Patent application number | Description | Published |
20110100815 | GAS SENSOR - A gas sensor having a sensor element including: a plate-shaped solid electrolyte body; and a pair of electrodes sandwiching the electrolyte body. The electrodes include a measurement electrode portion, and a standard electrode portion disposed in an inner portion of the sensor element. A lead portion, which extends along the surface of the solid electrolyte body, is connected to the standard electrode portion. The standard electrode portion is mainly formed with a precious metal and contains a ceramic. The lead portion is mainly formed of a precious metal and has a ceramic content smaller than the standard electrode portion. A porous portion, which extends to the inner portion of the sensor element along the surface of the solid electrolyte body, has a gas permeability higher than the lead portion, is mainly formed with a ceramic, and is connected to the standard electrode portion. | 05-05-2011 |
20110290015 | GAS-CONCENTRATION/HUMIDITY DETECTION APPARATUS - A sensor control apparatus ( | 12-01-2011 |
20120273369 | GAS SENSOR APPARATUS AND METHOD FOR CONTROLLING THE SAME - When a detection signal obtained from the cell of a gas sensor (S | 11-01-2012 |
20120325662 | OXYGEN SENSOR CONTROL APPARATUS - In an oxygen sensor control apparatus, a CPU obtains a correction coefficient for calibrating the relation between output value of an oxygen sensor and oxygen concentration when a fuel cut operation is performed. When the amount of scavenging air (total supply amount of air) becomes equal to or greater than a predetermined amount in each fuel cut period, the CPU calculates an average output value Ipav from a plurality of output values (concentration corresponding values) Ipr of the oxygen sensor, from which values deviating from a predetermined range R | 12-27-2012 |
20130180853 | GAS SENSOR PROCESSING APPARATUS - A gas sensor processing apparatus ( | 07-18-2013 |
20140367546 | VIBRATION DAMPING DEVICE - A vibration damping device including: an inner shaft member; a main rubber elastic body fixed to an outer circumference surface of the inner shaft member; and an outer bracket attached to an outer circumference surface of the main rubber elastic body. At least one locking projection formed to an inner circumference surface on a bracket main unit provided to the outer bracket is inserted and locked in a circumference direction in at least one locking groove formed on the outer circumference surface of the main rubber elastic body. The main rubber elastic body is held between axially opposed surfaces of an abutting protruding part formed on one axial end of the bracket main unit and a retaining protruding part formed on a press fit metal fitting press fit and fixed to another axial end of the bracket main unit. | 12-18-2014 |
Patent application number | Description | Published |
20090173630 | GAS SENSOR ELEMENT AND GAS SENSOR - A gas sensor element for detecting a specific gas component contained in a gas to be measured includes: a solid electrolyte layer; a first electrode disposed on the solid electrolyte layer; a second electrode disposed on the solid electrolyte layer; and a porous layer disposed on one of the first electrode and the second electrode such that the gas to be measured is introduced from the outside of said gas sensor element and passes through the porous layer to at least one of the first electrode and the second electrode. The porous layer includes: a first porous layer including a first ceramic porous body which does not include noble metal particles dispersed therein; and a second porous layer provided on the first porous layer and including a second ceramic porous body and noble metal particles dispersed therein. | 07-09-2009 |
20100000293 | GAS SENSOR - A gas sensor including: a gas sensing element including first and second ceramic layers. The first ceramic layer has a first through hole and a first through hole conductor covering an inner surface thereof The first ceramic layer includes a first conductor which includes: a first peripheral conductive portion electrically connected to the first through hole conductor; a first lead portion that is narrower than the first peripheral conductive portion; and a first contact conductive portion that is wider than the first lead portion. The first peripheral conductive portion, the first lead portion and the first contact conductive portion are integrally formed and arranged in this order in a longitudinal direction. The second ceramic layer includes a second conductor electrically connected to at least the first contact conductive portion. | 01-07-2010 |
20110214988 | GAS SENSOR ELEMENT, GAS SENSOR AND CONTROL SYSTEM OF GAS SENSOR - In order to compensate for variation in output of sensor elements | 09-08-2011 |
20120141662 | CONDUCTOR PATTERN FORMING METHOD - There is provided a method for forming a conductor pattern on a substrate in such a manner that the conductor pattern has a lead portion extending in a longitudinal direction thereof, a first conductor portion located at one end of the lead portion and a second conductor portion located at the other end of the lead portion, including a printing step of printing at least the lead portion by ink-jet printing process, i.e., scanning a print head while discharging liquid ink drops from nozzles of the prink head, wherein the scanning of the print head is performed in the longitudinal direction of the conductor pattern during the printing step; and wherein the length of each of the first and second conductor portions in a direction perpendicular to the longitudinal direction of the conductor pattern is larger than the diameter of the ink drop. | 06-07-2012 |
20120154494 | CONDUCTOR PATTERN PRINTING INK - There is provided an ink for printing a conductor pattern on a substrate, including platinum particles, wherein 70% or more of the platinum particles have a particle size of 0.05 to 0.5 μm. Even when the viscosity of the printing ink is controlled to a relatively low level for use in ink-jet printing process, it is possible by such particle size distribution control to prevent sedimentation of the platinum particles and excessive shrinkage of the conductor pattern due to sintering of the platinum particles during firing so that the conductor pattern can attain improved conduction characteristics. | 06-21-2012 |
20120154499 | CONDUCTOR FORMING METHOD - There is provided a method for forming a conductor, including a first printing step of printing a contour part of the conductor with a first printing ink, a drying step of drying the printed contour part, and a second printing step of printing a remaining part of the conductor with a second printing ink, wherein the second printing ink contains a conductive material and has a surface tension lower than or equal to a surface tension of the first printing ink. | 06-21-2012 |
20120196096 | INK - An ink contains at least a first solid particle, and a second solid particle formed of a base material of a different main component from that of the first solid particle. The first solid particle and the second solid particle have zeta potentials of the same polarity, or zeta potentials of 0±5 mV. The first and second solid particles in the ink have the same surface property, specifically the same interface property in the ink. This makes it possible to use a common dispersant suited for adsorption on the first and second solid particles. In this way, more than one kind of solid particle can be stably dispersed using a sole kind of dispersant. | 08-02-2012 |
20130032480 | GAS SENSOR - A gas sensor ( | 02-07-2013 |
Patent application number | Description | Published |
20090283895 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device including a metal frame having a penetrating opening; a semiconductor chip provided in the opening; an insulating layer provided on the upper surface of the metal frame such that the insulating layer covers the upper surface, which is the circuit-formed surface of the semiconductor chip; an interconnect layer provided only on the upper-surface side of the metal frame with intervention of the insulating material and electrically connected to a circuit of the semiconductor chip; a via conductor provided on the upper surface of said semiconductor chip to electrically connect the circuit of the semiconductor chip and the interconnect layer; and a resin layer provided on the lower surface of the metal frame. | 11-19-2009 |
20110215478 | SEMICONDUCTOR ELEMENT-EMBEDDED WIRING SUBSTRATE - In a wiring substrate containing a semiconductor element, the wiring substrate includes a supporting substrate; a semiconductor element provided on the supporting substrate; a peripheral insulating layer covering at least an outer circumferential side surface of the semiconductor element; and upper surface-side wiring provided on the upper surface side of the wiring substrate. The semiconductor element includes a semiconductor substrate; a first wiring-structure layer including first wiring and a first insulating layer alternately formed on the semiconductor substrate; and a second wiring-structure layer including second wiring and a second insulating layer alternately formed on the first wiring-structure layer. The upper surface-side wiring includes fan-out wiring led out from immediately above the semiconductor element to a peripheral region external to an outer edge of the semiconductor element. The fan-out wiring is electrically connected to the first wiring through the second wiring. The second wiring is thicker than the first wiring but thinner than the upper surface-side wiring. The second insulating layer is formed of a resin material and is thicker than the first insulating layer. | 09-08-2011 |
20120300425 | FUNCTIONAL ELEMENT BUILT-IN SUBSTRATE AND WIRING SUBSTRATE - An object of the present invention is to propose a functional element built-in substrate which enables an electrode terminal of a functional element to be well connected to the back surface on the side opposite to the electrode terminal of the functional element, and which can be miniaturized. According to the present invention, there is provided a functional element built-in substrate including a functional element provided with an electrode terminal on one surface side of the functional element, and a wiring substrate including a laminated structure in which the functional element is embedded so that the electrode terminal of the functional element faces the front surface side of the structure, and which is formed at least in a side surface region of the functional element by laminating a plurality of wiring insulating layers each including a wiring, the functional element built-in substrate being featured in that the electrode terminal and the back surface side of the wiring substrate are electrically connected to each other through the wiring of the laminated structure, and in that, in a pair of the wiring insulating layers included in the laminated structure and that are in contact with each other, the cross-sectional shape of the wiring in each of the wiring insulating layers, which cross-sectional shape is taken along the plane perpendicular to the extension direction of the wiring in the wiring insulating layer, has a relationship that the cross-sectional area of the wiring in the back surface side wiring insulating layer is larger than the cross-sectional area of the wiring in the front surface side wiring insulating layer. | 11-29-2012 |
20130009325 | SEMICONDUCTOR ELEMENT-EMBEDDED SUBSTRATE, AND METHOD OF MANUFACTURING THE SUBSTRATE - A semiconductor element-embedded substrate includes a semiconductor element; a chip component; a peripheral insulating layer covering at least the outer circumferential side surfaces thereof; an upper surface-side wiring line provided on the upper surface side of the substrate; and a lower surface-side wiring line provided on the lower surface side of the substrate. The built-in semiconductor element includes a terminal on the upper surface side thereof, and this terminal is electrically connected to the upper surface-side wiring line. The built-in chip component includes an upper surface-side terminal electrically connected to the upper surface-side wiring line; a lower surface-side terminal electrically connected to the lower surface-side wiring line; | 01-10-2013 |
20130026632 | SEMICONDUCTOR ELEMENT-EMBEDDED WIRING SUBSTRATE - A wiring substrate in which a semiconductor element is built includes a semiconductor element; a peripheral insulating layer covering at least an outer circumferential side surface of this semiconductor element; and an upper surface-side wiring line provided on the upper surface side of the wiring substrate. The semiconductor element includes an internal terminal electrically connected to the upper surface-side wiring line on the upper surface side of the semiconductor element. This internal terminal includes a first conductive part exposed out of an insulating surface layer of the semiconductor element; an adhesion layer on this first conductive part; and a second conductive part on this adhesion layer. The adhesion layer covers an exposed surface of the first conductive part, and is formed on a portion of the insulating surface layer around the exposed surface of the first conductive part, and the adhesion layer extends around the outer side of an outer edge of this second conductive part so as to surround the second conductive part. | 01-31-2013 |
20150053474 | FUNCTIONAL ELEMENT BUILT-IN SUBSTRATE AND WIRING SUBSTRATE - An object of the present invention is to propose a functional element built-in substrate which enables an electrode terminal of a functional element to be well connected to the back surface on the side opposite to the electrode terminal of the functional element, and which can be miniaturized. According to the present invention, there is provided a functional element built-in substrate including a functional element provided with an electrode terminal on one surface side of the functional element, and a wiring substrate including a laminated structure in which the functional element is embedded so that the electrode terminal of the functional element faces the front surface side of the structure, and which is formed at least in a side surface region of the functional element by laminating a plurality of wiring insulating layers each including a wiring, the functional element built-in substrate being featured in that the electrode terminal and the back surface side of the wiring substrate are electrically connected to each other through the wiring of the laminated structure, and in that, in a pair of the wiring insulating layers included in the laminated structure and that are in contact with each other, the cross-sectional shape of the wiring in each of the wiring insulating layers, which cross-sectional shape is taken along the plane perpendicular to the extension direction of the wiring in the wiring insulating layer, has a relationship that the cross-sectional area of the wiring in the back surface side wiring insulating layer is larger than the cross-sectional area of the wiring in the front surface side wiring insulating layer. | 02-26-2015 |
Patent application number | Description | Published |
20110290241 | NEBULIZERS AND FUNCTION UNITS ATTACHABLE TO NEBULIZER - A nebulizer includes a main body unit, an atomization unit, and a breath detection unit, which is a function unit for realizing an additional function of the nebulizer. The main body unit and the atomization unit are separable. The atomization unit includes a storage section for storing the medicinal solution, and an atomizing section for spraying the medicinal solution by atomizing the medicinal solution in the storage section. The main body unit includes a control circuit for performing control to operate the atomizing section. The breath detection unit is attachable between the main body unit and the atomization unit. | 12-01-2011 |
20120247518 | THIN PLATE MEMBER WASHING APPARATUS - In a thin plate member washing apparatus, tap water showering down from water flow holes of a water flow plate makes contact with outer rotary blades and inner rotary blades provided in a rotary supporting member, thereby rotating the rotary supporting member. Moreover, the tap water falling on a mesh member held by a mesh member holding portion flows over a front surface and a back surface of the mesh member based on a centrifugal force due to rotation of the mesh member and removes medicinal fluid residue deposited on the mesh member. The medicinal fluid residue removed from the mesh member is directly carried by the tap water and discharged to the outside of the thin plate member washing apparatus through a fluid outlet opening. | 10-04-2012 |
20120266921 | THIN PLATE MEMBER WASHING APPARATUS - A thin plate member washing apparatus includes a washing vessel including a lid member and an elongated cylindrical vessel having at one end an opening that is closed by the lid member and in which tap water is contained, and a thin plate member fixing member that is housed in the washing vessel and holds a mesh member whose surface is washed with the tap water by moving within the washing vessel. | 10-25-2012 |
Patent application number | Description | Published |
20120101771 | WALKING POSTURE DETERMINATION APPARATUS - In a pedometer serving as a walking posture determination apparatus, horizontal-axis acceleration data is synchronized with and superimposed on vertical-axis acceleration data so as to extract vertical-axis acceleration in a right foot walking period and vertical-axis acceleration in a left foot walking period. Then, the difference YR−YL between the maximum amplitude YR of right foot acceleration and the maximum amplitude YL of left foot acceleration, or the ratio YR/YL therebetween is calculated as an index value to be used in a stride length determination. The pedometer then references pre-stored associations between index values and stride length levels, and determines the stride length level associated with the calculated index value to be the stride length level of the measurement subject. | 04-26-2012 |
20130123669 | GAIT CHANGE DETERMINATION DEVICE - A gait change determination device includes a main body unit, an accelerometer that detects an acceleration of the main body unit, and a control unit, and determines a change in the gait of a user that wears the main body unit on a predetermined area. The control unit specifies a trajectory of a predetermined area on which the main body unit is worn during walking based on accelerations detected by the accelerometer, calculates the temporal change amount of the specified trajectory, and determines the degree of change, which is the degree of the temporal change, based on the calculated temporal change. The degree of change in the gait can be more accurately determined. | 05-16-2013 |
Patent application number | Description | Published |
20140295181 | MULTILAYER FILM FOR DECORATIVE MOLDNIG, POLYURETHANE RESIN, AND METHOD FOR PRODUCING DECORATIVE MOLDED BODY - A multilayer film includes a protective layer, a color layer and an adhesive layer, with a molding film disposed between either of the adjoining pairs of layers or on an opposite surface of the protective layer to the color layer, wherein the protective layer contains a polyurethane resin (U) formed at least from an active hydrogen component (A) and an organic isocyanate component (B) and having a polycarbonate skeleton with an alicyclic hydrocarbon group and that conditions (1) and/or (2) are satisfied:
| 10-02-2014 |
20150027614 | DECORATIVE MOLDING FILM - A decorative molding film has a laminated structure in which a coloring layer, protective layer and a base film are stacked in that order or in which the base film is disposed between the coloring layer and the protective layer, wherein the rupture elongation of said base film and the protective layer at 120° C. is 200% or more, wherein the coloring layer includes at least a binder resin, and a glittering material with an average longer diameter of from 5 to 12 μm, and wherein the stress at 100% elongation of the coloring layer at 120° C. is 4 MPa or less; which decorative molding film has less occurrence of surface irregularity at a highly stretched region. | 01-29-2015 |
20150129120 | FILM FOR DECORATIVE FORMING AND PRODUCTION METHOD FOR DECORATIVE FORMED BODY - A film for decorative forming includes a layered structure in which a protective layer and a colored layer are arranged sequentially in this order on a base material film, wherein, when a storage elastic modulus of the protective layer at 100° C. is written as E′a(100) and a storage elastic modulus of the colored layer at 100° C. is written as E′b(100), E′a(100) and E′b(100) satisfy conditions (1) to (3):
| 05-14-2015 |