Patent application number | Description | Published |
20090250350 | DETECTION DEVICE AND METHOD OF ANODIC OXIDE FILM - A device for detecting an anodic oxide film during an anodic oxidation treatment includes a container receiving an electrolyte therein, an aluminum sheet immersed in the electrolyte, a power source supplying a current to the aluminum sheet to form an anodic oxide film on the aluminum sheet, a data acquisition unit measuring a potential of the anodic oxide film at a time, a data processor unit calculating a differential value of the potential, and a display unit displaying a differential curve generated according to the differential values of the potentials at different times. The quality of the anodic oxide film can be judged by reading the shape of the differential curve. | 10-08-2009 |
20090250718 | LIGHT EMITTING DIODE AND METHOD FOR PRODUCING THE SAME - A method for producing an LED includes steps of: providing a base ( | 10-08-2009 |
20090261725 | SIDE-VIEW LIGHT EMITTING DIODE - A side-view light emitting diode includes a substrate, a tubular, upwardly tapered light permeable housing disposed on the substrate, a receiving space formed between the substrate and the housing, a light emitting diode chip received in the receiving space, a light permeable capsulation material filled in the receiving space and encapsulating the light emitting diode chip in the housing, and a flat reflecting layer formed on a top end of the capsulation material. The housing forms a plurality of annular projections projecting outwardly. An outer surface of the housing has a coarse feature. | 10-22-2009 |
20090267094 | LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to a light emitting diode and a method for manufacturing the same. The light emitting diode includes a base, a light emitting chip on the base, a light permeable encapsulation encapsulating the light emitting chip to the base. The encapsulation defines a plurality of apertures extending from a bottom end toward a top end of the encapsulation. | 10-29-2009 |
20090267794 | LIGHT EMITTING DIODE BASED TRAFFIC LIGHT MODULE - A traffic light module ( | 10-29-2009 |
20090268452 | LIGHT EMITTING DIODE LAMP - An LED lamp includes a reflecting portion and a plurality of LEDs. The reflecting portion is formed by rotating a half-parabola, a whole parabola of which has a vertex and a focal point located on the X-axis. The half-parabola extends from the vertex to the Y-axis, and rotates around the Y-axis to form the reflecting portion. The focal points of the half-parabolas of the reflecting portion form an arc-shaped trajectory, the vertexes of the half-parabolas of the reflecting portion form an arc and defining a first open side, and two outmost half-parabolas of the reflecting portion form a second open side of the reflecting portion. The plurality of LEDs are located on the trajectory, and face the reflecting portion. Light emitted by the plurality of LEDs travels to the reflecting portion and then is reflected parallelly therefrom to the second open side. | 10-29-2009 |
20090268459 | LIGHT EMITTING DIODE LAMP - An LED lamp includes a base, a plurality of LEDs arranged on the base, and a cover. Each LED has an emitting surface. The cover includes a mounting side attached to the base, and an opposite emitting side. A plurality of blind holes extends into the cover from the mounting side of the cover, and encases the plurality of LEDs therein, respectively. Each blind hole includes an open side facing the base, an opposite closed side facing the emitting surface of the LED, and a sidewall arranged between the open side and the closed side of the blind hole. An area of the closed side of each hole exceeds that of the open side of the blind hole. The sidewall surrounds the LED and reflects light of the LED to the closed side of the blind hole of the cover. | 10-29-2009 |
20090278149 | LIGHT EMITTING DIODE | 11-12-2009 |
20090279296 | LIGHT EMITTING DIODE LAMP - An LED lamp includes an LED, a reflector, a first lens and a second lens. The reflector includes an outer surface which is a total reflective surface. A receiving space extends into the reflector from a center of a top side of the reflector and defines an opening in the center of the top side. The LED is received in the receiving space and faces the top side of the reflector. The first lens couples to and seals the opening of the reflector. The second lens is arranged on the top side of the reflector surrounding the first lens. Light generated by the LED passes across both of the first and second lenses to an exterior during operation of the LED lamp. | 11-12-2009 |
20090283784 | SIDE-VIEW LIGHT EMITTING DIODE - An exemplary side-view light emitting diode (LED) includes a substrate, a housing, a LED chip, a capsulation material and a reflecting layer. The housing and the substrate cooperatively form a receiving space therebetween. The LED chip is received in the receiving space and electrically connected with the substrate. The capsulation material is filled in the receiving space and encapsulates the LED chip in the housing. An indent is defined in a top portion of the capsulation material to cave a top surface of the capsulation material. The reflecting layer is spread on the top surface of the capsulation material. The light emitted from the LED chip upwardly towards the top surface of the capsulation material is reflected to a lateral side of the housing by the reflecting layer. The indent has a horizontal section with a size decreased along a top-to-bottom direction. The housing has a diameter gradually increased along the top-to-bottom direction. | 11-19-2009 |
20090284969 | LIGHT EMITTING DIODE LAMP - A light emitting diode lamp includes a mounting base, a number of light emitting diodes, and a reflecting cover. The mounting base includes opposite first and second surfaces, and an outer surface interconnecting outer peripheries of the first and second surfaces. Outer size of the outer surface of the mounting base decreases from the first surface to the second surface. At least one of the light emitting diodes is arranged on the second surface, with at least one arranged on the outer surface of the mounting base. The reflecting cover surrounds the mounting base for reflecting the light of the plurality of light emitting diodes towards one side of the reflecting wall facing the second surface of the mounting base. | 11-19-2009 |
20090290362 | LIGHT EMITTING DIODE DEVICE - An exemplary light emitting diode (LED) device includes a base, a plurality of LED chips, a plurality of encapsulation materials and a heat dissipation substrate. The LED chips are mounted on a top surface of the base. The encapsulation materials are provided on the top surface of the base and encapsulate the LED chips therein. The heat dissipation substrate is fixedly attached to a bottom surface of the base. The heat dissipation substrate is of a porous material and defines a plurality of pores therein. The pores communicate with each other. | 11-26-2009 |
20090302337 | LIGHT EMITTING DIODE SYSTEM - An exemplary light emitting diode (LED) structure includes a base, a plurality of LED chips and an encapsulation material. The base defines a plurality of first channels located adjacent to a top surface thereof and a plurality of second channels located adjacent to a bottom surface thereof. Each of the first and the second channels extends along a vertical axis of the base. A projection of the first channels on the bottom surface of the base does not overlap with the projection of the second channels on the bottom surface of the base. The projection of the second channels on the bottom surface of the base is closer to the projection of one corresponding LED chip on the bottom surface of the base with respect to the projection of the first channels. A plurality of heat dissipation poles are filled in the first and the second channels. | 12-10-2009 |
20090305443 | METHOD OF MAKING LIGHT EMITTING DIODES - A method of making a plurality of light emitting diodes simultaneously includes steps of: a) providing a wafer and a first bonding layer, and adhering the first bonding layer to a bottom side of the wafer; b) cutting the wafer to form a plurality of LED dies on the first bonding layer; c) adhering a second bonding layer on top sides of the plurality of LED dies; d) removing the first bonding layer; e) mounting the second bonding layer with the plurality of LED dies on a base having a plurality of recesses; f) removing the second bonding layer and letting the plurality of LED dies fall into the recesses of the base; g) electrically connecting the LED dies to electric poles in the base; h) encapsulating the LED dies; and i) cutting the base to form the plurality of LEDs. | 12-10-2009 |
20090310352 | LED LAMP - An LED lamp includes a concave lamp enclosure, a base, a plurality of LEDs and a lens. The base is received in the lamp enclosure and located at a bottom of the lamp enclosure. The base has a curved, concave top surface. The LEDs are distributed on the top surface of the base. The lens is received in the lamp enclosure and located over the LEDs. The lens has a curved, convex light input surface. The light input surface faces and spaces from the top surface of the base to define a space between the light input surface of the lens and the top surface of the base. | 12-17-2009 |
20090310359 | LED LAMP - An LED lamp ( | 12-17-2009 |
20090316398 | LED LIGHT FIXTURE AND METHOD FOR MANUFACTURING THE SAME - An LED light fixture includes a first substrate, a second substrate and a plurality of LED chips. The first substrate, on one side thereof, includes a plurality of spaced first electrodes, a first inner terminal electrically connected to the first electrodes, and a second inner terminal insulated from the first electrodes, and, on another side thereof, a first outer terminal electrically connected to the first inner terminal and a second outer terminal electrically connected to the second inner terminal. The second substrate includes a plurality of spaced second electrodes corresponding to the first electrodes, and a third inner terminal electrically connected to the second electrodes and the second inner terminal. The LED chips are arranged between the first and second substrates and electrically connected to the first and second electrodes of the first and second substrates, respectively. | 12-24-2009 |
20090316399 | LIGHT EMITTING DIODE - An LED includes a base, a plurality of chips, a first lens made of a first light penetrable material and a second lens made of a second light penetrable material. The base has a concave depression. The chips are mounted at a bottom of the concave depression. The first lens is received in the depression for encapsulating the chips. The second lens is received in the depression and located on the first lens. The second lens includes a light input surface facing the chips and a plurality of recesses defined in the light input surface corresponding to the chips. Each recess has an internal wall with an uneven surface. | 12-24-2009 |
20090321763 | LIGHT EMITTING DIODE | 12-31-2009 |
20090321765 | LIGHT EMITTING DIODE - An LED includes an LED die forming an emitting surface for emitting light generated thereby and a packaging layer encapsulating the LED die. The packaging layer includes an end surface facing the emitting surface of the LED die, and a lateral surface extending downwardly from an outer periphery of the end surface along an axial direction of the packaging layer. The end surface forms a convex portion confronting the LED die and an emitting portion surrounding the convex portion. Light of the LED die traveling to the convex portion is reflected to the lateral surface, and then is reflected to the emitting portion, and finally travels through the emitting portion to an outside. | 12-31-2009 |
20090321766 | LED - An LED includes a base having a depression, a chip disposed in the depression, an encapsulation received in the depression for encapsulating the chip, and a base. Two spaced electrodes are attached to a bottom of the base and electrically connect with the chips. A porous heat sink extends through the base and reaches the depression, contacting the chip. | 12-31-2009 |
20090321768 | LED - An LED includes a base having a depression, a chip disposed in the depression and an encapsulation received in the depression for encapsulating the chip and a heat sink. The heat sink includes a plurality of fins formed on a top of the base and a heat-conductive material filled in the space between adjacent fins. The heat-conductive material has a plurality of pores therein. | 12-31-2009 |
20090323333 | LED LAMP - An LED lamp includes a lamp holder, a lens, and at least one LED. The lamp holder includes a substrate and a reflector expanding from an outer periphery of the substrate. The lens couples to the reflector of the lamp holder to seal a receiving space of the lamp holder. The at least one LED is received in the receiving space and arranged on the substrate. The lens includes an incident surface facing the receiving space and an opposite emitting surface. At least one micro-structure is formed on the incident surface of the lens corresponding to the at least one LED. The at least one micro-structure is located on a central axis of the at least one LED, for diffusing the light generated by the at least one LED. | 12-31-2009 |
20090323346 | LIGHT EMITTING DIODE STRUCTURE - An exemplary light emitting diode (LED) structure includes a heat sink and a light emitting diode mounted on a top surface of the heat sink. The heat sink includes a first fin unit and a second fin unit facing the first fin unit. Each of the first fin unit and the second fin unit includes a main body and a plurality of fins extending outwardly from the main body. The first fin unit and the second fin unit are thermally connected to each other and electrically insulated from each other. The light emitting diode is mounted on a top surface of the heat sink. The light emitting diode is thermally connected with the first fin unit and the second fin unit. The light emitting diode has two electrodes being electrically connected to electrical layers formed on the first fin unit and the second fin unit, respectively. | 12-31-2009 |
20100001310 | LIGHT EMITTING DIODE AND MANUFACTURING METHOD THEREOF - An exemplary light emitting diode (LED) includes a substrate, a LED chip and an encapsulation unit. The encapsulation unit includes a first encapsulation material located over the LED chip and a second encapsulation material located around the first encapsulation material. A plurality of first particles with a first distributing density is distributed in the first encapsulation material. A plurality of second particles with a second distributing density is distributed in the second encapsulation material. The first distributing density is larger than the second distributing density, a central portion of light from the light emitting diode chip transmits through the first encapsulation material and exits the encapsulation unit from a top surface thereof, and a periphery portion of light from the light emitting diode chip transmits through the second encapsulation material and exits the encapsulation unit from the top surface thereof. | 01-07-2010 |
20100002464 | LIGHT EMITTING DIODE LAMP - An exemplary light emitting diode (LED) lamp includes a substrate, a plurality of LED chips mounted on the substrate, a lens, and a plurality of reflecting layers. The lens, above the LED chips, has a plurality of first protruding strips and a second protruding strip on a top thereof. Each of the first protruding strips includes a side surface angled with respect to the substrate and a vertical side surface perpendicular to the substrate. The second protruding strip includes two side surfaces, each angled with respect to the substrate. The reflecting layers are formed on the angled side surfaces of the first protruding strips and the second protruding strip, respectively. | 01-07-2010 |
20100012960 | LIGHT EMITTING DIODE - An LED includes a substrate, an LED die, and a packaging layer. The substrate has conductive pins extending therethrough. The LED die is arranged on the substrate and electronically connected to the conductive pins of the substrate. The packaging layer couples to the substrate to encapsulate the LED die therein. The packaging layer includes a contacting surface attached to the substrate, an outer surface opposite to the contacting surface and facing an ambient air, and a lateral surface between the contacting surface and the outer surface. The lateral surface of the packaging layer converges from the contacting surface to the outer surface. A refractive index of the packaging layer decreases from the contacting surface to the outer surface. | 01-21-2010 |
20100022039 | METHOD OF MAKING LIGHT EMITTING DIODES - A method of making LEDs simultaneously includes steps of : a) providing a wafer having LED dies on a substrate; b) forming a passivation layer on the LED dies; c) forming an electrode layer on the passivation layer and the LED dies; d) assembling a conducting board on the electrode layer; e) removing the substrate to expose a light emitting surface of each LED die; f) forming a terminal on the light emitting surface; g) forming a channel at a lateral side of each LED die; h) assembling a cover onto the LED dies; i) wire bonding and encapsulating the LED dies to the LEDs connected with each other; and j) cutting through the interconnected LEDs to form the LEDs separated from each other. | 01-28-2010 |
20100051989 | LED AND METHOD FOR MAKING THE SAME - An LED includes a substrate, an LED die, and a packaging layer. The substrate has conductive pins extending therethrough. The LED die is arranged on the substrate and electronically connected to the conductive pins of the substrate. The packaging layer fills in the substrate to encapsulate the LED die therein. A plurality of fillers are distributed in the packaging layer. Each of the fillers has a plurality of nano-particles distributed therein for enhancing a light dispersion of light generated by the LED die. | 03-04-2010 |
20100056009 | METHOD FOR FABRICATING FIELD EMISSION DISPLAY - A method for fabricating a carbon nanotube-based field emission display includes providing a substrate, forming a cathode array on the substrate, forming a catalyst layer on the cathode array of the substrate by self-assembly of catalyst powders onto the cathode array, growing carbon nanotubes from the cathode array of the substrate, forming an insulating layer on an area of the substrate bearing no cathode array, forming a grid array on the insulating layer of the substrate; and packaging the substrate with a phosphor screen to form the field emission display. | 03-04-2010 |
20100102339 | LIGHT EMITTING DIODE AND LED CHIP THEREOF - A light emitting diode includes a base, a first and second conductive members through the base and a light emitting diode chip on the base. The light emitting diode chip includes an upper surface, a bottom surface, a first sidewall and a second sidewall. The first sidewall and the second sidewall interconnect the upper surface and bottom surface. A first and second heat dissipating layers are respectively located on the first and second sidewalls. The first and second heat dissipating layers connect with the first and second conductive members, respectively. A bottom face of the chip electrically and thermally connects with the second conductive member. A gold wire electrically connects an electrode on a top face of the chip and the first heat dissipating layer. | 04-29-2010 |
20100124072 | AUTOMOBILE AND HEAD LIGHT SYSTEM THEREOF - A head light system of an automobile includes a normal head light and an auxiliary head light. The normal head light is fixedly mounted at a front end of the automobile. The auxiliary head light is provided at the front end of the automobile and includes a lamp body and a supporting member. The lamp body has a center of gravity. One end of the supporting member is fixedly mounted to the automobile. The lamp body is pivotally connected to another end of the supporting member. A pivotal connection point between the lamp body and the supporting member is located just above the center of gravity of the lamp body. | 05-20-2010 |
20100127291 | LIGHT EMITTING DIODE - A light emitting diode includes a light emitting diode chip and first and second encapsulation units respectively of first and second encapsulating materials. The first encapsulation unit encapsulates the light emitting diode chip. The first encapsulation unit includes a light emitting surface defining a plurality of recesses therein and forming a plurality of first protrusions between the recesses. The first protrusions are alternately arranged with the recesses. The second encapsulation unit covers the light emitting surface of the first encapsulation unit. The second encapsulation unit includes a plurality of filling portions filling the recesses of the first encapsulation unit, respectively, and a plurality of second protrusions on the first protrusions, respectively. | 05-27-2010 |
20100157605 | LIGHT EMITTING DIODE LAMP - A light emitting diode lamp includes a lampshade and a light source. The lampshade is a portion of a hollow ellipsoid with one focus of the ellipsoid located therein. The lampshade is symmetric to a major axis of the ellipsoid. The lampshade has a vertex located on the major axis and defines a light extraction opening at one end thereof opposite to the vertex. A reflecting layer is formed on an inner surface of the lampshade. The light source is received in the lampshade and localized at the one focus of the ellipsoid. The light source includes a plurality of light emitting diodes facing the inner surface of the lampshade and the light extraction opening, respectively. | 06-24-2010 |
20100246186 | ILLUMINATION LAMP - An illumination lamp includes a housing, light source, a light reflecting device and a light path conversion device. The housing defines a light emitting window therein. The light source is disposed in the housing. The light reflecting device is disposed in the housing and has a reflecting surface. The light path conversion device is disposed in the housing. The light path conversion device is configured for converting light rays emitted from the light source into parallel light rays and directing the parallel light rays toward the light reflecting surface of the light reflecting device. The light reflecting device reflects the parallel light rays out of the housing via the light emitting window. | 09-30-2010 |