Osborn, CA
David Osborn, Sacramento, CA US
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20130217079 | Beta-Glucosidase Variants and Polynucleotides encoding same - The present invention relates to variants of a parent beta-glucosidase. The present invention also relates to polynucleotides encoding the variants; nucleic acid constructs, vectors, and host cells comprising the polynucleotides; and methods of using the variants. | 08-22-2013 |
20140329284 | Chimeric Polypeptides Having Beta-Glucosidase Activity and Polynucleotides Encoding Same - The present invention relates to chimeric polypeptides having beta-glucosidase activity. The present invention also relates to polynucleotides encoding the chimeric polypeptides; nucleic acid constructs, vectors, and host cells comprising the polynucleotides; and methods of using the chimeric polypeptides | 11-06-2014 |
20150017670 | Methods For Determining The Degradation Of A Biomass Material - The present invention relates to methods for analyzing degradation of a biomass material at a high dry weight percentage. | 01-15-2015 |
Jay Osborn, Palo Alto, CA US
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20110247926 | INTERNAL VENTING DOME SWITCH - To substantially prevent debris from entering the internal volume of a dome switch, the dome switch can be configured to include limited or no external vents. However, to ensure that the air can be displaced and to avoid an excessively high pressure underneath the dome with the dome is inverted, the dome switch can include one or more internal regions for receiving the displaced air. In particular, the dome switch may include one or more integrated reservoirs. For example, the integrated reservoirs can be placed in a layer between a film placed over the dome and a circuit board on which the dome is placed. As another example, the integrated reservoirs can be constructed out of the plane of the circuit board. | 10-13-2011 |
Jay K. Osborn, Dublin, CA US
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20120099264 | PORTABLE COMPUTING DEVICE - A portable computing device includes at least a base portion of a lightweight material that includes at least a wedge shaped top case having a trough formed at an interfacing edge thereof. The trough includes a raised portion having a first contact surface and a receiving area, and a bottom case coupled to the top case to form a complete housing for at least a portion of the portable computing device for enclosing at least a plurality of operational components and a plurality of structural components. The portable computing device also includes at least a lid portion pivotally connected to the base portion by a hinge assembly. In the described embodiments, the lid portion has a display in communication with one or more of the plurality of components in the base portion by way of or more electrical conductors that electrically connect the base portion to the lid portion. | 04-26-2012 |
20130003280 | PORTABLE COMPUTING DEVICE - A portable computing device includes at least a base portion of a lightweight material that includes at least a wedge shaped top case having a trough formed at an interfacing edge thereof. The trough includes a raised portion having a first contact surface and a receiving area, and a bottom case coupled to the top case to form a complete housing for at least a portion of the portable computing device for enclosing at least a plurality of operational components and a plurality of structural components. The portable computing device also includes at least a lid portion pivotally connected to the base portion by a hinge assembly. In the described embodiments, the lid portion has a display in communication with one or more of the plurality of components in the base portion by way of or more electrical conductors that electrically connect the base portion to the lid portion. | 01-03-2013 |
20150131220 | PORTABLE COMPUTING DEVICE - A portable computing device includes at least a base portion of a lightweight material that includes at least a wedge shaped top case having a trough formed at an interfacing edge thereof. The trough includes a raised portion having a first contact surface and a receiving area, and a bottom case coupled to the top case to form a complete housing for at least a portion of the portable computing device for enclosing at least a plurality of operational components and a plurality of structural components. The portable computing device also includes at least a lid portion pivotally connected to the base portion by a hinge assembly. In the described embodiments, the lid portion has a display in communication with one or more of the plurality of components in the base portion by way of or more electrical conductors that electrically connect the base portion to the lid portion. | 05-14-2015 |
Jay Kevin Osborn, Dublin, CA US
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20120092285 | TOUCH SENSOR ARRAYS WITH INTEGRATED INTER-LAYER CONTACTS - Touch pad structures are provided that gather touch sensor data. The data may be used to control a computer or other electronic device. The touch pad structures may be integrated into a computer or other computing equipment or may be provided as a stand-alone accessory. The touch pad structures may include a touch sensor array. The touch sensor array may include rows and columns of touch sensor electrodes, interconnect lines, and other conductive structures. The conductive structures on the touch sensor array may be formed from patterned layers of ink. Interconnect line segments in different layer of ink may be connected in rectangular contact regions. The touch sensor array may have a tail. A layer of insulator may be removed from the substrate across a tip portion of the tail to allow the line segments to be connected. | 04-19-2012 |
Jon V. Osborn, Thousand Oaks, CA US
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20080259344 | Interferometry system chamber viewing window - A stroboscopic imaging interferometer system includes an environmental chamber having a novel viewing window equipped with a rigidly integrated beam splitter and piezo actuated reference mirror for illuminating a device providing an object beam and reference mirror for providing a reference beam, upon the reflection of both beams, produces interference of the object beam by the reference beam for providing absolute phase observations of the device, that may be a MEMS device under test. | 10-23-2008 |
20090065801 | Surface plasmon polariton actuated transistors - A surface plasmon polaritron activated semiconductor device uses a surface plasmon wire that functions as an optical waveguide for fast communication of a signal and functions as a energy translator using a wire tip for translating the optical signal passing through the waveguide into plasmon-polaritron energy at a connection of the semiconductor device, such as a transistor, to activate the transistor for improved speed of communications and switching for preferred use in digital systems. | 03-12-2009 |
20090110021 | Plasmon stabilized unimodal laser diodes - A device having a light cavity includes, at one end, a plasmonic reflector having a grating surface for coupling incoming light into traverse plasmon waves and for coupling the traverse plasmon wave into broaden light, the surface serving to redistribute light within the cavity, the reflector being well suited for use in laser diodes for redistributing filamental cavity laser light into spatially broaden cavity laser light for translating multimodal laser light into unimodal laser light for improved reliability and uniform laser beam creation. | 04-30-2009 |
20110280273 | PLASMON STABILIZED LASER DIODES - A device having a light cavity includes, at one end, a plasmonic reflector having a grating surface for coupling incoming light into traverse plasmon waves and for coupling the traverse plasmon wave into broaden light, the surface serving to redistribute light within the cavity, the reflector being well suited for use in laser diodes for redistributing filamental cavity laser light into spatially broaden cavity laser light for translating multimodal laser light into unimodal laser light for improved reliability and uniform laser beam creation. | 11-17-2011 |
20130125676 | RADIO FREQUENCY TRANSPARENT THERMAL WINDOW - A radio-frequency transparent window having internal conduits for the passage of cooling fluid is configured for simulating a highly uniform thermal environment for testing a device intended for use in space. The device to be tested is placed within a chamber in which a vacuum condition is maintained by a radio-frequency transparent pressure window under a pressure seal. Within the chamber, the thermal window is positioned adjacent, but not in contact with, the pressure window. A radio frequency signal is capable of passing directly through both the thermal window and the pressure window to permit communication with the device being tested within the housing. The thermal window is not in contact with the device so there in no conduction of heat from the device. Radiant heat transfer may occur from the device to the thermal window. | 05-23-2013 |
Kevin Osborn, Santa Cruz, CA US
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20090077018 | SYSTEM AND METHOD OF HANDLING FILE METADATA - A network storage system comprises data storage, one or more file system APIs, and a metadata handler. The data storage can comprise file data and associated metadata. The file system APIs can be configured to read and write file data and metadata to and from the data storage. The metadata handler can have a library of functions for handling the metadata. The library can include a metadata blob creation function and a metadata blob extraction function. The metadata blob creation function cooperates with the file system APIs to read source metadata associated with specified file data and creates and populates a metadata blob from which a substantial copy of the source metadata can be generated. The metadata blob extraction function receives at least a metadata blob, extracts information from the metadata blob, and cooperates with the file system APIs to generate destination metadata, a substantial copy of the source metadata. | 03-19-2009 |
20130013643 | SYSTEM AND METHOD OF HANDLING FILE METADATA - A network storage system comprises data storage, one or more file system APIs, and a metadata handler. The data storage can comprise file data and associated metadata. The file system APIs can be configured to read and write file data and metadata to and from the data storage. The metadata handler can have a library of functions for handling the metadata. The library can include a metadata blob creation function and a metadata blob extraction function. The metadata blob creation function cooperates with the file system APIs to read source metadata associated with specified file data and creates and populates a metadata blob from which a substantial copy of the source metadata can be generated. The metadata blob extraction function receives at least a metadata blob, extracts information from the metadata blob, and cooperates with the file system APIs to generate destination metadata, a substantial copy of the source metadata. | 01-10-2013 |
Kevin Jordan Osborn, Yucaipa, CA US
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20120066253 | Mapping Product Identification Information To A Product - Mapping product identification data to product information. Generating classifiers operative to classify products referred to in product identification data. Receiving client product identification data. Applying at least one generated classifier on the received product identification data. Using at least one classification determined by the applied classifier(s) and a subset of the client product identification data to query the product database. Qualifying the results of the query using at least one classification. | 03-15-2012 |
Kyre Madeleine Osborn, San Francisco, CA US
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20150331842 | SYSTEMS AND METHODS FOR SELECTING CONTENT ITEMS AND GENERATING MULTIMEDIA CONTENT - Systems, methods, and non-transitory computer-readable media can detect a trigger event for generating multimedia content. A set of content items associated with a user account can be identified. Information associated with at least one of the set of content items or the user account can be acquired. A subset of content items can be selected out of the set of content items based on the information. In some embodiments, each content item in the subset can satisfy specified selection criteria. The multimedia content can be generated based on the subset of content items. | 11-19-2015 |
Michael Osborn, Los Angeles, CA US
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20110159158 | REDUCED NON-FIBER CARBOHYDRATE PRESERVATIVE TREATMENT FOR PROCESSED FOODS - The present invention is comprised of a process and multiple reduced non-fiber carbohydrate preservative treatment ingredients to control water activity (aw) in the processing of food components to extend shelf life of processed foods. The process includes formulating a specific combination of the multiple treatment ingredients to effectively produce a desired water activity (aw) level using measurements of water activity (aw) in the food components. The multiple treatment ingredients include using soluble fiber and salt to control water activity (aw) to extend shelf life and not significantly add to the non-fiber carbohydrate and calorie levels of the processed food product. | 06-30-2011 |
20120258234 | INCREASED DIETARY FIBER METHOD AND TREATMENT FOR PROCESSED FOODS - The present invention is comprised of an increased dietary fiber method and treatment for processed foods to add dietary fiber to processed foods, control water activity (aw) and increase the pliability of the high fiber ingredients during mixing, blending and forming operations. The method adds soluble fiber ingredients to the processed food mixtures to provide consumers with a high fiber source to meet recommended daily Adequate Intake of fiber. The method additionally reduces non-fiber carbohydrate sources and sugar alcohols providing other beneficial physiological effects and helps to control water activity by using liquid soluble fiber to bind water adding to the shelf life of the processed food products. The treatment increases the pliability of the ingredient mixtures to more thoroughly combine, mix and blend the ingredients. The treatment continues to provide increased pliability of the completed product mixture during a product forming process. | 10-11-2012 |
Michael J. Osborn, Oakland, CA US
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20130105350 | Informative Packaging And Wrapping Product | 05-02-2013 |
Nathan W. Osborn, Menlo Park, CA US
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20110022961 | Interactive User Interface - A user interface for an interactive information distribution system comprising a graphics region, a video region and a mask/reveal layer. The user interface is generated in a head end of the system as a digital bitstream and transmitted to subscriber equipment for display. Operation of the user interface is facilitated by functions on both a local level with the subscriber equipment and on a system level within the head end. One embodiment of the user interface is an interactive program guide. | 01-27-2011 |
20140123189 | Data Structure and Methods for Providing an Interactive Program Guide - A program guide in which a video layer includes a plurality of video objects including title objects, each title object having associated with it a channel and at least one time slot, the video layer being formed in response to a received video stream; and a graphics layer comprising a plurality of graphics objects including title overlay objects, each of the title overlay objects selectively imparting at least a visual de-emphasis to a respective title object in the video layer, the visual de-emphasis being imparted to title objects not being associated with a desired time slot. | 05-01-2014 |
Nathan W. Osborn, Palo Alto, CA US
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20140043933 | Calibration of Multiple Aperture Ultrasound Probes - The quality of ping-based ultrasound imaging is dependent on the accuracy of information describing the precise acoustic position of transmitting and receiving transducer elements. Improving the quality of transducer element position data can substantially improve the quality of ping-based ultrasound images, particularly those obtained using a multiple aperture ultrasound imaging probe, i.e., a probe with a total aperture greater than any anticipated maximum coherent aperture width. Various systems and methods for calibrating element position data for a probe are described. | 02-13-2014 |
Neal Osborn, Milpitas, CA US
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20090276494 | MUTUAL SCHEDULING OF EVENTS ON HANDHELD COMPUTERS - An embodiment of the invention provides a method for scheduling an event. The method includes signaling a request from a first computer to schedule an event to a second computer. A schedule is then received from the second, the schedule includes indicators of available time periods in the calendar period from the second computer. A consolidated schedule is then generated. The consolidated schedule comprises information comparing the indicators of available time periods from the second computer with indicators of available time periods from the first computer. | 11-05-2009 |
20100045626 | METHOD AND SYSTEM FOR CHANGING THE POWER STATE OF A PORTABLE ELECTRONIC DEVICE - A method and system for changing the power state of a portable electronic device is disclosed. A portable electronic device may be powered up or powered down responsive to a user interaction with the portable electronic device. The user interaction may be an insertion of a stylus or other user interface object into a housing of the portable electronic device. Alternatively, the user interaction may be a removal of a stylus or other user interface object from the housing of the portable electronic device. The user interaction may be a rotation of a cover of the portable electronic device. | 02-25-2010 |
Neal A. Osborn, Milpitas, CA US
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20110119511 | SYSTEM FOR MANAGING POWER OF PERIPHERAL COMMUNICATIONS BY AUTOMATICALLY CLOSING COMMUNICATIONS CHANNEL IMMEDIATELY AFTER FINISHING A COMMUNICATION WITH A PERIPHERAL DEVICE - An improved method and apparatus manages communications port contention and power consumption for a handheld computer, particularly handheld computers with a communications protocol that boosts power consumption when active, such as an RS-232 protocol. The improved method provides communications channel management that automatically opens the communications channel in response to a wake-up signal sent to a handheld computer from a peripheral device. The computer peripheral device is explicitly and/or implicitly identified. The opened communications channel is closed in response to receiving some data from the peripheral device, and/or after a device timeout expires without the handheld computer receiving data from the computer peripheral device. | 05-19-2011 |
Norbert Osborn, Los Angeles, CA US
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20100099518 | GOLF BALL MARKER - Providing visual cues to a golfer to instruct or remind the golfer as to aspects of better play. The visual cues are placed on a device which may be planted on a golf course to mark ball location on the golf course, so that the ball may be removed and subsequently replaced at the same location. The apparatus may comprise a circular pad bearing indicia which is visible from above and a spike which projects downwardly to engage the ground. An associated method combines the functions of marking ball location and receiving golfing instruction, using the novel apparatus. | 04-22-2010 |
Olivia Osborn, Solana Beach, CA US
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20130345392 | EDN3-LIKE PEPTIDES AND USES THEREOF - This application discloses novel EDN3-like polypeptides. One such short polypeptide is EDN3 97-140, which is a 44 amino acid peptide that stimulates GLP-1 secretion in enteric cells and inhibits gluconeogenesis in hepatic cells. EDN3 97-140, as well as other EDN3-like polypeptides provided herein may be used in the study and treatment of a number of indications, including the treatment of metabolic disorders such as obesity and diabetes. | 12-26-2013 |
Philip R. Osborn, San Jose, CA US
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20080303132 | Semiconductor chip packages having cavities - Packaged microelectronic elements are provided which include a dielectric element, a cavity, a plurality of chip contacts and a plurality of package contacts, and microelectronic elements having a plurality of bond pads connected to the chip contacts. | 12-11-2008 |
20110147928 | MICROELECTRONIC ASSEMBLY WITH BOND ELEMENTS HAVING LOWERED INDUCTANCE - Microelectronic assemblies can have multiple conductive bond elements, e.g., bond wires, or a lead bond and a bond wire, extending between a pair of a substrate contact and a chip contact. E.g., a first bond wire can have ends joined to the contacts of the chip and substrate. A second bond wire can be joined to the ends of the first bond wire so that the second bond wire does not touch either the chip contact or the substrate contact to which the first bond wire is joined. In one example, a bond wire has a looped connection with first and second ends joined at a first contact and a middle portion joined to a second contact. In one example, first and second bond elements, e.g., bond wires or lead bonds can connect first and second pairs of a substrate contact with a chip contact. A third bond element, e.g., a bond wire or bond ribbon, can be joined to ends of the first and second bond elements. | 06-23-2011 |
20110147953 | MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED INDUCTANCE - A microelectronic assembly includes a semiconductor chip having chip contacts exposed at a first face and a substrate juxtaposed with a face of the chip. A conductive bond element can electrically connect a first chip contact with a first substrate contact of the substrate, and a second conductive bond element can electrically connect the first chip contact with a second substrate contact. The first bond element can have a first end metallurgically joined to the first chip contact and a second end metallurgically joined to the first substrate contact. A first end of the second bond element can be metallurgically joined to the first bond element. The second bond element may or may not touch the first chip contact or the substrate contact. A third bond element can be joined to ends of first and second bond elements which are joined to substrate contacts or to chip contacts. In one embodiment, a bond element can have a looped connection, having first and second ends joined at a first contact and a middle portion joined to a second contact. | 06-23-2011 |
20110285020 | MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED INDUCTANCE - A microelectronic assembly includes a semiconductor chip having chip contacts exposed at a first face and a substrate juxtaposed with a face of the chip. A conductive bond element can electrically connect a first chip contact with a first substrate contact of the substrate, and a second conductive bond element can electrically connect the first chip contact with a second substrate contact. The first bond element can have a first end metallurgically joined to the first chip contact and a second end metallurgically joined to the first substrate contact. A first end of the second bond element can be metallurgically joined to the first bond element. The second bond element may or may not touch the first chip contact or the substrate contact. A third bond element can be joined to ends of first and second bond elements which are joined to substrate contacts or to chip contacts. In one embodiment, a bond element can have a looped connection, having first and second ends joined at a first contact and a middle portion joined to a second contact. | 11-24-2011 |
20110291297 | MICROELECTRONIC PACKAGES HAVING CAVITIES FOR RECEIVING MICROELECTRONIC ELEMENTS - Packaged microelectronic elements are provided which include a dielectric element, a cavity, a plurality of chip contacts and a plurality of package contacts, and microelectronic elements having a plurality of bond pads connected to the chip contacts. | 12-01-2011 |
20120280386 | PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE - A microelectronic assembly includes a substrate having a first surface and a second surface remote from the first surface. A microelectronic element overlies the first surface and first electrically conductive elements are exposed at one of the first surface and the second surface. Some of the first conductive elements are electrically connected to the microelectronic element. Wire bonds have bases joined to the conductive elements and end surfaces remote from the substrate and the bases, each wire bond defining an edge surface extending between the base and the end surface. An encapsulation layer extends from the first surface and fills spaces between the wire bonds such that the wire bonds are separated by the encapsulation layer. Unencapsulated portions of the wire bonds are defined by at least portions of the end surfaces of the wire bonds that are uncovered by the encapsulation layer. | 11-08-2012 |
20130203216 | PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE - A method of making a microelectronic package includes forming a dielectric encapsulation layer on an in-process unit having a substrate having a first surface and a second surface remote therefrom. A microelectronic element is mounted to the first surface of the substrate, and a plurality of conductive elements exposed at the first surface, at least some of which are electrically connected to the microelectronic element. Wire bonds have bases joined to the conductive elements and end surfaces remote from the bases and define an edge surface extending away between the base and the end surface. The encapsulation layer is formed to at least partially cover the first surface and portions of the wire bonds with unencapsulated portions of the wire bonds being defined by at least one of the end surface or a portion of the edge surface that is uncovered thereby. | 08-08-2013 |
20130292834 | MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED INDUCTANCE - First and second bond elements, e.g., wire bonds, electrically connect a chip contact with one or more substrate contacts of a substrate, and can be arranged so that the second bond element is joined to the first bond element at each end and so that the second bond element does not touch the chip contact or one or more substrate contacts. A third bond element can be joined to ends of the first and second bond elements. In one embodiment, a bond element can have a looped connection, having first and second ends joined at a first contact and a middle portion joined to a second contact. | 11-07-2013 |
20140021641 | MICROELECTRONIC PACKAGES HAVING CAVITIES FOR RECEIVING MICROELECTRONIC ELEMENTS - Packaged microelectronic elements are provided which include a dielectric element, a cavity, a plurality of chip contacts and a plurality of package contacts, and microelectronic elements having a plurality of bond pads connected to the chip contacts. | 01-23-2014 |
20140124565 | MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED INDUCTANCE - First and second bond elements, e.g., wire bonds, electrically connect a chip contact with one or more substrate contacts of a substrate, and can be arranged so that the second bond element is joined to the first bond element at each end and so that the second bond element does not touch the chip contact or one or more substrate contacts. A third bond element can be joined to ends of the first and second bond elements. In one embodiment, a bond element can have a looped connection, having first and second ends joined at a first contact and a middle portion joined to a second contact. | 05-08-2014 |
20150091118 | PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE - A method of making a microelectronic package includes forming a dielectric encapsulation layer on an in-process unit having a substrate having a first surface and a second surface remote therefrom. A microelectronic element is mounted to the first surface of the substrate, and a plurality of conductive elements exposed at the first surface, at least some of which are electrically connected to the microelectronic element. Wire bonds have bases joined to the conductive elements and end surfaces remote from the bases and define an edge surface extending away between the base and the end surface. The encapsulation layer is formed to at least partially cover the first surface and portions of the wire bonds with unencapsulated portions of the wire bonds being defined by at least one of the end surface or a portion of the edge surface that is uncovered thereby. | 04-02-2015 |
Scott Osborn, Rancho Palos Verdes, CA US
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20150178662 | ANALYZING AUTOMOTIVE INSPECTIONS - For analyzing automotive inspections, a recording module records a plurality of inspection results. Each inspection result comprises a technician identifier and an inspection item recommendation for each of a plurality of inspection items. Each inspection item comprises a target recommendation. The inspection item recommendation comprises one of a no service required recommendation and a service recommendation. An identification module identifies a recommendation bias in response to a function of first inspection item recommendations for a first inspection item of the plurality of inspection results exceeding a first target recommendation for the first inspection item. | 06-25-2015 |
Steve Osborn, Mountain View, CA US
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20140056419 | CLOUD BASED CONTACT CENTER PLATFORM POWERED BY INDIVIDUAL MULTI-PARTY CONFERENCE ROOMS - The present disclosure includes a system and method for handling customer service requests in a virtual computing environment supporting multimedia interactions. In some embodiments, the system includes an automated management tool for receiving a customer service request from a client device, a server for establishing an individualized communication session, and a plurality of available resources capable of being connected to the individualized communication session. In some embodiments, the method includes receiving and establishing a connection between an automated management tool and a client device, receiving a customer service request from the client device, establishing an individualized communication session, and providing resources to the individualized communication session. | 02-27-2014 |
Thomas C. Osborn, Sacramento, CA US
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20090061449 | SYSTEMS AND METHODS FOR PROCESSING HYBRID SEED - The present disclosure provides for systems and method for producing hybrid seed. In various embodiments, the disclosure provides a system for the high-throughput, nondestructive sampling of seeds. In another embodiment, a high-throughput, nondestructive method for producing hybrid seeds comprises removing a sample from a plurality of seeds in the population while preserving the germination viability of the seed and analyzing the sample for the presence or absence of one or more genetic markers indicative of a male-sterile gene. | 03-05-2009 |