Patent application number | Description | Published |
20080228951 | RECONFIGURABLE CIRCUITS - The present disclosure involves reconfigurable circuits that include an asynchronous data path with asynchronous control and at least one logic element coupled with the asynchronous data path that allows the circuit to be configured to more than one logical implementation through data and control token. In one particular example, the asynchronous data path with asynchronous control includes an interconnection of memory elements, such as latches, with each memory element including a corresponding asynchronous control element, such as a GasP element. One or more logical elements are coupled at one or more points of the data path, such coupling may involve feed-back, feed-forward, or combinations of both, and may include external data connections. Through distribution of data items and control tokens to the asynchronous data path with asynchronous control, the fixed logical coupling to the data path may be reconfigured to provide various logical arrangements. | 09-18-2008 |
20090176450 | MULTIPLE ACCESS OVER PROXIMITY COMMUNICATION - A multiple access Proximity Communication system in which electrical elements on an integrated circuit chip provide the multiplexing of multiple signals to a single electrical receiving element on another chip. Multiple pads formed on one chip and receiving separate signals may be capacitively coupled to one large pad on the other chip. Multiple inductive coils on one chip may be magnetically coupled to one large coil on another chip or inductive coils on three or more chips may be used for either transmitting or receiving. The multiplexing may be based on time, frequency, or code. | 07-09-2009 |
20090189241 | Using floating fill metal to reduce power use for proximity communication - One embodiment of the present invention provides a system that facilitates reducing the power needed for proximity communication. This system includes an integrated circuit with an array of transmission pads that transmit a signal using proximity communication. A layer of fill metal is located in proximity to this array of transmission pads, wherein the layer of fill metal is “floating” (e.g., not connected to any signal). Leaving this layer of fill metal floating reduces the parasitic capacitance for the array of transmission pads, which can reduce the amount of power needed to transmit the signal. | 07-30-2009 |
20090189674 | Circuit that facilitates proximity communication - One embodiment of the present invention provides a system that facilitates proximity communication. This system includes a circuit containing a bootstrap transistor and a pass-gate transistor, where the drain of the bootstrap transistor is coupled to the gate of the pass-gate transistor. Note that a first coupling capacitance exists between the source of the pass-gate transistor and the drain of the bootstrap transistor and a second coupling capacitance exists between the drain of the pass-gate transistor and the drain of the bootstrap transistor. During operation, the gate and the source of the bootstrap transistor are coupled to a high voltage, thereby causing an intermediate voltage at the drain of the bootstrap transistor. When the source of the pass-gate transistor transitions to a high voltage, the first coupling capacitance and the second coupling capacitance boost the voltage at the gate of the pass-gate transistor higher than the high voltage, thereby enabling the high voltage at the source of the pass-gate transistor to pass to the drain of the pass-gate transistor. | 07-30-2009 |
20090279571 | DIVERSITY PROXIMITY COMMUNICATION - A diversity proximity communication system formed on two juxtaposed chips, one having a two-dimensional array of transmit elements, the other having a two-dimensional array of receive elements. The receive and transmit elements need not be aligned and may have nominal alignment of one transmit element overlapping the corners of four receive elements. The elements may be electrical pads capacitively coupled across the interface. Signals of four different multiplexing groups, e.g., time-multiplexed, are supplied to transmitting elements in a 2×2 array. Signals from four receive elements in a 2×2 array are amplified, combined, and demultiplexed for the selected multiplexing group. The gains for the four signals to be combined are differentially controlled to increase the signal-to-noise ratio. The amplification may be determined by the overlap between each of the receive elements and the transmit element of the selected multiplexing group. | 11-12-2009 |
20090315157 | PROTECTION FOR PROXIMITY ELECTRONICS AGAINST ELECTROSTATIC DISCHARGE - A system of protecting a proximity communication system against electrostatic discharge (ESD). The proximity communication system includes two chips, each having an array of electrical pads at its surface and covered by a thin dielectric layer such that capacitive coupling circuits are formed between the chips when they are joined together. In at least one of the chips, an additional protection pad is formed away from the array, and heavy protection circuitry is connected to it. Its surface is exposed through the dielectric surface over it such that, when an ESD aggressor approaches, the discharge occurs to the protection pad. | 12-24-2009 |
20090315624 | ACTIVE RESISTOR USED IN A FEEDBACK AMPLIFIER PARTICULARLY USEFUL FOR PROXIMITY COMMUNICATION - An active resistor and its use in a negative feedback amplifier allow wide voltage swings on the input and output signals. One embodiment includes parallel pass-gate MOS transistors of opposite conductivity types connected between the input and output nodes. Bootstrapping transistors are connected between the gates of the pass-gate transistors and respective bias voltages. Coupling capacitors are connected between the gates and the output node. Additional coupling capacitors may be connected between the gates and the input node to make the resistor symmetric. In other embodiments, only one pass-gate transistor is used. | 12-24-2009 |
20100060299 | DETERMINING CHIP SEPARATION BY COMPARING COUPLING CAPACITANCES - A semiconductor die includes proximity connectors proximate to a surface of the semiconductor die. This semiconductor die is configured to communicate signals with another semiconductor die via proximity communication through one or more of the proximity connectors. In particular, the proximity connectors include a first group of proximity connectors that is configured to facilitate determining a first separation between the semiconductor die and the other semiconductor die by comparing coupling capacitances between the semiconductor die and the other semiconductor die. Note that the first group of proximity connectors includes a first proximity connector and a second proximity connector, and the second proximity connector at least partially encloses an in-plane outer edge of the first proximity connector. | 03-11-2010 |