Patent application number | Description | Published |
20080229033 | Method For Processing Data in a Memory Arrangement, Memory Arrangement and Computer System - A method processes data in a memory arrangement. The method includes receiving and transmitting the data from the memory arrangement in the form of data packets according to a predefined protocol. The method includes distributing each received data packet to at least two separate data packet processing units. Each data packet processing unit is coupled to a portion of memory cells of the memory arrangement. The method includes processing, at each data packet processing unit, parts of the received data packets that relate to the portion of the memory cells the data packet processing unit is coupled to. The method includes generating a data packet to be transmitted including setting up, with each data packet processing unit, a part of the data packet to be transmitted. | 09-18-2008 |
20090141843 | Method and Apparatus for Determining a Skew - The invention provides a method and an apparatus for determining a skew of each data bit of an encoded data word received by a receiver via an interface from a transmitter comprising the steps of performing an error check and correction of the received and sampled encoded data word to calculate an error corrected encoded data word corresponding to the encoded data word transmitted by the transmitter, and correlating a sequence of error corrected encoded data words with the sampled encoded data words to determine a skew of each data bit of said received encoded data words. | 06-04-2009 |
20090144583 | Memory Circuit - The invention provides a memory circuit comprising a plurality of storage cells for storing data and redundant spare storage cells for replacing defective storage cells, and a memory access logic for accessing said storage cells connected to a replacement setting register which is writeable during operation of said memory circuit to store replacement settings. | 06-04-2009 |
20100062621 | Horizontal Dual In-line Memory Modules - Horizontal dual in-line memory modules are disclosed. In one embodiment, the memory module includes a circuit board, a plurality of memory chips attached to a top surface of the circuit board, and a plurality of connector contacts disposed under a back surface of the circuit board and extending away from the memory chips, the connector contacts being electrically coupled to the memory chips, the back surface opposite the top surface of the circuit board. | 03-11-2010 |
20100077139 | MULTI-PORT DRAM ARCHITECTURE - Embodiments of the invention provide a memory device that may be accessed by a plurality of controllers or processor cores via respective ports of the memory device. Each controller may be coupled to a respective port of the memory device via a data bus. Each port of the memory device may be associated a predefined section of memory, thereby giving each controller access to a distinct section of memory without interference from other controllers. A common command/address bus may couple the plurality of controllers to the memory device. Each controller may assert an active signal on a memory access control bus to gain access to the command/address bus to initiate a memory access. | 03-25-2010 |
20100077157 | MULTI MASTER DRAM ARCHITECTURE - Embodiments of the invention provide a memory device that may be accessed by a plurality of controllers or processor cores via respective ports of the memory device. Each controller may be coupled to a respective port of the memory device via a data bus. Each port of the memory device may be associated a predefined section of memory, thereby giving each controller access to a distinct section of memory without interference from other controllers. A common command/address bus may couple the plurality of controllers to the memory device. Each controller may assert an active signal on a memory access control bus to gain access to the command/address bus to initiate a memory access. In some embodiments, the memory device may be a package comprising a plurality of stacked memory dies. | 03-25-2010 |
20100082871 | Distributed Command and Address Bus Architecture - Distributed command and address bus architecture for memory modules and circuit boards is described. In one embodiment, a memory module includes a plurality of connector pins disposed on an edge of a circuit board, the plurality of connector pins comprising first pins coupled to a plurality of data bus lines, second pins coupled to a plurality of command and address bus lines, wherein the second pins are disposed in a first and a second region, wherein a portion of the first pins is disposed between the first and the second regions. | 04-01-2010 |
20110205828 | SEMICONDUCTOR MEMORY WITH MEMORY CELL PORTIONS HAVING DIFFERENT ACCESS SPEEDS - A semiconductor memory including a plurality of memory banks disposed on an integrated circuit, each memory bank including an array of memory cells, wherein a first portion of memory cells of the plurality of memory banks has a first access speed and a second portion of memory cells of the plurality of memory banks has a second access speed, wherein the first access speed is different from the second access speed. | 08-25-2011 |
Patent application number | Description | Published |
20080222443 | Controller - The invention relates to a controller for generating control signals (evload_o, odload_o, st_chgclk_o, clk_o , clkorfiford_i) synchronous with a continuous clock signal (clk_hr_i) input to it for a device ( | 09-11-2008 |
20080240290 | METHOD AND DEVICE FOR TRANSMITTING OUTGOING USEFUL SIGNALS AND AN OUTGOING CLOCK SIGNAL - Method and device for transmitting outgoing useful signals and an outgoing clock signal. Useful signals and a clock signal are transmitted from a transmitter via a first line pair and a second line pair to a receiver. A first useful signal is transmitted in the form of a modulated difference between the electrical potentials of the first line pair. A second useful signal is transmitted in the form of a modulated difference between the electrical potentials of the second line pair. The clock signal is transmitted in the form of a modulated difference between the average value of the potentials of the first line pair and the average value of the potentials of the second line pair. | 10-02-2008 |
20090073010 | DATA CONVERSION - A circuit includes a data conversion circuit including a first input configured to receive a first serial data stream, a second input configured to receive a second serial data stream, and a third input configured to receive a third serial data stream. A first sampling circuit is coupled to the first, second, and third inputs and is configured to sample the first to third data streams based on a plurality of clock signals and to generate a corresponding plurality of first sampled signals. A second sampling circuit is configured to sample the plurality of first sampled signals based on a further clock signal. The further clock signal has a clock frequency different from a clock frequency underlying the first to third serial data streams. | 03-19-2009 |
20090161401 | Multi-die Memory, Apparatus and Multi-die Memory Stack - The multi-die memory comprises a first die and a second die. The first die comprises a first group of memory banks, and the second die comprises a second group of memory banks. The first group of memory banks and the second group of memory banks are coupled to a common memory interface. The common memory interface couples the multi-die memory with an internal connection. | 06-25-2009 |
20100030934 | Bus Termination System and Method - A memory system includes a number of integrated circuit chips coupled to a bus. Each of the integrated circuit chips has an input/output node coupled to the bus, the input/output node having a programmable on-die termination resistor. The input/output node of one of the integrated circuit chips is accessed via the bus. The programmable on-die termination resistor of each of the integrated circuit chips is independently set to a termination resistance. The termination resistance is determined by a transaction type and which of the plurality memory devices is being accessed, which information can be transmitted over a separate transmission control bus. | 02-04-2010 |
20100032820 | Stacked Memory Module - Memory modules, computing systems, and methods of manufacturing memory modules are disclosed. In one embodiment, a memory module includes a substrate having a first side and a second side opposed to the first side. A plurality of pins is disposed on the first side of the substrate. A first plurality of memory chips are arranged in a first chip layer, the first chip layer overlying the second side of the substrate. Electrical contacts of the first plurality of memory chips are electrically coupled to the pins. A second plurality of memory chips is arranged in a second chip layer, the second chip layer overlying the first chip layer. Electrical contacts of the second plurality of memory chips are electrically coupled to the pins. | 02-11-2010 |
20100046266 | High Speed Memory Architecture - Memory devices and memory modules are disclosed. In one embodiment, a memory device includes a semiconductor substrate having a first edge and a second edge opposed to the first edge. A plurality of memory banks is disposed at a central portion of the semiconductor substrate, each memory bank including a plurality of memory cells. A plurality of input/output contacts is disposed between the first edge and the memory banks. Delay locked loop circuitry is disposed adjacent the first edge. A plurality of address and command contacts is disposed between the second edge and the memory banks. | 02-25-2010 |