Chih-Chin
Chih-Chin Chang, Hsinchu TW
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20080224096 | PHOTOLUMINESCENT MATERIAL OF LIGHT-EMITTING DIODE PACKAGE STRUCTURE - An LED package structure including a carrier, an LED chip, an encapsulant and a PL material is provided, wherein the LED chip is disposed on the carrier for emitting light. The encapsulant encapsulates the LED chip. The PL material is distributed in the encapsulant. The PL material is suitable for being excited by the light emitted from the LED chip and scattering the light. Moreover, the present invention provides a novel PL material with a molecular formula of W | 09-18-2008 |
Chih-Chin Chang, Taipei TW
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20140210287 | Annular-Shaped Stator Structure and Method of Manufacture - A method of manufacturing an annular-shaped stator structure includes forming an elongate stator body, the elongate stator body extending along a longitudinal axis, the elongate stator body including first and second ends and a plurality of slots. Electrically-conductive wires are inserted into the slots of the elongate stator body, whereby each of the electronically conductive wires includes a first end and a second end. The elongate stator body is then formed into an annular shape. The first end of the annular-shaped stator body is coupled to the second end of the annular-shaped stator body, and the first end of each electrically-conductive wire is coupled to that wire's respect second end. | 07-31-2014 |
Chih-Chin Chang, New Taipei City TW
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20140208579 | Manufacturing Method of a Stator of an Alternator - The present invention relates to a manufacturing method of a stator of an alternator, providing an elongated stator body having a plurality of parallel grooves, winding a plurality of wires in the plurality of different grooves, and then rolling the elongated stator body wound with the wires into an annular shape to form an annular stator. | 07-31-2014 |
20140210300 | Stator of an Alternator - The present invention relates to a stator of an alternator, providing an elongated stator body having a plurality of parallel grooves, winding a plurality of wires in the plurality of different grooves, and then rolling the elongated stator body wound with the wires into an annular shape to form an annular stator. | 07-31-2014 |
20140210301 | Stator of an Alternator - The present invention relates to a stator of an alternator, providing an elongated stator body having a plurality of parallel grooves, winding a plurality of wires in the plurality of different grooves, and then rolling the elongated stator body wound with the wires into an annular shape to form an annular stator. | 07-31-2014 |
Chih-Chin Hsieh, Hsinchu City TW
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20160064968 | Discharge Balancing Device, Discharge Balancing Method, and Power Supply System - A discharge balancing device, for balancing a plurality of electric energy storage units connected in series in a discharge stage, comprising a plurality of bypass units, respectively connected to the plurality of electric energy storage units in parallel, configured to drain bypass currents from the plurality of electric energy storage units according to control signals; an energy condition measurement circuit, coupled to the plurality of the electric energy storage units, configured to measure energy conditions of the plurality of electric energy storage units; and a balancing control unit, coupled to the energy condition measurement circuit and the plurality of bypass units, configured to generate each of the control signals according to the energy conditions measured by the energy condition measurement circuit, so as to control each of the plurality of bypass units whether to drain a bypass current from a corresponding electric energy storage unit. | 03-03-2016 |
Chih-Chin Hsu, Taipei City TW
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20140053421 | SIMPLE TYPE DUAL AXES OPTOELECTRONIC LEVEL - A simple type dual axes optoelectronic level includes a carrier, an adjustable fixing mechanism, a level sensing device, a container cup holding a liquid, and a reflector. The adjustable fixing mechanism and the container cup are fixed at the carrier. The level sensing device is fixed at the adjustable fixing mechanism and faces the container cup. The reflector is fixed at the bottom surface of the container cup. The level sensing device provides a measuring light beam, which is refracted by the liquid surface to the reflector, and reflected back to the liquid surface by the reflector, and refracted again by the liquid surface to the level sensing device. Through the refraction effect, the level sensing device can detect two angles between the bottom surface of the carrier and the liquid surface. The dual axes optoelectronic level has advantages of simple structure, low cost and differentiating angles of two axes. | 02-27-2014 |
Chih-Chin Huang, Taipei City TW
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20080280077 | Transfer printing structure capable of sensing and indicating intensity of ultraviolet rays - A transfer printing structure capable of sensing and indicating intensity of ultraviolet rays. The transfer printing structure includes a substrate having a transfer print face and a transfer print sensitive layer laid on the transfer print face of the substrate. The transfer print sensitive layer is able to sense environmental ultraviolet rays to change its look. When a pressure is exerted onto a backside of the substrate, the transfer print sensitive layer adhesively attaches to a surface of an article or human body. When the article or human body moves outdoors, the look of the transfer print sensitive layer varies with the intensity of the ultraviolet rays to indicate the intensity of the ultraviolet rays. | 11-13-2008 |
Chih-Chin Ko, Kaohsiung TW
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20140000185 | COMPOSITE DAMPER | 01-02-2014 |
Chih-Chin Liao, Yuanlin TW
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20080303166 | TWO-SIDED SUBSTRATE LEAD CONNECTION FOR MINIMIZING KERF WIDTH ON A SEMICONDUCTOR SUBSTRATE PANEL - A semiconductor die substrate panel is disclosed including a minimum kerf width between adjoining semiconductor package outlines on the panel, while ensuring electrical isolation of plated electrical terminals. By reducing the width of a boundary between adjoining package outlines, additional space is gained on a substrate panel for semiconductor packages. | 12-11-2008 |
20080305306 | SEMICONDUCTOR MOLDED PANEL HAVING REDUCED WARPAGE - A panel is disclosed on which a plurality of integrated circuit package outlines may be fabricated within a plurality of process tools. The panel includes recessed portions in the exposed surfaces of the molding compound and/or the substrate. The recesses relieve stress resulting from disparate coefficients of expansion between the substrate and molding compound applied to the substrate around the integrated circuits. In embodiments, the recesses may be formed as lines scored into the surface of the molding compound or substrate. Alternatively, the recesses may be formed in the solder mask on the substrate during a process for applying the solder mask, or the recesses may be formed in the molding compound during the encapsulation process. | 12-11-2008 |
20080305576 | METHOD OF REDUCING WARPAGE IN SEMICONDUCTOR MOLDED PANEL - A panel is disclosed on which a plurality of integrated circuit package outlines may be fabricated within a plurality of process tools. The panel includes recessed portions in the exposed surfaces of the molding compound and/or the substrate. The recesses relieve stress resulting from disparate coefficients of expansion between the substrate and molding compound applied to the substrate around the integrated circuits. In embodiments, the recesses may be formed as lines scored into the surface of the molding compound or substrate. Alternatively, the recesses may be formed in the solder mask on the substrate during a process for applying the solder mask, or the recesses may be formed in the molding compound during the encapsulation process. | 12-11-2008 |
20080305577 | METHOD OF MINIMIZING KERF WIDTH ON A SEMICONDUCTOR SUBSTRATE PANEL - A semiconductor die substrate panel is disclosed including a minimum kerf width between adjoining semiconductor package outlines on the panel, while ensuring electrical isolation of plated electrical terminals. By reducing the width of a boundary between adjoining package outlines, additional space is gained on a substrate panel for semiconductor packages. | 12-11-2008 |
Chih-Chin Su, Taoyuan TW
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20120249260 | METHOD FOR PERFORMING DYNAMIC IMPEDANCE MATCHING AND A COMMUNICATION APPARATUS THEREOF - Method for performing dynamic impedance matching and communication apparatus thereof are provided. With respect to an operating band of an impedance matching circuit of a communication device, a first number of times of tuning are performed on a first element of an impedance matching circuit, and a second number of times of tuning are performed on a second element of the impedance matching circuit, wherein the first number is different from the second number. | 10-04-2012 |
Chih-Chin Yang, Yongkang City TW
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20120187563 | PLANARIZATION METHOD APPLIED IN PROCESS OF MANUFACTURING SEMICONDUCTOR COMPONENT - A planarization method of manufacturing a semiconductor component is provided. A dielectric layer is formed above a substrate and defines a trench therein. A barrier layer and a metal layer are formed in sequence in the trench. A first planarization process is applied to the metal layer by using a first reactant so that a portion of the metal layer is removed. An etching rate of the first reactant to the metal layer is greater than that of the first reactant to the barrier layer. A second planarization process is applied to the barrier layer and the metal layer by using a second reactant so that a portion of the barrier layer and the metal layer are removed to expose the dielectric layer. An etching rate of the second reactant to the barrier layer is greater than that of the second reactant to the metal layer. | 07-26-2012 |
Chih-Chin Yang, Taipei City TW
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20090024786 | External storage device - An external storage device includes a hard-drive, a flash memory, and a memory arrangement unit. The memory arrangement determines if the tag of the data accessed by a computer stored in the tag list of the memory arrangement unit and controls the hard-drive and the flash memory according to the result of the determination. | 01-22-2009 |
Chih-Chin Yang, Chupei City TW
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20100148698 | AUDIO CONTROLLED LED DECORATION LAMP STRING SYSTEM - The present invention is an audio controlled LED decoration lamp string system that mainly is to design a system with flashing function by inputting the audio source's frequency to directly control the LED decoration lamp string and create the variation of light and shade. The said system can be electrically-conducted in from a first sector capable of providing the AC (alternate current) or DC (direct current) power to a second sector's IC and electrically-conducted in a fifth sector's LED lamp string simultaneously. And, the second sector's IC is separately electrically-conducted with a third sector's MIC (audio source receiver) and a fourth sector's PWM (pulse width modulation). The fourth sector's PWM is then electrically conducted with a fifth sector's LED lamp string to form a complete system. | 06-17-2010 |
Chih-Chin Yeh, Miao-Li TW
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20090273735 | Illuminator assembly with reflective pyramids and liquid crystal display with same - An exemplary illuminator assembly includes light emitting diode (LED) chips and reflective pyramids. The LED chips are arranged in an array and capable of emitting light. The reflective pyramids are arranged in an array complementary to the array of LED chips. Each LED chip is arranged among a plurality of the plurality of reflective pyramids, and each reflective pyramid is arranged among a plurality of the plurality of LED chips. The reflective pyramids include a plurality of reflective surfaces, and the reflective surfaces are inclined to the LED chips and thereby capable of reflecting at least some of the light beams emitted from the LED chips such that the reflected light beams propagate in directions that are closer to a direction normal to the arrays than the directions of said some of the light beams prior to their reflection. | 11-05-2009 |