Patent application number | Description | Published |
20080289868 | CONNECTION BOARD, AND MULTI-LAYER WIRING BOARD, SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE USING CONNECTION BOARD, AND MANUFACTURING METHOD THEREOF - The present invention provides a connection board that is formed by an insulating resin composition layer made of one layer or two or more layers and a connection conductor that is formed so as to pass through the insulating resin composition layer in its thickness direction at a position where a conductor circuit is connected, and a multi-layer wiring board, a substrate for semiconductor package and a semiconductor package using the connection board, and methods for manufacturing them. | 11-27-2008 |
20090008141 | Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof - The present invention provides a connection board that is formed by an insulating resin composition layer made of one layer or two or more layers and a connection conductor that is formed so as to pass through the insulating resin composition layer in its thickness direction at a position where a conductor circuit is connected, and a multi-layer wiring board, a substrate for semiconductor package and a semiconductor package using the connection board, and methods for manufacturing them. | 01-08-2009 |
20090274586 | MICRO FLUID SYSTEM SUPPORT AND MANUFACTURING METHOD THEREOF - A support unit for a microfluidic system includes a first support; a first adhesive layer provided on a surface of the first support; and a hollow filament laid on a surface of the first adhesive layer to have an arbitrary shape and functioning as a flow channel layer of the microfluidic system. | 11-05-2009 |
Patent application number | Description | Published |
20100071940 | CONNECTING TERMINAL, SEMICONDUCTOR PACKAGE USING CONNECTING TERMINAL AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE - The connection reliability of connecting terminals with displacement gold plating films is improved by connecting terminals comprising a conductive layer, an electroless nickel plating film, a first palladium plating film which is a displacement or electroless palladium plating film with a purity of 99% by mass or greater, a second palladium plating film which is an electroless palladium plating film with a purity of at least 90% by mass and less than 99% by mass, and a displacement gold plating film, wherein the electroless nickel plating film, the first palladium plating film, the second palladium plating film and the displacement gold plating film are laminated in that order on one side of the conductive layer, and the displacement gold plating film is situated on the uppermost surface layer on the opposite side from the conductive layer. | 03-25-2010 |
20110147072 | METHOD FOR SURFACE TREATMENT OF COPPER AND COPPER - An object of the present invention is to provide a copper surface treatment method capable of keeping certainly a bonding strength between a copper surface and a resist, or between a copper surface and an insulating resin without forming irregularities having sizes of more than 1 μm on the copper surface, and a copper treated with the method. The surface treatment method, comprising: a first step of forming, on a copper surface, a nobler metal than the copper discretely; a second step, subsequent to the first step, of forming copper oxide on the copper surface by oxidation with an alkaline solution containing an oxidizing agent; and third step of dissolving the copper oxide so as to be removed, thereby forming irregularities on the copper surface. | 06-23-2011 |
Patent application number | Description | Published |
20090269245 | MICRO FLUID SYSTEM SUPPORT AND MANUFACTURING METHOD THEREOF - A support unit for a microfluidic system includes a first support; a first adhesive layer provided on a surface of the first support; and a hollow filament laid on a surface of the first adhesive layer to have an arbitrary shape and functioning as a flow channel layer of the microfluidic system. | 10-29-2009 |
20090274581 | MICRO FLUID SYSTEM SUPPORT AND MANUFACTURING METHOD THEREOF - A support unit for a microfluidic system includes a first support; a first adhesive layer provided on a surface of the first support; and a hollow filament laid on a surface of the first adhesive layer to have an arbitrary shape and functioning as a flow channel layer of the microfluidic system. | 11-05-2009 |
20090274582 | MICRO FLUID SYSTEM SUPPORT AND MANUFACTURING METHOD THEREOF - A support unit for a microfluidic system includes a first support; a first adhesive layer provided on a surface of the first support; and a hollow filament laid on a surface of the first adhesive layer to have an arbitrary shape and functioning as a flow channel layer of the microfluidic system. | 11-05-2009 |
20090274583 | MICRO FLUID SYSTEM SUPPORT AND MANUFACTURING METHOD THEREOF - A support unit for a microfluidic system includes a first support; a first adhesive layer provided on a surface of the first support; and a hollow filament laid on a surface of the first adhesive layer to have an arbitrary shape and functioning as a flow channel layer of the microfluidic system. | 11-05-2009 |
20090274584 | MICRO FLUID SYSTEM SUPPORT AND MANUFACTURING METHOD THEREOF - A support unit for a microfluidic system includes a first support; a first adhesive layer provided on a surface of the first support; and a hollow filament laid on a surface of the first adhesive layer to have an arbitrary shape and functioning as a flow channel layer of the microfluidic system. | 11-05-2009 |
20090274585 | MICRO FLUID SYSTEM SUPPORT AND MANUFACTURING METHOD THEREOF - A support unit for a microfluidic system includes a first support; a first adhesive layer provided on a surface of the first support; and a hollow filament laid on a surface of the first adhesive layer to have an arbitrary shape and functioning as a flow channel layer of the microfluidic system. | 11-05-2009 |