGH VIA FORMATION - A method for forming signal conduits before encapsulation for incorporation as through vias in a semiconductor device package is provided. One or more signal conduits are formed through photolithography and metal deposition on a metal film or substrate. After removing photoresistive material, the semiconductor device package is built by encapsulating the signal conduits along with any semiconductor die and other parts of the package. The ends of the signal conduits are exposed and the signal conduits can then be used as through vias, providing signal-bearing pathways between interconnects or contacts on the bottom and top of the package, and electrical contacts of the semiconductor die. Using this method, signal conduits can be provided in a variety of geometric placings in the semiconductor device package. A semiconductor device package including the signal conduits made from the above method is also provided. | 02-28-2013 |
20130052777 | BACK SIDE ALIGNMENT STRUCTURE AND MANUFACTURING METHOD FOR THREE-DIMENSIONAL SEMICONDUCTOR DEVICE PACKAGES - A mechanism for accurate alignment of semiconductor package back side interconnect processing is provided. As semiconductor die are placed in position for an encapsulated panel, two or more alignment die having fiducial markings formed on the back, or non-active, side of those die are also placed in the panel. Once all the die and other components have been placed for the panel, the panel is encapsulated using an encapsulant. Excess encapsulant, if any, is removed by a process such as backgrinding. The back grinding process exposes the back side of the alignment die and the fiducial features on those alignment die. The fiducial features on the alignment die can then be used for alignment of backside processing operations on the panel. | 02-28-2013 |
20130078753 | CAPPED DEVICE INTERCONNECT IN A SEMICONDUCTOR PACKAGE - A method for fabricating a thin package that encapsulates a capped MEMS device electrically coupled with one or more encapsulated semiconductor devices is provided. A wafer-level packaging methodology is used in which the capped MEMS device is electrically coupled to a package interconnect, which then allows for electrical coupling to the one or more encapsulated semiconductor devices, as well as external connections. | 03-28-2013 |
20130127030 | SEMICONDUCTOR DEVICE PACKAGING HAVING SUBSTRATE WITH PRE-ENCAPSULATION THROUGH VIA FORMATION - A method for forming through vias in a semiconductor device package prior to package encapsulation is provided. One or more signal conduits are formed through photolithography and metal deposition on a printed circuit substrate having interconnect pads. After removing photoresistive material, the semiconductor device package is built by encapsulating the signal conduits along with any semiconductor die, wire bonding, and other parts of the package. Free ends of each signal conduit are exposed and the signal conduits are used as through vias to provide signal-bearing pathways between connections from a top-mounted package to a printed circuit substrate interconnect and electrical contacts of the semiconductor die or package contacts. Using this method, signal conduits can be provided in a variety of geometric placings on the printed circuit substrate for inclusion in a semiconductor device package. A semiconductor device package incorporating the pre-fabricated through vias is also provided. | 05-23-2013 |
20130154091 | SEMICONDUCTOR DEVICE PACKAGING USING ENCAPSULATED CONDUCTIVE BALLS FOR PACKAGE-ON-PACKAGE BACK SIDE COUPLING - A semiconductor device package having an embedded three-dimensional interconnect structure and a process for making such a package is provided. One or more ball conductors are attached to a major surface of a substrate that provides at least an electrical conduit from the ball conductor to an opposite major surface of the substrate. The substrate can also provide an interconnect between solder balls. The combination of solder balls and substrate is encapsulated in the semiconductor device package. The ends of the signal conduits are exposed on one major surface of the device package, while a portion of the ball conductors is exposed on the opposite major surface of the device package. The ball conductors and signal conduits provide signal-bearing pathways between the major surfaces of the package. Contacts created by the back grinded ball conductors are used to form a package-on-package structure by coupling with contacts from another package. | 06-20-2013 |
20140048946 | SENSOR PACKAGES AND METHOD OF PACKAGING DIES OF VARIOUS SIZES | 02-20-2014 |
20140054783 | STACKED MICROELECTRONIC PACKAGES HAVING SIDEWALL CONDUCTORS AND METHODS FOR THE FABRICATION THEREOF - Methods for fabricating stacked microelectronic packages are provided, as are embodiments of a stacked microelectronic package. In one embodiment, the method includes arranging a plurality of microelectronic device panels in a panel stack. Each microelectronic device panel contains plurality of microelectronic devices and a plurality of package edge conductors extending therefrom. Trenches are created in the panel stack exposing the plurality of package edge conductors, and a plurality of sidewall conductors is formed interconnecting different ones of the package edge conductors exposed through the trenches. The panel stack is then separated into a plurality of stacked microelectronic packages each including at least two microelectronic devices electrically interconnected by at least one of the plurality of sidewall conductors included within the stacked microelectronic package. | 02-27-2014 |
20140054796 | STACKED MICROELECTRONIC PACKAGES HAVING PATTERENED SIDEWALL CONDUCTORS AND METHODS FOR THE FABRICATION THEREOF - Embodiments of a method for fabricating stacked microelectronic packages are provided, as are embodiments of a stacked microelectronic package. In one embodiment, the method includes arranging microelectronic device panels in a panel stack. Each microelectronic device panel includes a plurality of microelectronic devices and a plurality of package edge conductors extending therefrom. Trenches are formed in the panel stack exposing the plurality of package edge conductors. An electrically-conductive material is deposited into the trenches and contacts the plurality of package edge conductors exposed therethrough. The panel stack is then separated into partially-completed stacked microelectronic packages. For at least one of the partially-completed stacked microelectronic packages, selected portions of the electrically-conductive material are removed to define a plurality of patterned sidewall conductors interconnecting the microelectronic devices included within the stacked microelectronic package. | 02-27-2014 |
20140054797 | STACKED MICROELECTRONIC PACKAGES HAVING SIDEWALL CONDUCTORS AND METHODS FOR THE FABRICATION THEREOF - Embodiments of a method for fabricating stacked microelectronic packages are provided, as are embodiments of stacked microelectronic packages. In one embodiment, the method includes producing a partially-completed stacked microelectronic package including a package body having a vertical package sidewall, a plurality microelectronic devices embedded within the package body, and package edge conductors electrically coupled to the plurality of microelectronic devices and extending to the vertical package sidewall. A flowable conductive material is applied on the vertical package sidewall and contacts the package edge conductors. Selected portions of the flowable conductive material are then removed to define, at least in part, electrically-isolated sidewall conductors electrically coupled to different ones of the package edge conductors. | 02-27-2014 |
20140070397 | HIGH POWER SEMICONDUCTOR PACKAGE SUBSYSTEMS - A method and apparatus for incorporation of high power device dies into smaller system packages by embedding metal “coins” having high thermal conductivity into package substrates, or printed circuit boards, and coupling the power device dies onto the metal coins is provided. In one embodiment, the power device die can be attached to an already embedded metal coin in the package substrate or PCB. The power device die can be directly coupled to the embedded metal coin or the power device die can be attached to a metallic interposer which is then bonded to the embedded metal coin. In another embodiment, the die can be attached to the metal coin and then the PCB or package substrate can be assembled to incorporate the copper coin. Active dies are coupled to each other either through wire bonds or other passive components, or using a built-up interconnect. | 03-13-2014 |
20140070415 | MICROELECTRONIC PACKAGES HAVING TRENCH VIAS AND METHODS FOR THE MANUFACTURE THEREOF - Embodiments of a microelectronic package including at least one trench via are provided, as are embodiments of a method for fabricating such a microelectronic package. In one embodiment, the method includes the step of depositing a dielectric layer over a first microelectronic device having a plurality of contact pads, which are covered by the dielectric layer. A trench via is formed in the dielectric layer to expose the plurality of contact pads therethrough. The trench via is formed to include opposing crenulated sidewalls having a plurality of recesses therein. The plurality of contact pads exposed through the trench via are then sputter etched. A plurality of interconnect lines is formed over the dielectric layer, each of which is electrically coupled to a different one of the plurality of contact pads. | 03-13-2014 |
20140369015 | WARP COMPENSATED ELECTRONIC ASSEMBLIES - An electronic panel assembly (EPA) includes one or more electronic devices with primary faces having electrical contacts, opposed rear faces and edges therebetween. The devices are mounted primary faces down in openings in a warp control sheet (WCS). Cured plastic encapsulation is formed at least between lateral edges of the devices and WCS openings. Undesirable panel warping during encapsulation is mitigated by choosing the WCS coefficient of thermal expansion (CTE) to be less than the encapsulation CTE. Thin film insulators and conductors couple electrical contacts on various devices to each other and to external terminals, thereby forming an integrated multi-device EPA. | 12-18-2014 |