Patent application number | Description | Published |
20090273071 | IC CHIP MOUNTING PACKAGE AND PROCESS FOR MANUFACTURING THE SAME - In one embodiment of the present invention, an IC chip mounting package is arranged such that an IC chip and a film base member are connected via an interposer, and a section in which the IC chip, the film base member, and the interposer are connected is sealed with sealing resin. The sealing resin is provided by potting sealing resin around the interposer via a potting nozzle, or is provided by potting the sealing resin around the IC chip, that is, via a device hole. Moreover, the sealing resin has a coefficient of linear expansion of not more than 80 ppm/° C., a viscosity of not less than 0.05 Pa·s but not more than 0.25 Pa·s, and also includes filler having a particle size of not more than 1 μm. | 11-05-2009 |
20090302464 | SEMICONDUCTOR DEVICE - A semiconductor device allowing for chip size reduction and thereby cost reduction without being restricted by a layout of bumps comprises a film substrate, an interposer substrate ( | 12-10-2009 |
20100019394 | IC CHIP MOUNTING PACKAGE - In one embodiment of the present invention, an IC chip mounting package includes a film base member and an IC chip connected via an interposer. Connecting terminals on the film base member side of the interposer are provided so as to have a pitch larger than that of connecting terminals of the IC. A device hole is opened to the film base member, and the IC chip is provided in the device hole. A distance between an inner lead leading end and a periphery of the device hole is set as not less than 10 μm. | 01-28-2010 |
20100025681 | IC CHIP PACKAGE AND IMAGE DISPLAY DEVICE INCORPORATING SAME - A liquid crystal driver mounting package in accordance with an embodiment of the present invention contains a film base material and a liquid crystal driver connected to each other via an interposer. The liquid crystal driver includes first alignment marks on its face opposite the interposer. The interposer includes second alignment marks on its face opposite the liquid crystal driver. The first alignment marks and the second alignment marks are separated by about a distance which is in a tolerable range as a combining position where the liquid crystal driver and the interposer are attached when viewed from the normal of the face of the interposer opposite the liquid crystal driver. Thus, an IC chip (liquid crystal driver) package is provided which enables efficient positing of the IC chip and the interposer. | 02-04-2010 |
20100044871 | SEMICONDUCTOR DEVICE, DISPLAY DEVICE, AND ELECTRONIC DEVICE - In order to attain, in a semiconductor device in which a semiconductor element is mounted, formation of a mark of a relatively large size which is easily recognizable by the naked eye or a machine, and which can apply a code system containing enough amount of information for tracing a manufacturing history, a semiconductor device according to the present invention includes an interposer electrically connected to a semiconductor element, which semiconductor device has a mark for displaying at least predetermined information relevant to the semiconductor element. | 02-25-2010 |
20100290192 | SEMICONDUCTOR DEVICE AND DISPLAY APPARATUS - A COF includes, in at least one embodiment, a heat dissipating material on a back surface of an insulating film. The heat dissipating material has a slit for reducing a degree of thermal expansion. Thus, at least one embodiment of the invention provides the COF in which deformation and disconnection of wiring are prevented. | 11-18-2010 |
20100302474 | SOURCE DRIVER, METHOD FOR MANUFACTURING SAME, AND LIQUID CRYSTAL MODULE - In at least one embodiment, a source driver of a film package type, includes: a film substrate; a semiconductor chip on a surface of the film substrate, the semiconductor chip having a plurality of terminals each of which is connectable to an external member, the plurality of terminals including input terminals, output terminals, and third terminals; an input terminal wiring region for receiving first wiring lines which are connected to the input terminals, respectively, the input terminal region being provided on the surface of the film substrate; an output terminal wiring region for receiving second wiring lines which are connected to the output terminals, respectively, the output terminal wiring region being provided on the surface of the film substrate; and sprocket portions at opposite ends of the film substrate, each of the sprocket portions having a copper foil on the surface, and a string of holes, the input terminal wiring region and the output terminal wiring region being provided so as to extend toward opposite ends having no sprocket portion, respectively, the source driver further including a heat conducting patterns for connecting the third terminals, each of which is connected to neither any one of the plurality of first wiring lines nor any one of the plurality of second wiring lines, to the copper foils of the sprocket portions, respectively, the heat conducting patterns being provided on the surface of the film substrate. This makes it possible to provide a source driver, a method for manufacturing the source driver, and a liquid crystal module, each of which can increase a heat dissipation amount. | 12-02-2010 |
20110108979 | SEMICONDUCTOR DEVICE AND DISPLAY APPARATUS - In a COF of an embodiment of the present invention, the smaller distance to edges of a heat-releasing member an area of the heat-releasing member has, the larger openings the area has. Accordingly, a volume per area (an area per length) of the heat-releasing member decreases toward the edges. The arrangement improves flexibility of the COF. This prevents a stress caused by bending the COF from concentrating at the edges. This makes it possible to prevent a line on an insulating film from being broken. Also, it becomes possible to prevent an anisotropic conductive resin from coming off which is used to bond the COF with a display panel in providing the COF in a display apparatus. | 05-12-2011 |