Patent application number | Description | Published |
20100181089 | SEALING STRUCTURE - To minimize thermal influence when integrally forming the sealing member on a flexible wiring board, a sealing structure includes a housing, a flexible wiring board inserted therethrough, and a sealing member integrally formed with the flexible wiring board to airtightly seal a gap between the housing and the flexible wiring board, the flexible wiring board includes a base substrate made of an elastic material, an electrically conductive printed wiring layer formed on a surface of the base substrate, and a cover film covering a surface of the printed wiring layer, and the printed wiring layer which crosses the sealing member is formed as a plurality of divided print wiring layers at only a crossing region with the sealing member and its vicinity. | 07-22-2010 |
20100212953 | SEALING STRUCTURE - To eliminate rubber burr formation at the time of molding and to make sealing members to be surely integrated with the flexible wiring board, a sealing structure consists of housings to which the flexible wiring board is inserted, and sealing members integrally formed on the flexible wiring board to seal gaps between the housings and the flexible wiring board, the flexible wiring board consists of a base board made of an elastic material, a conductive printed wiring layer formed on the surface of the base board, and a cover film covering the surface of the printed wiring layer, and dummy printed wiring layers are arranged in regions where the sealing members are integrated with the flexible wiring board, so as to make a shape as if the printed wiring layer exists substantially over the entire base board in the width direction. | 08-26-2010 |
20100264606 | GASKET - To provide a gasket ( | 10-21-2010 |
20110031703 | SEAL STRUCTURE - In order to provide excellent waterproofness at a low manufacturing cost to a seal structure comprising a housing to which a flexible wiring board ( | 02-10-2011 |
20110069913 | WATERPROOFING DEVICE FOR MOBILE APPARATUS AND METHOD OF MANUFACTURING THE SAME - A waterproofing device for a mobile apparatus, using a thin coaxial cable or an optical cable and capable of being applied to a portable telephone of bi-directionally openable/closable type. A waterproofing device for a mobile apparatus, adapted to connect housings to each other by a linear member. The waterproofing device is provided with seal members consisting of a rubber-like elastic material and sealing a gap between the housings, and also with a connecting member having opposite ends in the vicinities of which the seal members are integrated. The linear member is passed through the inside of the connecting member to electrically interconnect electronic parts of the housings. The connecting member has a circular tube-like shape consisting of a soft resin material. | 03-24-2011 |
20110181003 | SEAL STRUCTURE - To provide a seal structure having seal members which can be easily inserted into insertion holes of a housing, and achieve an excellent sealing performance of the seal members, the seal structure is comprised of a housing provided with insertion holes to which a flexible wiring substrate is inserted, and seal members which are integrally formed on the flexible wiring substrate are made of a rubber elastic material in a bush-shape, and hermetically seal gaps between the insertion holes and the flexible wiring substrate, wherein projected portions are provided on parts of the flexible wiring substrate at positions where the seal members are integrally formed. | 07-28-2011 |
20120074653 | GASKET FOR SMALL SIZE ELECTRONIC APPLIANCE - A waterproof gasket for a small size electronic appliance of the invention has straight portions ( | 03-29-2012 |
Patent application number | Description | Published |
20080254323 | MAGNETIC RECORDING MEDIUM - A magnetic recording medium includes a metal thin-film magnetic layer formed on a non-magnetic substrate. The metal thin-film magnetic layer is formed so that the coercivity measured when a magnetic field is applied with an angle of intersection of 120° between the plane of the non-magnetic substrate and magnetic field lines of the magnetic field and the coercivity measured when the magnetic field is applied with the angle of intersection of 60° are both at least 160 kA/m. | 10-16-2008 |
20090050940 | SEMICONDUCTOR DEVICE - The present invention has for its purpose to provide a technique capable of reducing planar dimension of the semiconductor device. An input/output circuit is formed over the semiconductor substrate, a grounding wiring and a power supply wiring pass over the input/output circuit, and a conductive layer for a bonding pad is formed thereover. The input/output circuit is formed of MISFET elements in the nMISFET forming region and the pMISFET forming region, resistance elements in the resistance element forming regions and diode elements in the diode element forming regions functioning as protective elements. A wiring connected to the protective elements and positioned under the grounding wiring and the power supply wiring is pulled out in a pulling-out region between the nMISFET forming region and the pMISFET forming region and between the grounding wiring and the power supply wiring to be connected to the conductive layer. | 02-26-2009 |
20100171177 | SEMICONDUCTOR DEVICE - The present invention has for its purpose to provide a technique capable of reducing planar dimension of the semiconductor device. An input/output circuit is formed over the semiconductor substrate, a grounding wiring and a power supply wiring pass over the input/output circuit, and a conductive layer for a bonding pad is formed thereover. The input/output circuit is formed of MISFET elements in the nMISFET forming region and the pMISFET forming region, resistance elements in the resistance element forming regions and diode elements in the diode element forming regions functioning as protective elements. A wiring connected to the protective elements and positioned under the grounding wiring and the power supply wiring is pulled out in a pulling-out region between the nMISFET forming region and the pMISFET forming region and between the grounding wiring and the power supply wiring to be connected to the conductive layer. | 07-08-2010 |
20130341728 | Semiconductor Device - The present invention has for its purpose to provide a technique capable of reducing planar dimension of the semiconductor device. An input/output circuit is formed over the semiconductor substrate, a grounding wiring and a power supply wiring pass over the input/output circuit, and a conductive layer for a bonding pad is formed thereover. The input/output circuit is formed of MISFET elements in the nMISFET forming region and the pMISFET forming region, resistance elements in the resistance element forming regions and diode elements in the diode element forming regions functioning as protective elements. A wiring connected to the protective elements and positioned under the grounding wiring and the power supply wiring is pulled out in a pulling-out region between the nMISFET forming region and the pMISFET forming region and between the grounding wiring and the power supply wiring to be connected to the conductive layer. | 12-26-2013 |
20150108579 | SEMICONDUCTOR DEVICE - The present invention has for its purpose to provide a technique capable of reducing planar dimension of the semiconductor device. An input/output circuit is formed over the semiconductor substrate, a grounding wiring and a power supply wiring pass over the input/output circuit, and a conductive layer for a bonding pad is formed thereover. The input/output circuit is formed of MISFET elements in the nMISFET forming region and the pMISFET forming region, resistance elements in the resistance element forming regions and diode elements in the diode element forming regions functioning as protective elements. A wiring connected to the protective elements and positioned under the grounding wiring and the power supply wiring is pulled out in a pulling-out region between the nMISFET forming region and the pMISFET forming region and between the grounding wiring and the power supply wiring to be connected to the conductive layer. | 04-23-2015 |
Patent application number | Description | Published |
20090039010 | Hollow Fiber Membrane Module, and Method for Producing the Hollow Fiber Membrane Module - The structure can be made simple, and the reuse of a housing can be attained. | 02-12-2009 |
20090250261 | SEAL STRUCTURE - To provide a seal structure which has a seal member integrally formed on a flexible wiring board without peeling off an insulating layer (top coat) of the flexible wiring board, has excellent sealing performance and can be manufactured at a low cost, the seal structure is composed of a housing, to which the flexible wiring board is inserted, and the seal member, which is integrally formed with the flexible wiring board and seals a gap between the housing and the flexible wiring board, the flexible wiring board is composed of a base FPC composed of an elastic material, a patterned copper foil and an adhesive layer, conductive electromagnetic shielding layers formed on surfaces of the base FPC, and insulating layers covering surfaces of the electromagnetic shielding layers, and the seal member is integrally formed directly on the insulating layers by using a self-adhesive liquid rubber. | 10-08-2009 |
20110261685 | RADIO COMMUNICATION SYSTEM AND UPPER NODE - A radio communication system provides a first call type in which a radio resource is allocated to a call in time division and a second call type in which the radio resource is allocated according to a transmission rate. The radio communication system includes a measurement unit measuring a usage result of the first call type and a usage result of the second call type; and a setting unit setting a first usage result priority level as a priority level of the first call type based on the usage result of the first call type upon receipt of the first call type and setting a second usage result priority level as a priority level of the second call type based on the usage result of the second call type upon receipt of the second call type. The first usage result priority level is applied independently of a congestion state of a radio communication section. The second usage result priority level is applied according to the congestion state of the radio communication section. | 10-27-2011 |
20110281612 | MOBILE STATION AND RADIO BASE STATION - A mobile station including a transmission power determining unit configured to determine a transmission power in an uplink shared channel, in accordance with a maximum transmission power value corresponding to power class of the mobile station, the number of resource blocks for the uplink shared channel, path loss between the mobile station and a radio base station which is a connection destination of the uplink shared channel, and transmission power control information received from the radio base station, where when receiving a maximum allowable transmission power value from the radio base station, the transmission power determining unit is configured to determine transmission power in the uplink shared channel, using the maximum allowable transmission power value instead of the maximum transmission power value corresponding to the power class of the mobile station. | 11-17-2011 |
20110305155 | RADIO APPARATUS, RADIO COMMUNICATION SYSTEM AND RADIO COMMUNICATION METHOD - Each of a plurality of frequencies defines a combination of at least one uplink from among a plurality of types of uplink radio access, and at least one downlink from among a plurality of types of downlink radio access. A base station ( | 12-15-2011 |
20110317598 | RADIO COMMUNICATION DEVICE AND RADIO COMMUNICATION METHOD - A radio base station ( | 12-29-2011 |
20120026907 | BASE STATION, RADIO COMMUNICATION SYSTEM, AND RADIO COMMUNICATION METHOD - A base station includes a measuring unit and a setting unit. The measuring unit configured to measure at least any one piece of information of an absolute value of received total wideband power in the cell, a dispersion value of the received total wideband power in the cell, a reception success rate which is a rate of success in packet reception in the cell, and a simultaneous connecting user number which is the number of radio terminals connected to the cell simultaneously. The setting unit configured to set target received total wideband power which is a target for the received total wideband power in the cell based on information measured by the measuring unit. | 02-02-2012 |
20120026942 | COMMUNICATION DEVICE AND COMMUNICATION METHOD | 02-02-2012 |
20120039306 | RADIO COMMUNICATION SYSTEM, RADIO BASE STATION, AND RADIO COMMUNICATION METHOD - A mobile communication system comprises: a data amount measurement unit ( | 02-16-2012 |
Patent application number | Description | Published |
20090118038 | GOLF BALL - The present invention relates to a golf ball having a ball component made of a material molded under heat from a rubber composition which includes:
| 05-07-2009 |
20090124757 | METHOD OF MANUFACTURING A GOLF BALL - The present invention relates to an industrially beneficial method of manufacturing golf balls which includes the steps of pre-preparing a masterbatch of an unsaturated carboxylic acid and/or a metal salt thereof by mixing an unsaturated carboxylic acid and/or a metal salt thereof with a rubber material, preparing a rubber composition that contains the rubber material by using the masterbatch, and employing a material obtained by molding the rubber composition under heat as a golf ball component. The masterbatch is composed of: | 05-14-2009 |
20090124761 | METHOD OF MANUFACTURING A GOLF BALL - The present invention relates to an industrially beneficial method of manufacturing golf balls which includes the steps of pre-preparing an inorganic filler masterbatch by mixing an inorganic filler with a rubber material, preparing a rubber composition that contains the rubber material by using the masterbatch, and employing a material obtained by molding the rubber composition under heat as a golf ball component. The masterbatch is composed of:
| 05-14-2009 |
20090247322 | GOLF BALL - The invention provides a golf ball having a ball component made of a material molded under heat from a rubber composition of (a) a base rubber which includes a polybutadiene of at least 40% cis-1,4 structure, (b) an unsaturated carboxylic acid and/or a metal salt thereof, (c) an organic peroxide, and (d) a halogenated thiophenol, and/or a metal salt thereof, which is prepared by reacting starting materials in a polar solvent then washing with water and drying. The golf ball of the invention uses as a ball component a material of exceptional resilience which is obtained by molding a rubber composition under applied heat. As a result, the ball as a whole has an excellent rebound. | 10-01-2009 |
Patent application number | Description | Published |
20120043371 | WIRING SUBSTRATE MANUFACTURING METHOD - A wiring substrate includes a conductor layer and a resin insulating layer stacked alternately, solder resist layers formed on outermost surfaces on a first principal surface side and an opposing second principal surface side respectively, and outermost conductor layers exposed from opening portions formed in the respective solder resist layers. A method of manufacturing the wiring substrate includes: forming a first underlying layer and a second underlying layer on the respective outermost conductor layers; supplying a first solder onto the first underlying layer, and a second solder onto the second underlying layer; and connecting the first solder to the first underlying layer and the second solder to the second underlying layer respectively, by heating the first solder and the second solder simultaneously. | 02-23-2012 |
20130081862 | WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Embodiments of the present invention provide a wiring substrate which is excellent in terms of the reliability of connection between the wiring substrate and a semiconductor chip. In some embodiments the wiring substrate comprises a first build-up layer in which resin insulation layers and conductor layers are laminated alternately. The outermost conductor layer can include a plurality of connection terminal portions to which a semiconductor chip is flip-chip connected. The plurality of connection terminal portions can be exposed through openings of a solder resist layer. Each of the connection terminal portions includes a connection region to which a connection terminal of the semiconductor chip is to be connected, and a wiring region which extends in a planar direction from the connection region and which is narrower than the connection region. The surface of the wiring region has a solder wettability lower than that of the surface of the connection region. | 04-04-2013 |
20140069701 | WIRING BOARD - A wiring board includes a base layer, a plurality of connection terminals and a surface layer. The base layer is electrically insulative. The plurality of connection terminals are conductive and formed on the base layer. The surface layer is electrically insulative, and fills gaps between the plurality of connection terminals on the base layer. The connection terminals include a base portion made of a conductive first metal and a coating portion made of a conductive second metal that is different from the first metal. The coating portion penetrates the surface layer, and coats the base portion to the base layer. | 03-13-2014 |
20140097007 | WIRING SUBSTRATE AND METHOD FOR PRODUCING THE SAME - Embodiments of the present wiring substrate include a stacked body including one or more insulation layers and one or more conductive layers, wherein the wiring substrate has a plurality of connection terminals formed on the stacked body, each connection terminal has a top surface whose area is smaller than that of each of opposite side surfaces thereof, and a filling member provided in a filling manner between the connection terminals. The top surface of each connection terminal has an area larger than that of a portion of each side surfaces portion exposed from the filling member, and a bonding layer containing a solder is formed on the top surface. | 04-10-2014 |
20140124242 | WIRING SUBSTRATE - A wiring substrate according to the present invention includes a laminate of one or more insulation layers and one or more conductive layers and further includes a plurality of connection terminals formed on the laminate and spaced apart from one another, each having a step formed at the outer periphery of a first main surface opposite a contact surface in contact with the laminate, and a filling member provided in a filling manner between the connection terminals. | 05-08-2014 |
20150189752 | WIRING SUBSTRATE AND PRODUCTION METHOD THEREFOR - A wiring substrate includes a surface layer having electrical insulation properties and a connection terminal having electrical conduction properties and protruding from the surface layer. The connection terminal includes a base portion, a covering portion and a filling portion. The base portion of the connection terminal is made of an electrically conductive first metal and located adjacent to the surface layer so as to extend through the surface layer and protrude from the surface layer. The covering portion of the connection terminal is made of an electrically conductive second metal having a melting point lower than that of the first metal and located so as to cover the base portion. The filling portion of the connection terminal is made of at least one of the second metal and an alloy containing the first and second metals and located so as to fill a hollow in the base portion. | 07-02-2015 |
20150208501 | WIRING BOARD AND METHOD FOR MANUFACTURING SAME - To provide a wiring board excellent in connection reliability with a semiconductor chip. A first buildup layer | 07-23-2015 |
20150216059 | WIRING BOARD AND MANUFACTURING METHOD OF THE SAME - To provide a wiring board in which wiring conductors are securely protected by a precise and rigid dam portion formed on an outermost layer of a laminate and that is excellent in connection reliability with a semiconductor chip. A laminate that configures this wiring board includes multiple connection terminal portions and wiring conductors as a conductor layer of the outermost layer. The wiring conductors are arranged at predetermined positions, passing through between multiple connection terminal portions for flip-chip mounting a semiconductor chip. A resin insulating layer of the outermost layer of the laminate has a dam portion and a reinforcement portion. The dam portion covers the wiring conductors. The reinforcement portion is formed, between the wiring conductor and the connection terminal portion that is adjacent to the wiring conductor, lower than a height of the dam portion. The reinforcement portion is concatenated with a side surface of the dam portion. | 07-30-2015 |