Chong, MY
Aun Choon Chong, Penang MY
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20140191119 | SINGLE TRACK THREE-CHANNEL ENCODER WITH DIFFERENTIAL INDEX - An optical encoder is disclosed. Specifically, a three-channel encoder is disclosed which utilizes a single track for all three channels. An index channel is provided on the same optical track as the first and second channels which are used to determine incremental angular position. Thus, a more compact and simple three-channel encoder is provided. | 07-10-2014 |
Boon Keat Chong, Kuala Lumpur MY
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20080279025 | Electronic Circuit with Memory for Which a Threshold Level is Selected | 11-13-2008 |
Chaung Sim Chong, Penang MY
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20090255033 | SURFACE MODIFICATION OF ELASTOMERIC ARTICLES - The invention disclosed herein relates to improved elastomeric articles and processes for making the elastomeric articles. In particular, the invention relates to the surface modification of elastomeric articles such as industrial, surgical, and examination gloves that provides for improved consistency with respect to surface tack on a single article, between different articles from a single production batch, and between articles from separate production batches. The surface modification treatment comprises application of an aqueous mixture of silicone emulsion and ammonium salts of alkyl phosphates to the surfaces of elastomeric articles. | 10-15-2009 |
Chee Keong Chong, Seberang Jaya MY
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20080245956 | PHOTODETECTOR ARRAY AND CODEWHEEL CONFIGURATION FOR FLEXIBLE OPTICAL ENCODER RESOLUTION - An optical encoder includes a coding element having a track with multiple transparent sections, a light source positioned to output light to the track, and a photodetector array, positioned to detect light that passes through the transparent sections of the track. The photodetectors of the photodetector array have larger width dimensions than the width dimensions of the transparent sections of the track. Resolution of the optical encoder may be adjusted by changing the resolution of the coding element. | 10-09-2008 |
Chee Khon Chong, Georgetown MY
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20160141097 | MULTI-PLANE RECEIVING COIL FOR WIRELESSLY CHARGING A BATTERY - A multi-plane receiving coil structure includes a receiving coil having at least a first planar section and a second planar section where the windings of the receiving coil each traverse both planar sections. The planar sections include at least two planar sections that are not parallel, and which can be “L,” “J,” or “U” shaped. The receiving coil structure is disposed in a device that includes, or is coupled to, a battery to be charged by receiving energy from a charging coil of a wireless charger via the receiving coil structure. | 05-19-2016 |
20160141899 | APPARATUS AND METHOD FOR FULL-ORIENTATION OVER-THE-AIR CHARGING IN PORTABLE ELECTRONIC DEVICES - An apparatus and method for full-orientation over-the-air charging includes a receiver coil associated with a portable electronic device for wireless charging; and a repeater coil associated with a device selectively configured to engage or support the portable electronic device for wireless charging, wherein the device is one of a cover, holster, or case for the portable electronic device; wherein, when the device is selectively engaged or supporting the portable electronic device, a portion of the repeater coil overlaps a portion of the receiver coil forming a magnetic coupling therebetween and supporting wireless charging of the portable electronic device in a plurality of orientations of the portable electronic device relative to a transmitter coil. | 05-19-2016 |
Chiew Let Chong, Kajang MY
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20140296550 | PROCESS FOR FRACTIONATING CRUDE TRIGLYCERIDE OIL - The present invention relates to an improved process for fractionating triglyceride oil. The process according to the present invention attains a reproducible crystallization by introducing a controlled temperature profile and ensuing crystal development that reduce the amount of entrapped olein inside the crystals or crystal aggregates. The process of the present invention may be used to fractionate vegetable oils such as palm oil or its blends with other palm oil products or edible vegetable oils. | 10-02-2014 |
Chin Wah Nyee Chong, Selangor Darul Ehsan MY
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20080238115 | Impact Energy Dissipation Device - An impact energy dissipation device for the prevention of high-speed vehicles and more specifically automotive vehicles, aircraft, helicopters, components and the like from receiving high-speed impact energy directly onto their structures in case of a collision. The device is to isolate high-speed impact energy from the crashworthy structures by breaking down the huge impact energy with many small manageable shear fragments. The device includes a slidable assembly with a series of resistive pins with predetermined shear strength, staggered in two tandem rows to shear in a controlled manner that only one pin is sheared at a time thereof bearing an approximate equivalent of one shear pin load transmission throughout a collision. | 10-02-2008 |
Chooi Mei Chong, Gopeng MY
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20130200532 | Semiconductor Device Using Diffusion Soldering - A method includes providing a semiconductor chip having a first main surface and a second main surface. A semiconductor chip is placed on a carrier with the first main surface of the semiconductor chip facing the carrier. A first layer of solder material is provided between the first main surface and the carrier. A contact clip including a first contact area is placed on the semiconductor chip with the first contact area facing the second main surface of the semiconductor chip. A second layer of solder material is provided between the first contact area and the second main surface. Thereafter, heat is applied to the first and second layers of solder material to form diffusion solder bonds between the carrier, the semiconductor chip and the contact clip. | 08-08-2013 |
Chooi Mei Chong, Melaka MY
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20140097528 | CHIP ARRANGEMENTS, A CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP ARRANGEMENT - A chip package is provided. The chip package includes a chip carrier, a voltage supply lead, a sensing terminal and a chip disposed over the chip carrier. The chip includes a first terminal and a second terminal, wherein the first terminal electrically contacts the chip carrier. The chip package also includes an electrically conductive element formed over the second terminal, the electrically conductive element electrically coupling the second terminal to the voltage supply lead and the sensing terminal. | 04-10-2014 |
20140284777 | Multi-Chip Semiconductor Power Device - A semiconductor device includes a first semiconductor power chip mounted over a first carrier and a second semiconductor power chip mounted over a second carrier. The semiconductor device further includes a contact clip mounted over the first semiconductor power chip and on the second semiconductor power chip. A semiconductor logic chip is mounted over the contact clip. | 09-25-2014 |
20140291849 | Multi-Level Semiconductor Package - A semiconductor package includes a semiconductor die having a first electrode at a first side and a second electrode at a second side opposing the first side, a first lead under the semiconductor die and connected to the first electrode at a first level of the package, and a second lead having a height greater than the first lead and terminating at a second level in the package above the first level, the second level corresponding to a height of the semiconductor die. A connector of a single continuous planar construction over the semiconductor die and the second lead is connected to both the second electrode and the second lead at the same second level of the package. | 10-02-2014 |
20150092375 | Transistor arrangement with semiconductor chips between two substrates - An electronic device comprising a first substrate, a second substrate, a first semiconductor chip comprising a transistor, comprising a first mounting surface bonded to the first substrate and comprising a second mounting surface bonded to the second substrate, and a second semiconductor chip comprising a first mounting surface bonded to the first substrate and comprising a second mounting surface bonded to the second substrate, wherein the first semiconductor chip comprises a via electrically coupling a first transistor terminal at its first mounting surface with a second transistor terminal at its second mounting surface. | 04-02-2015 |
20160056092 | Leadframe and method of manufacturing the same - A hybrid leadframe is provided comprising a thin leadframe layer comprising a diepad and a structured region; and a metal layer being thicker than the thin leadframe layer and arranged on the diepad. | 02-25-2016 |
20160086876 | Electronic Component - In an embodiment, an electronic component includes a dielectric layer, a semiconductor device embedded in the dielectric layer, an electrically conductive substrate, a redistribution layer having a first surface and a second surface providing at least one outer contact, and a first electrically conductive member. The semiconductor device has a first surface including at least one first contact pad and a second surface including at least one second contact pad. The second contact pad is mounted on the electrically conductive substrate. The first electrically conductive member includes at least one stud bump and extends between the electrically conductive substrate and the first surface of the redistribution layer. | 03-24-2016 |
Chooi Mei Chong, Perak MY
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20120074546 | Multi-chip Semiconductor Packages and Assembly Thereof - Semiconductor packages and method of fabricating them are described. In one embodiment, the semiconductor package includes a substrate having a first and a second die attach pad. A first die is disposed over the first die attach pad. A second die is disposed over the second die attach pad. A third die is disposed between the first and the second die. The third die having a first, a second, and a third portion such that the first portion is disposed above a portion of the first die, the second portion is disposed above a portion of the second die, and the third portion is disposed above an area between the first die and the second die. | 03-29-2012 |
Chuang Sim Chong, Kedah MY
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20150284584 | Hydrophilic/Hydrophobic Aqueous Polymer Emulsions and Products and Methods Relating Thereto - Methods for preparing copolymeric emulsions from at least one water soluble monomer and at least one water insoluble monomer are disclosed herein. In some embodiments, one or more surfactants and stabilizers may be used. In some embodiments, the monomers used in the process include, by total monomer weight, at least 50% water soluble monomers and at least 10% water insoluble monomers. Copolymer emulsions formed from the reaction product of at least one water soluble monomer and at least one water insoluble monomer are also disclosed along with articles coated with such emulsions and coating formulations made from such emulsions as well as methods for the manufacture and coating of such articles. | 10-08-2015 |
Chuang Sim Chong, Bukit Mertajam MY
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20120107485 | GLOVE COATING AND MANUFACTURING PROCESS - This invention relates to an elastomeric article with improved lubricity and donnablity and reduced stickiness/tackiness. According to the methods of the invention, the internal surface of the elastomeric article is coated with a polyisoprene coating. The coating of the invention is formed from synthetic polyisoprene rubber that may or may not contain minor amounts of other components. The coating is preferably directly bonded to the underlying elastomeric article. | 05-03-2012 |
20120121838 | GLOVE COATING AND MANUFACTURING PROCESS - This invention relates to an elastomeric article with improved lubricity and donnablity and reduced stickiness/tackiness. According to the methods of the invention, the internal surface of the elastomeric article is coated with a polyisoprene coating. The coating of the invention is formed from synthetic polyisoprene rubber that may or may not contain minor amounts of other components. The coating is preferably directly bonded to the underlying elastomeric article. | 05-17-2012 |
Chuang Sim Chong, Penang MY
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20150113704 | HYDROPHILIC/HYDROPHOBIC AQUEOUS POLYMER EMULSIONS AND PRODUCTS AND METHODS RELATING THERETO - Methods for preparing copolymeric emulsions from at least one water soluble monomer and at least one water insoluble monomer are disclosed herein. In some embodiments, one or more surfactants and stabilizers may be used. In some embodiments, the monomers used in the process include, by total monomer weight, at least 50% water soluble monomers and at least 10% water insoluble monomers. Copolymer emulsions formed from the reaction product of at least one water soluble monomer and at least one water insoluble monomer are also disclosed along with articles coated with such emulsions and coating formulations made from such emulsions as well as methods for the manufacture and coating of such articles. | 04-30-2015 |
Chuang Sim Chong, Greenlane MY
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20150342274 | Coated elastomeric article - This invention relates to an elastomeric article with improved lubricity and donnablity and reduced stickiness/tackiness. According to the methods of the invention, the internal surface of the elastomeric article is coated with a polyisoprene coating. The coating of the invention is formed from synthetic polyisoprene rubber that may or may not contain minor amounts of other components. The coating is preferably directly bonded to the underlying elastomeric article. | 12-03-2015 |
David Chong, Penang MY
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20100258925 | SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME - Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an encapsulating material may be disposed over the semiconductor die. | 10-14-2010 |
20120181675 | SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME - Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an encapsulating material may be disposed over the semiconductor die. | 07-19-2012 |
20130009309 | CONDUCTIVE CHIP DISPOSED ON LEAD SEMICONDUCTOR PACKAGE AND METHODS OF MAKING THE SAME - In one implementation, an apparatus includes a semiconductor die, a lead, a non-conductive epoxy, and a conductive epoxy. The semiconductor die includes an upper surface and a lower surface opposite the upper surface. The lead is electrically coupled to the upper surface of the semiconductor die. The non-conductive epoxy is disposed on a first portion of the lower surface of the semiconductor die. The conductive epoxy is disposed on a second portion of the lower surface of the semiconductor die. In some implementations, a conductive wire extends from the lead to the upper surface of the semiconductor die to electrically couple the lead to the upper surface of the semiconductor die. | 01-10-2013 |
20130307134 | CONDUCTIVE CHIP DISPOSED ON LEAD SEMICONDUCTOR PACKAGE AND METHODS OF MAKING THE SAME - In one implementation, a method of forming a conductive device can include depositing a non-conductive epoxy on a first portion of a lower surface of a semiconductor die, and can include depositing a conductive epoxy on a second portion of the lower surface of the semiconductor die. | 11-21-2013 |
20140167238 | SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME - Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an encapsulating material may be disposed over the semiconductor die. | 06-19-2014 |
David Chong, Bayan Leaps MY
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20090189261 | Ultra-Thin Semiconductor Package - Semiconductor packages with a reduced-height die pad and associated methods for making and using these semiconductor packages are described. The semiconductor packages include a lead frame with die pad of reduced height so the die pad has a height that is less than that of the lead frame. The semiconductor packages may comprise an isolated and/or a fused lead finger with a portion of an upper surface of the isolated lead finger that is removed to form a concavity to which one or more bond wires may be bonded. The upper surface of the isolated lead finger may be removed so the isolated lead finger has a height that is less than the height of the lead frame. And a perimeter of a bottom surface of the fused lead finger may be removed. Other embodiments are described. | 07-30-2009 |
David Chong, Bayan Lepas MY
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20090236711 | METHOD OF MAKING AND DESIGNING LEAD FRAMES FOR SEMICONDUCTOR PACKAGES - A lead frame with patterned conductive runs on the top surface to accept a wire bonded or flip-chip or COL configuration is disclosed. The top pattern is completed and the bottom is etched away creating cavities. The cavities are filled with a pre-mold material that lend structural support of the lead frame. The top is then etch through the lead frame to the pre-mold, except with the top conductive runs exist. In this manner the conductive runs are completed and isolated from each other so that the placement of the runs is flexible. The chips are mounted and the encapsulated and the lead frames are singulated. The pattern on the top and the bottom may be defined by first plated the patterns desired. | 09-24-2009 |
Foo Wing Chong, Penang MY
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20130106304 | DEVICE AND METHOD FOR DRIVING LEDS | 05-02-2013 |
Jonathan Wun Shiung Chong, Kuching MY
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20130248182 | MODULAR MANIFOLD OF A WELLSITE FLUID SYSTEM AND METHOD OF USING SAME - A mobile manifold assembly of a fluid system for providing fluid to a wellsite during well construction. The fluid system includes auxiliary components including at least one fluid source, mixer and high pressure pump. The manifold assembly includes a modular manifold and a mobile frame. The modular manifold includes manifold pumps, valves and pipes integrated together for transport. Connector portions of the pipes extend from the modular manifold in an arrangement corresponding to an arrangement of the auxiliary components to define a plug-in configuration therebetween such that the connector portions of the pipes are positionable in alignment with the auxiliary components for direct and removable connection therewith. The manifold pumps and valves are positioned about the pipes to selectively pump the fluid. The modular manifold is securable to a base of the mobile frame whereby the modular manifold is transportable to the auxiliary components for operable connection therewith. | 09-26-2013 |
Kah Heng Chong, Puchong MY
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20150156197 | SYSTEM AND METHOD FOR TRANSFERRING ELECTRONIC INFORMATION - A system for collecting and transferring electronic information includes one or more servers, having one or more centralized databases for storing or retrieving the data, connected to a network, one or more computing devices connected to the servers via the network for retrieving the data from the centralized databases, and a plurality of biometric devices connected to the servers via the network, located at different locations. Each biometric device comprises a system for identifying users based on biometric data of the users, a system for storing the biometric data and activity information of the users, and a system for sending the biometric data and activity information to the servers, in communication with the servers in real time via the network. | 06-04-2015 |
20160132971 | TIME ATTENDANCE TRACKING METHOD AND SYSTEM - A time attendance tracking method is provided by which a hand-held device is set as a primary device and/or a secondary device based on inherent mobile identity of the hand-held device and operable in either a first mode and/or a second mode. The first mode permits the user to clock-in and/or clock-out for attendance recording for the user tied account while the second mode restricts the user to clock-in and/or clock-out for attendance recording for the user tied account. | 05-12-2016 |
Kean Hoo Chong, Perak MY
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20150312705 | SYSTEM AND METHOD FOR TRANSMITTING, STORING RECEIVING AND/OR RETRIEVING IDENTIFICATION INFORMATION OR DATA AND/OR PAIRING INFORMATION OR DATA BETWEEN ACCESSORIES OR ASSOCIATED PRODUCTS AND SMART ELECTRONIC DEVICES INTO AND/OR FROM ANY DISTINCT SERVER OR STORAGE MEDIA - The present invention relates to a system and method for transmitting, storing receiving and/or retrieving identification information or data and/or pairing information or data between accessories or associated products and smart electronic devices into and/or from any distinct server or storage media. Accordingly, the present invention enables the user to transmit and/or store all identification information or data and/or pairing information or data of accessory or associated products that have been connected or paired to an existing smart device into a distinct server or storage media, and enables those information or data to be retrieved and/or received from the said server or storage media, into the same or another smart electronic device for the purposes of establishing and/or maintain connection and/or communication with the said accessory or associated products without the need to reinitiate the pairing process. | 10-29-2015 |
Kean Hoo Chong, Lahat MY
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20150222740 | WIRELESS ALERTING SYSTEM FOR PERSONAL AREA ASSET SUPERVISION - The present invention relates to a wireless alerting system for personal area asset supervision, the system includes an observing device, using a host apparatus such as Bluetooth, capable of monitoring at least one identifier device located within a selected proximity which encompasses an area in a selected radius of distance; wherein the observing device provides infrastructure for the system including power supply and a user interface; and wherein the identifier device is a generic tag or customized to some extent in the system for attachment to any item. | 08-06-2015 |
20150296477 | WIRELESS PAIRING AND TRACKING SYSTEM FOR LOCATING LOST ITEMS - The present invention relates to a wireless pairing and tracking system for lost item searching, the system includes: a) an observing device (NODE Owner); b) at least one associating identifier device (NODE) with wireless or Radio Frequency (RF) link; c) at least one participating observing device; and d) a host apparatus; wherein the observing device (NODE Owner) and the participating observing device are implemented with suitable application software (NODE-APP) in association with the host apparatus; and wherein any lost identifier devices (LOST-NODE) is discovered by any participating observing device whenever the participating observing device comes near within Radio Frequency (RF) range of the LOST NODE. | 10-15-2015 |
Kok Keong Chong, Kuala Lumpur MY
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20130319506 | SOLAR CONCENTRATOR ASSEMBLY - The present invention provides a solar concentrator assembly comprising a non-imaging dish concentrator and a photovoltaic receiver for the application of concentrator photovoltaic system that provides uniform solar flux, matches the square or rectangular solar images to the square or rectangular dimension of the photovoltaic receiver and produces high solar concentration ratio. The present invention also provides a solar concentrator assembly that is cost effective and has simpler mechanical structure. | 12-05-2013 |
20150207455 | Dense-Array Concentrator Photovoltaic System Utilising Non-Imaging Dish Concentrator And Array Of Crossed Compound Parabolic Concentrators - Disclosed is a solar concentrator assembly ( | 07-23-2015 |
Kok Loong Chong, Rawang MY
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20140142211 | Elastomeric Article - An elastomeric article comprising at least one elastomer and precipitated calcium carbonate particles, wherein the sphere equivalent particle size of said precipitated calcium carbonate particles is less than 1.0 μm. The elastomeric article is preferably produced using a latex dipping process, and is particularly suitable for use as a glove, a condom, or a balloon. | 05-22-2014 |
Kong Sin Chong, Melaka MY
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20150249047 | Interposer with Programmable Matrix for Realizing Configurable Vertical Semiconductor Package Arrangements - An interposer for establishing a vertical connection between semiconductor packages includes an electrically insulating substrate having a first main side and a second main side opposite the first main side, a plurality of first electrical conductors at the first main side of the substrate, a plurality of second electrical conductors at the second main side of the substrate, and a programmable connection matrix at one or both main sides of the substrate. The programmable connection matrix includes programmable junctions configured to open or close electrical connections between different ones of the first electrical conductors and different ones of the second electrical conductors upon programming of the junctions. | 09-03-2015 |
Kow Chee Chong, Kedah MY
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20150245467 | APPARATUS AND METHOD OF MINIATURIZING THE SIZE OF A PRINTED CIRCUIT BOARD - A printed circuit board includes at least one plated-through hole via drilled into at least one of a first layer on a first side of the printed circuit board and a second layer on a second side of the printed circuit board. The printed circuit board also includes a core section laminated between the first layer and the second layer, wherein a length of the core section is shorter than a length of the first layer and a length of the second layer. The printed circuit board further includes an open slot configured to house a connection tab of an electronic product connected to the printed circuit board, wherein the open slot is formed adjacent to the core section and between sections of the first layer and the second layer that are longer than the core section. | 08-27-2015 |
Kow Chee Chong, Bayan Lepas MY
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20110045323 | CURRENT LIMITING APPARATUS AND METHOD - A battery pack ( | 02-24-2011 |
20110104544 | METHOD AND APPARATUS FOR DISASSEMBLING A HERMETICALLY SEALED BATTERY - A battery pack includes a cover coupled to a housing, wherein the cover and the housing are hermetically sealed to enclose one or more batteries. A wire is integrally molded within a perimeter of the cover to allow for the removal of the cover from the housing upon application of current to the wire. The wire is molded within the cover so as to be co-located along an edge of the housing. First and second contacts are coupled to the wire and remain exposed on the cover. The cover can be separated from the housing in response to current being applied to the first and second contacts and pulling of the wire. | 05-05-2011 |
Kow Chee Chong, Penang MY
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20160126764 | EFFICIENT APPARATUS AND METHOD FOR INHIBITING CORROSION WITH DISCHARGE BLOCKING FEATURES IN A BATTERY - A battery pack selectively coupled to a portable electronic device and/or a recharging source, and configured to inhibit corrosion with discharge blocking features, the battery pack includes a positive terminal, a negative terminal, and a data terminal accessible from a housing of the battery pack, wherein each of the positive terminal, the negative terminal, and the data terminal are coupled to a battery in the battery pack; and a discharge blocking circuit configured to allow/block voltage across the positive terminal and the negative terminal based on a presence of a steady state pull up on the data terminal, wherein the steady state pull up is based on the battery pack being coupled to the recharging source, via the positive terminal, the negative terminal, and the data terminal. | 05-05-2016 |
Lai Kuan Chong, Sg. Nibong MY
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20110148887 | GRAPHICS RENDER CLOCK THROTTLING AND GATING MECHANISM FOR POWER SAVING - An example of a controller circuit may include a policy module to generate a power reduction policy output based on a processor power state input. The power reduction policy output may also be generated based on a graphics render engine idleness input. The circuit can also include a clock masking cell to apply a clock masking configuration to a graphics render clock trunk based on the power reduction policy output. | 06-23-2011 |
Lit-Ho Chong, Kulai Johor MY
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20110242891 | OPERATION METHODS FOR MEMORY CELL AND ARRAY FOR REDUCING PUNCH THROUGH LEAKAGE - A method for programming a first memory cell in a memory array. In a specific embodiment, each memory cell has a drain, a source, a channel, and a control gate overlying a charge storage material and the channel. The source of the first memory cell is coupled to the drain of a second memory cell. A voltage is applied to the drain of the first memory cell, and the source of the second memory cell is grounded. The method includes floating the drain of the second memory cell and the source of the first memory cell and turning on the channels of the first and second memory cells, effectively forming an extended channel region. Hot carriers are injected to the charge storage material of the first cell to program the first memory cell. The extended channel lowers electrical fields and reduces punch through leakage in unselected memory cells. | 10-06-2011 |
20120002484 | OPERATION METHODS FOR MEMORY CELL AND ARRAY FOR REDUCING PUNCH THROUGH LEAKAGE - A method for programming a first memory cell in a memory array. In a specific embodiment, each memory cell has a drain, a source, a channel, and a control gate overlying a charge storage material and the channel. The source of the first memory cell is coupled to the drain of a second memory cell. A voltage is applied to the drain of the first memory cell, and the source of the second memory cell is grounded. The method includes floating the drain of the second memory cell and the source of the first memory cell and turning on the channels of the first and second memory cells, effectively forming an extended channel region. Hot carriers are injected to the charge storage material of the first cell to program the first memory cell. The extended channel lowers electrical fields and reduces punch through leakage in unselected memory cells. | 01-05-2012 |
Pee Win Chong, Petaling Jaya Selangor MY
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20130059817 | COMPOSITION FOR REDUCING ABSORPTION OF DIETARY FAT - This invention relates to compositions for reducing the absorption or bioavailability of lipids in the gastrointestinal tract, and to methods for the preparation and use of these compositions. The compositions comprise a source of dietary fibre together with a cyclodextrin. The compositions of the invention are suitable for use in the prevention and treatment of obesity or hyperlipidaemia. | 03-07-2013 |
20160051574 | COMPOSITION FOR REDUCING ABSORPTION OF DIETARY FAT - This invention relates to compositions for reducing the absorption or bioavailability of lipids in the gastrointestinal tract, and to methods for the preparation and use of these compositions. The compositions comprise a source of dietary fibre together with a cyclodextrin. The compositions of the invention are suitable for use in the prevention and treatment of obesity or hyperlipidaemia. | 02-25-2016 |
Pei Pei Chong, Selangor MY
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20130034856 | METHOD FOR DETECTING AND IDENTIFYING CANDIDA SPECIES - The present invention describes a method, based on a semi-nested polymerase chain reaction (PCR), for the detection and identification of ten clinically relevant | 02-07-2013 |
Sek Hoi Chong, Melaka MY
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20090194868 | PANEL LEVEL METHODS AND SYSTEMS FOR PACKAGING INTEGRATED CIRCUITS WITH INTEGRATED HEAT SINKS - Panel level methods and arrangements are described for attaching heat sinks in panel form with dice attached to a leadframe panel. Various methods produce integrated circuit packages each having an exposed heat sink on one outer surface of the package and an exposed die attach pad on a second opposite surface of the package. | 08-06-2009 |
20090212382 | OPTICAL LEADLESS LEADFRAME PACKAGE - Apparatuses and methods directed to a semiconductor chip package having an optical component are disclosed. Packages include a die having a light sensing region and a stress buffer on a first surface, a first opaque encapsulant having an opening therethrough disposed atop the first surface, and a second transparent or translucent encapsulant formed within the first encapsulant opening and directly atop and contacting the light sensing region. A leadless leadframe or other conductive component can be coupled to a second surface of the die. The die may also have light sensitive regions that are shielded by the first encapsulant and/or stress buffer. The stress buffer can be a layer formed at the wafer stage or a dam formed at the panel stage. A customized mold is used while dispensing the first encapsulant such that the opening therethrough is properly formed. | 08-27-2009 |
Shi Chai Chong, Malaysia MY
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20110265821 | TECHNIQUES FOR MAINTAINING A SUBSTRATE PROCESSING SYSTEM - Techniques and systems for maintaining a plasma processing kit consisting of protection and shielding elements without causing damage are introduced. The elements may be made of aluminium, polysilicon and quartz and may be coated with silicon. The surfaces of the elemants show a specified roughness. Precision cleaning and recovery of the contamined kit components of a plasma doping (PLAD) system is used, to extend the life and reusability of the components. The methods described cover the stages of inspection, pre-cleaning, mechanical processing and texturing, post-cleaning, clean-room class cleaning and packaging of the components consisting of quartz, aluminium and/or silicon. Techniques described employ the combination of a variety of means (primarily chemical and mechanical) to achieve the desired levels of cleanliness. The result obtained by methods that include Inductively Coupled Plasma-Mass Spectrometry (ICP-MS) and Laser Particle Count affirm the efficacy of these techniques. | 11-03-2011 |
Shih Jun Chong, Penang MY
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20150186311 | SMART DIRECT MEMORY ACCESS - Disclosed herein is a memory access controller. The memory access controller includes an event detection unit (EDU) to receive an indication that a trigger event has been detected in an electronic component, wherein the EDU is to select a memory access context based on the trigger event. The memory access controller includes an event selector to start a DMA operation based on the memory context. | 07-02-2015 |
Siew Pheng Chong, Penang MY
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20100142718 | NOISE CANCELLING HEADPHONE - A noise cancelling headphone is described. The noise cancelling headphone utilizes a low power consuming noise cancellation circuit wherein an audio input signal is directly fed into the headphone without the use of an additional headphone amplifier. The noise cancelling circuit uses a microphone to pick up ambient noise and produces a signal which is equal in amplitude but opposite in polarity to the ambient noise signal. The resultant signal is mixed with the audio input signal and fed into the speakers of the headphone. This method is advantageous because it uses fewer components than conventional noise cancellation circuits and it also consumes less power due to the use of fewer components. The distortion of the audio input signal is also reduced since no amplification is performed to the audio input signal onboard the noise cancellation circuit. | 06-10-2010 |
Song-Kong Chong, Pingtung County MY
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20140164405 | DYNAMIC DATA MASKING METHOD AND DATABASE SYSTEM - A dynamic data masking method, suitable for a database including plural data, is disclosed in this invention. Each of the data includes plural values and plural keys corresponding to the values. The dynamic data masking method includes steps of: determining whether values and keys of one data are sensitive contents when the data are requested to be written into the database; if one of the values/keys of the data is sensitive, setting a key corresponding to the sensitive value or the key itself as a sensitive key and dynamically establishing a filtering rule corresponding to the key; and then, saving the filtering rule and writing the data into the database. In addition, a database system is also disclosed herein. | 06-12-2014 |
Thow Pang Chong, Sungai Ara MY
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20120274375 | FREQUENCY CONTROL CLOCK TUNING CIRCUITRY - Circuits and a method for tuning an integrated circuit (IC) are disclosed. The IC includes multiple programmable fuses coupled to a control block. The programmable fuses used may be one-time programmable (OTP) fuses. The control block reads settings or data stored in the programmable fuses. A tuning circuit coupled to the control block receives the delay transmitted by the control block. The tuning circuit allows tuning of the IC without changes to the fabrication mask. The tuning circuit may include delay chains to provide additional delay to the IC when needed and the delay in the tuning circuit is configured based on the delay value stored in the programmable fuses and transmitted by the control block. | 11-01-2012 |
Thow-Pang Chong, Johor MY
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20080297192 | TECHNIQUES FOR OPTIMIZING DESIGN OF A HARD INTELLECTUAL PROPERTY BLOCK FOR DATA TRANSMISSION - Techniques are provided for implementing channel alignment for a data transmission interface in an HIP block on a programmable logic integrated circuit. The HIP block channel alignment logic can be run using a reduced number of parallel data paths, which consumes substantially less logic resources. Also, the HIP block channel alignment logic circuits can be processed at the higher HIP core clock rate in serial, decreasing lock latency time. Techniques are provided for implementing error handling for transmitted data in programmable logic circuits. The programmable logic circuits can be configured to implement error generation and error monitoring functions that are tailored for any application. Alternatively, the logic elements can be configured to perform other functions for applications that do not require error handling. The phase skew between data and clock signals on an integrated circuit are reduced by routing clock signals along with the data signals to each circuit block. | 12-04-2008 |
Tze Voon Chong, Petaling Jaya MY
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20140106706 | Process to Reload Mobile Prepaid Airtime Using a Self-Service Terminal Across Multiple Telcos and Multiple Currencies - A system and method for purchasing and reloading airtime for a local and foreign prepaid mobile phone account are disclosed. The system comprises a plurality of payment receiving means which are connected to a wireless protocol cloud ( | 04-17-2014 |
Wei Tuck Chong, Penang MY
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20090276214 | METHOD FOR DUAL CHANNEL MONITORING ON A RADIO DEVICE - A method for dual channel monitoring on a radio device as provided enables efficient use of communication network resources. The method includes receiving at the radio device a first speech signal over a first channel, while simultaneously receiving at the radio device a second speech signal over a second channel. The first speech signal is then processed at the radio device to generate a text transcription of the first speech signal, and the text transcription of the first speech signal is displayed on a display screen of the radio device. An audible voice signal is then produced from a speaker that is operatively connected to the radio device simultaneously with displaying the text transcription of the first speech signal. | 11-05-2009 |
Yang Loong Chong, Selangor MY
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20150068950 | Method of removing oil sludge and recovering oil from oil sludge with nanoemulsion surfactant system - A method of treating a first batch of oil sludge containing entrapped oil residue comprises the steps comprises the steps of bringing into contact the first batch of oil sludge to a liquid composition of an emulsion with or without a carrier, wherein the emulsion comprises an alkylpolyglucoside surfactant in 2 to 40% by weight of total composition; a co-surfactant in 1 to 30% by weight of total composition selected from the group consisting of C3 to C18 alcohols, C3 to C18 alkyl lactates, lecithins, C3 to C18 fatty acids and any mixtures thereof; an oil phase in 15 to 90% by weight of total composition; and an aqueous phase in 0.5 to 20% by weight of total composition; | 03-12-2015 |
Yen-Hwong Chong, Shenzhen MY
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20160091878 | METHOD OF CONTROLLING ELECTRONIC DEVICE - A method for controlling electronic device includes the following blocks. A control signal is received from an earphone jack. A predefined control command corresponding to the control signal is obtained. At least one application associated with the predefined control command is determined whether is initialized. The predefined control command is executed when the at least one application is initialized. | 03-31-2016 |
Yik Leong Chong, Bayan Lepas MY
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20100266158 | SYSTEM AND METHOD FOR OPTICALLY TRACKING A MOBILE DEVICE - A system and method for optically tracking a mobile device uses a first displacement value along a first direction and a second displacement value along a second direction, which are produced using frames of image data of a navigation surface, to compute first and second tracking values that indicate the current position of the mobile device. The first tracking value is computed using the second displacement value and the sine of a tracking angle value, while the second tracking value is computed using the second displacement value and the cosine of the tracking angle value. The tracking angle value is an angle value derived using at least one previous second displacement value. | 10-21-2010 |
20120081283 | Computer Keyboard With Input Device - A computer keyboard integrated with an optical input device is provided. The computer keyboard includes a plurality of keys, a plurality of optical input devices, a controller, and a navigation engine configured to generate an input function in response to finger movement on one or more of the plurality of input devices. The computer keyboard controller is configured to permit the user to assign an input function to one or more of the plurality of optical input devices from a list of input functions. The plurality of optical input devices have firmware capable of stitching two input devices together to provide a combined input function. | 04-05-2012 |
Yik-Leong Chong, Penang MY
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20150177857 | NAVIGATION DEVICE AND IMAGE DISPLAY SYSTEM - There is provided an image display system including a navigation device and an inertial unit. The navigation device outputs displacements at a report rate. The inertial unit may provide an inertial displacement for continuously controlling a cursor motion after the displacements decrease to zero. | 06-25-2015 |