Patent application number | Description | Published |
20110091696 | INK COMPOSITION, INK COMPOSITION FOR INKJET RECORDING, INK SET, INK CARTRIDGE, INKJET RECORDING METHOD, AND RECORDED PRODUCT - An ink composition is provided which does not undergo decomposition or fading of colorants even when stored under high-temperature environment. An ink composition which contains a compound represented by the following general formula (1) and a humectant, wherein the content of the compound represented by the general formula (1) is from 0.1% by mass to less than 7.0% by mass, the content of the humectant having 3 or more hydroxyl groups is 8.0% by mass or less, and the molar ratio of the humectant having 3 or more hydroxyl groups/the compound represented by the general formula (1) being less than 15.0; | 04-21-2011 |
20110104458 | INK COMPOSITION, INKJET RECORDING INK COMPOSITION, INK SET, INK CARTRIDGE, INKJET RECORDING METHOD AND RECORDED MATTER - An ink composition having a suitably-adjusted hue and causing no decomposition of dyes during storage is provided. The ink composition contains a compound (a) represented by the following formula (1), an ingredient (c) and moisture-retentive agents, characterized by being from 0.1 mass % to lower than 7.0 mass % in content of the compound represented by the formula (1), 10.0 mass % or lower in content of a moisture-retentive agent having 3 or more hydroxyl groups (b) and lower than 30.0 in molar ratio of the moisture-retentive agent having 3 or more hydroxyl groups to the compound represented by the formula (1): | 05-05-2011 |
Patent application number | Description | Published |
20090250812 | FLIP-CHIP MOUNTING SUBSTRATE AND FLIP-CHIP MOUNTING METHOD - A solder resist and a central pad to which a central Au bump provided on a semiconductor chip is flip-chip bonded are formed on a substrate main body. In a flip-chip mounting substrate where an underfill resin is provided after the semiconductor chip is mounted, a central opening portion for exposing the central pad is formed in the solder resist, and also, an edge portion forming the central opening portion of the solder resist is partially overlapped with the outer peripheral portion of the central pad. | 10-08-2009 |
20100127370 | WIRING BOARD, SEMICONDUCTOR DEVICE AND SEMICONDUCTOR ELEMENT - On a semiconductor element loading face, wiring patterns are drawn out from those formed in the vicinity of the edge of the semiconductor element of the loading pads formed to correspond to the electrode terminals of the semiconductor element, and connected to via pads formed in the vicinity of the edge of the semiconductor element loading face; area pads constructed of the loading pads corresponding to the electrode terminals formed in the central region of the semiconductor element and its vicinity are electrically connected to external connecting terminal pads formed in the central region on the other side of the wiring board and its vicinity, through the nearest area pad vias encircled by the external connecting terminal pads and passing through the wiring board and the wiring patterns; and a plurality of the loading pads constituting the area pads commonly use one of the area pad vias. | 05-27-2010 |
20100252938 | SEMICONDUCTOR PACKAGE - A semiconductor package includes: a semiconductor element mounted on a one-sided plane of a wiring board; an underfill agent dropped so as to be filled between the semiconductor element and the wiring board; and a pad group constituted by a plurality of pads which are formed in the vicinity of a circumference of the wiring board and along the circumference, the pad group being formed on a bottom plane of a groove portion formed in a solder resist which covers the one-sided plane of the wiring board, wherein a corner edge of the groove portion located in the vicinity of a dropping starting portion to which dropping of the underfill agent is started is formed at an obtuse angle or in an arc shape in order to avoid the dropped underfill agent from entering into an inner portion of the groove portion. | 10-07-2010 |
20100295174 | WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE - A wiring substrate includes: a semiconductor chip on which a plurality of bumps are mounted, and a plurality of connection pads which are joined to the bumps mounted on the semiconductor chip in a flip chip method, wherein the connection pads of a peripheral portion of the wiring substrate are formed in a non-solder mask defined structure, and the connection pads of a center portion of the wiring substrate are formed in a solder mask defined structure. | 11-25-2010 |
20110316150 | SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE - A semiconductor package includes a first board, a semiconductor chip having a first face and a second face at an opposite side to the first face, the semiconductor chip being mounted on the first board with the first face facing the first board, an insulating film provided on the second face of the semiconductor chip, and a second board stacked on the first board. A bump provided on a face of the second board facing the first board is connected to a pad provided on a face of the first board facing the second board and a gap is formed between the first board and the second board. The semiconductor chip and the insulating film are provided in the gap. | 12-29-2011 |
20110316151 | SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE - A semiconductor package includes a board, an under fill resin layer provided on the board, and a semiconductor chip having a first face and a second face at an opposite side to the first face, the semiconductor chip being flip-chip mounted on the board via the under fill resin layer with the first face facing the board. The semiconductor chip is covered with the under fill resin layer over the first face and from the first face to an edge part of the second face. | 12-29-2011 |
20120126423 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE - According to an aspect of the present invention, there is provided a semiconductor device manufacturing method, including: preparing a support plate having a mounting portion on which a mounting terminal is mountable; preparing a circuit board having a mounting surface on which a semiconductor chip is mounted and a connection pad is formed; bringing the support plate to face the mounting surface of the circuit board, and connecting the support plate to the connection pad through the mounting terminal; forming a resin layer between the support plate and the mounting surface of the circuit board to cover the mounting terminal; and removing the support plate, thereby faulting a via in the resin layer along a shape of the mounting portion so as to expose the mounting terminal therethrough. | 05-24-2012 |
Patent application number | Description | Published |
20100123545 | PROJECTION SYSTEM, SCREEN, AND PROJECTOR - A projection system includes: a screen having screen specific authentication information; and a projector having a function of acquiring the screen specific authentication information and, based on the acquired authentication information, carrying out an authentication process for setting the projector to a usable condition. | 05-20-2010 |
20100134764 | PROJECTOR - A projector includes: a light source; a light modulation device which forms an image by modulating light emitted from the light source according to inputted image information; a projection optical system which projects the image formed by the light modulation device; a projection position controlling unit which controls the projection position of the image by shifting the projection optical system in the left-right direction with respect to the projection direction; a pair of left and right speakers which output sounds corresponding to audio information inputted with the image information; and a sound volume adjusting unit which separately adjusts sound volume levels of the sounds outputted from the pair of the speakers based on the control condition of the projection position provided by the projection position controlling unit. | 06-03-2010 |
20100165302 | PROJECTOR AND METHOD OF CONTROLLING THE SAME - A projector adapted to perform a keystone distortion correction for correcting keystone distortion of an image projected on a projection surface, includes: a fluctuation detection section adapted to start detection of fluctuation state of the projector in response to a predetermined instruction signal; an angle detection section adapted to detect an installation angle of the projector; a distortion correction section adapted to perform the keystone distortion correction, in response to detection of a fluctuation settled state by the fluctuation detection section, in accordance with the installation angle detected by the angle detection section; and a control section adapted to terminate the detection of the fluctuation state by the fluctuation detection section in response to elapse of second time while keeping the fluctuation settled state from completion of the keystone distortion correction by the distortion correction section. | 07-01-2010 |
20110149175 | PROJECTOR AND METHOD FOR PROJECTING IMAGE - A projector includes: an image projecting section that projects an image; a ruled line storage section that stores ruled line data of a ruled line; a ruled line reading unit that reads the ruled line data of the ruled line from the ruled line storage section so as to make the image projecting section project the ruled line corresponding to the ruled line data; a ruled line editing unit that performs editing for changing the structure of the projected ruled line; and a storage processing unit that makes the ruled line storage section store the edited ruled line data corresponding to the ruled line changed by the ruled line editing unit. | 06-23-2011 |
20110164192 | PROJECTOR AND METHOD OF CONTROLLING THE SAME - A projector includes: an image projection unit that projects a projection image generated based on input image data onto a projection surface; a projection distance measurement unit that measures a projection distance from the projector to the projection surface; and an adjusting unit that adjusts the project ion image in accordance with the projection distance so that the projection image is projected onto the projection surface under a predetermined projection condition. | 07-07-2011 |
20110181846 | PROJECTOR AND IMAGE PROJECTION METHOD - A projector includes: an image projection unit that projects an image; a trapezoidal correction unit that performs trapezoidal correction on the image projected by the image projection unit; a nonvolatile storage unit that stores the amount of previous trapezoidal correction and a predetermined acceptable value associated with the amount of previous trapezoidal correction, the amount of previous trapezoidal correction being used immediately before at least one of when the projector is turned off and when signal processing is changed; and an adjustment unit that sets, if the amount of previous trapezoidal correction is greater than the predetermined acceptable value, the amount of trapezoidal correction to be performed by the trapezoidal correction unit at a predetermined standard value or zero after the projector is activated or after the signal processing is changed. | 07-28-2011 |
20110216047 | PROJECTOR AND METHOD FOR PROJECTING AN IMAGE BY USING THE PROJECTOR - In a projector, if an image signal other than the currently selected image signal is input, the image signal is switched to the other image signal according to the position of a shutter. | 09-08-2011 |
20130010269 | PROJECTOR AND CONTROL METHOD FOR PROJECTOR - A projector can be connected in cascade to another projector. Either a first mode for the projector to operate as a leading projector in the cascade connection or a second mode for the projector to operate as a second or subsequent projector in the cascade connection is set. The projector is made available for use on authentication by an authentication unit or on reception of use permission information of the projector by a receiving unit. | 01-10-2013 |
20140043590 | PROJECTOR AND METHOD FOR CONTROLLING PROJECTOR - A projector can not only perform power on/off operation in synchronization with open/close action of a shutter but also provide a screen mute function achieved by the shutter. When the shutter is located in an OFF position and the period timed by a timer is longer than or equal to a predetermined period during the operation of the projector, the projector is powered off. In this process, after the timing operation performed by the timer and notification from a notification unit are terminated, a light source is turned off and the projector is caused to enter a standby state. | 02-13-2014 |
20140085272 | PROJECTOR SYSTEM AND CONTROL METHOD FOR THE PROJECTOR SYSTEM - A projector system including input pens, the projector system being capable of preventing a user from forgetting to return the input pen to a predetermined place after using the input pen is provided. When the projector system receives power-off operation during an operation, if at least one of the input pens is not stored in a pen housing unit, a warning message is projected by an image projecting unit. If all the input pens are housed in the pen housing unit, a power supply for the projector system is turned off. | 03-27-2014 |
20140192089 | PROJECTOR SYSTEM AND CONTROL METHOD THEREOF - A projector system includes: a position detecting unit that detects a pointed position of a pointer on a projection surface; a drawing unit that performs drawing on the projection surface according to the pointed position detected by the position detecting unit; a height detecting unit that detects a height of a user of a projector; and a display changing unit that changes, according to the user's height detected by the height detecting unit, at least one of a shape of the image projected onto the projection surface and a display position of the image on the projection surface. | 07-10-2014 |