Patent application number | Description | Published |
20090274931 | HARD MAGNET WITH CAP AND SEED LAYERS AND DATA STORAGE DEVICE READ/WRITE HEAD INCORPORATING THE SAME - A method including forming a multilayer structure. The multilayer structure includes a seed layer comprising a first component selected from the group consisting of a Pt-group metal, Fe, Mn, Ir and Co. The multilayer structure also includes an intermediate layer comprising the first component and a second component selected from the group consisting of a Pt-group metal, Fe, Mn, Ir and Co. The second component is different than the first component. The multilayer structure further includes a cap layer comprising the first component. The method further includes heating the multilayer structure to an annealing temperature to cause a phase transformation of the intermediate layer. Also a hard magnet including a seed layer comprising a first component selected from the group consisting of a Pt-group metal, Fe, Mn, Ir and Co. The hard magnet also includes a cap layer comprising the first component. The hard magnet further includes an intermediate layer between the seed layer and the cap layer. The intermediate layer includes the first component and a second component selected from the group consisting of a Pt-group metal, Fe, Mn, Ir and Co. The first component is different than the second component. Additionally, a read/write head including the hard magnet. | 11-05-2009 |
20100108636 | Integrated Tool for Fabricating an Electronic Component - A tool for use in fabricating an electronic component includes a plurality of processing modules and a transfer chamber in communication with each of the plurality of processing modules. The transfer chamber includes a component for transferring a structure to each of the plurality of processing modules. The plurality of processing modules and the transfer chamber are sealed from the surrounding environment and are under a vacuum. The plurality of processing modules includes a first module configured to perform a first process on the structure and a second module configured to perform a second process on the structure. The first process includes performing at least one shaping operation on the structure. | 05-06-2010 |
20100123117 | NON VOLATILE MEMORY CELLS INCLUDING A FILAMENT GROWTH LAYER AND METHODS OF FORMING THE SAME - A non volatile memory cell that includes a first electrode; a variable resistive layer disposed on the first electrode; a filament growth layer disposed on the variable resistive layer, the filament growth layer including dielectric material and metal atoms; and a second electrode. In other embodiments, a memory array is disclosed that includes a plurality of non volatile memory cells, each non volatile memory cell including a first electrode; a variable resistive layer disposed on the first electrode; a filament growth layer disposed on the variable resistive layer, the filament growth layer including clusters of a first electrically conductive atomic component interspersed in an oxidized second atomic component; and a second electrode; at least one word line; and at least one bit line, wherein the word line is orthogonal to the bit line and each of the plurality of non volatile memory cells are operatively coupled to a word line and a bit line. In still other embodiments, methods are disclosed that include forming a non volatile memory cell include forming a first electrode; forming a variable resistive layer on the first electrode; depositing a two phase alloy layer on the variable resistive layer; converting the two phase alloy layer to a filament growth layer; and depositing a second electrode on the filament growth layer, thereby forming a non volatile memory cell. | 05-20-2010 |
20100183957 | Method of Patterned Media Template Formation and Templates - Aspects include methods to produce pattern media templates and the templates. A pattern of resist structures is formed on a first material layer. A conformal layer of a second material is deposited on the resist pattern, covering tops and side walls of the resist structures. The first material is more resistant to ion milling than the second material, and less resistant to plasma etching than the second material. The first material can be amorphous carbon and the second material can be aluminum oxide. The second material is removed on the tops, and preserved on the side walls. The resist structures and portions of the first layer not supporting second layer material are removed by plasma. The remaining structure is 2× denser than the resist pattern. Conformal deposition of second material and ion milling can be repeated. CMP removes the second material down to a portion of remaining first material, and remaining first material is removed by plasma, leaving a 4× denser pitch pattern structure formed from the second material. | 07-22-2010 |
20100285633 | NON VOLATILE MEMORY CELLS INCLUDING A FILAMENT GROWTH LAYER AND METHODS OF FORMING THE SAME - A non volatile memory cell that includes a first electrode; a variable resistive layer disposed on the first electrode; a filament growth layer disposed on the variable resistive layer, the filament growth layer including dielectric material and metal atoms; and a second electrode. In other embodiments, a memory array is disclosed that includes a plurality of non volatile memory cells, each non volatile memory cell including a first electrode; a variable resistive layer disposed on the first electrode; a filament growth layer disposed on the variable resistive layer, the filament growth layer including clusters of a first electrically conductive atomic component interspersed in an oxidized second atomic component; and a second electrode; at least one word line; and at least one bit line, wherein the word line is orthogonal to the bit line and each of the plurality of non volatile memory cells are operatively coupled to a word line and a bit line. In still other embodiments, methods are disclosed that include forming a non volatile memory cell include forming a first electrode; forming a variable resistive layer on the first electrode; depositing a two phase alloy layer on the variable resistive layer; converting the two phase alloy layer to a filament growth layer; and depositing a second electrode on the filament growth layer, thereby forming a non volatile memory cell. | 11-11-2010 |
20100328823 | MAGNETORESISTIVE READER WITH DEMAGNETIZATION FLUX GUIDE - A magnetic reader comprises first and second shields oriented transversely to a media-facing surface, a magnetoresistive stack located between the first and second shields, and a flux guide. The magnetoresistive stack extends from a proximal end oriented toward the media-facing surface to a distal end oriented away from the media-facing surface. The flux guide extends from the first shield toward the second shield, and is spaced from the magnetoresistive stack at the distal end. The flux guide magnetically couples the distal end of the magnetoresistive stack to the first shield. | 12-30-2010 |
20110006033 | Magnetic Device Definition with Uniform Biasing Control - A method of fabricating a magnetic device is described. A mask removing layer is formed on a layered sensing stack and a hard mask layer is formed on the mask removing layer. A first reactive ion etch is performed with a non-oxygen-based chemistry to define the hard mask layer using an imaged layer formed on the hard mask layer as a mask. A second reactive ion etch is performed with an oxygen-based chemistry to define the mask removing stop layer using the defined hard mask layer as a mask. A third reactive ion etch is performed to define the layered sensing stack using the hard mask layer as a mask. The third reactive ion etch includes an etching chemistry that performs at a lower etching rate on the hard mask layer than on the layered sensing stack. | 01-13-2011 |
20110006384 | MAGNETIC TUNNEL JUNCTION HAVING COHERENT TUNNELING STRUCTURE - A magnetic tunnel junction includes an amorphous ferromagnetic reference layer having a first reference layer side and an opposing second reference layer side. The first reference layer side has a greater concentration of boron than the second reference layer side. A magnesium oxide tunnel barrier layer is disposed on the second side of the amorphous ferromagnetic reference layer. The magnesium oxide tunnel barrier layer has a crystal structure. An amorphous ferromagnetic free layer is disposed on the magnesium oxide tunnel barrier layer. | 01-13-2011 |
20110007422 | Protected Transducer for Dead Layer Reduction - A transducer includes magnetic material formed on a substrate that is shaped to include a trailing edge, a leading edge and a pair of opposing sidewalls extending between the trailing edge and the leading edge. A layer of protective material is positioned in contact with each of the pair of sidewalls of the shaped magnetic material. Backfill material surrounds the protective material on each of the pair of sidewalls of the shaped magnetic material. | 01-13-2011 |
20120217598 | MAGNETIC TUNNEL JUNCTION HAVING COHERENT TUNNELING STRUCTURE - A magnetic tunnel junction includes an amorphous ferromagnetic reference layer having a first reference layer side and an opposing second reference layer side. The first reference layer side has a greater concentration of boron than the second reference layer side. A magnesium oxide tunnel barrier layer is disposed on the second side of the amorphous ferromagnetic reference layer. The magnesium oxide tunnel barrier layer has a crystal structure. An amorphous ferromagnetic free layer is disposed on the magnesium oxide tunnel barrier layer. | 08-30-2012 |
20130001721 | MAGNETIC TUNNEL JUNCTION HAVING COHERENT TUNNELING STRUCTURE - A magnetic tunnel junction includes an amorphous ferromagnetic reference layer having a first reference layer side and an opposing second reference layer side. The first reference layer side has a greater concentration of boron than the second reference layer side. A magnesium oxide tunnel barrier layer is disposed on the second side of the amorphous ferromagnetic reference layer. The magnesium oxide tunnel barrier layer has a crystal structure. An amorphous ferromagnetic free layer is disposed on the magnesium oxide tunnel barrier layer. | 01-03-2013 |
20130017317 | LOAD LOCK CONTROL METHOD AND APPARATUS - Method and apparatus for controlling evacuation pressure of a load lock connected to a processing chamber uses prior pressure changes detected in the processing chamber when the load lock communicates with the processing chamber. | 01-17-2013 |
20130180579 | PHOTOVOLTAIC DEVICE HAVING AN ABSORBER MULTILAYER AND METHOD OF MANUFACTURING THE SAME - A photovoltaic device having an absorber multilayer and methods of manufacturing the same are described. The absorber multilayer, which is formed adjacent to a window layer, may include a doped first cadmium telluride layer which contains a first dopant and an intrinsic second cadmium telluride layer. The absorber multilayer may further include at least a third cadmium telluride layer formed adjacent to a back contact. The at least third cadmium telluride layer may include doped or intrinsic cadmium telluride. | 07-18-2013 |
20130183794 | METHOD AND SYSTEM OF PROVIDING DOPANT CONCENTRATION CONTROL IN DIFFERENT LAYERS OF A SEMICONDUCTOR DEVICE - A method and system for controlling the amount of a second material incorporated into a first material by controlling the amount of a third material which can interact with the second material. | 07-18-2013 |
20130327391 | APPARATUS AND METHOD FOR IMPROVING EFFICIENCY OF THIN-FILM PHOTOVOLTAIC DEVICES - A method for producing apparatus for producing and photovoltaic device including semiconductor layers with halide heat treated surfaces that increase grain growth within at least one of the semiconductor layers and improve the interface between the semiconductor layers. The halide heat treatment includes applying and heating multiple coatings of a halide compound on surfaces adjacent to or part of the semiconductor layers. | 12-12-2013 |
20140261688 | HIGH EFFICIENCY PHOTOVOLTAIC DEVICE EMPLOYING CADMIUM SULFIDE TELLURIDE AND METHOD OF MANUFACTURE - A photovoltaic device is disclosed including at least one Cadmium Sulfide Telluride (CdS | 09-18-2014 |
20150041429 | INTEGRATED TOOL FOR FABRICATING AN ELECTRONIC COMPONENT - A tool for use in fabricating an electronic component includes a plurality of processing modules and a transfer chamber in communication with each of the plurality of processing modules. The transfer chamber includes a component for transferring a structure to each of the plurality of processing modules. The plurality of processing modules and the transfer chamber are sealed from the surrounding environment and are under a vacuum. The plurality of processing modules includes a first module configured to perform a first process on the structure and a second module configured to perform a second process on the structure. The first process includes performing at least one shaping operation on the structure. | 02-12-2015 |