Makita, Tokyo
Atsushi Makita, Tokyo JP
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20100074384 | RECEIVING DEVICE, RECEIVING METHOD, AND PROGRAM - A receiving device includes: a noise detecting means for detecting a noise, which is contained in a received signal, using the received signal which has undergone clock synchronization processing: a phase error detecting means for detecting a phase error of the received signal using the received signal which has undergone clock synchronization processing; and a calculation means for calculating a phase correction value on the basis of the phase error detected by the phase error detecting means, wherein, when the noise is detected by the noise detecting means, the calculation means modifies a parameter to be employed in the calculation of the phase correction value so as to decrease the phase correction value. | 03-25-2010 |
20100080138 | DATA PROCESSING APPARATUS AND DATA PROCESSING METHOD - Disclosed herein is a data processing apparatus including: an adjusting section configured to receive a stream including packets and a start flag indicative of the beginning of each of the packets in the stream, adjust a rate of the stream to a certain rate, and output the adjusted stream that is the stream after the rate adjustment and the start flag indicative of the beginning of each of the packets in the adjusted stream; a monitoring section configured to monitor a packet interval that is a start interval between the packets in the adjusted stream on the basis of the start flag; and an output control section configured to execute output control of outputting the packets in the adjusted stream if the packet interval is a normal interval and restricting the outputting of the packets in the adjusted stream if the packet interval is an abnormal interval. | 04-01-2010 |
20100135335 | FRAME SYNCHRONIZER, FRAME SYNCHRONIZATION METHOD AND DEMODULATOR - The present invention relates to a frame synchronizer, frame synchronization method and demodulator which can more positively establish frame synchronization of an input signal which is likely to have a plurality of frame lengths. | 06-03-2010 |
Atsuya Makita, Tokyo JP
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20090101905 | DISPLAY UNIT AND METHOD OF MANUFACTURING THE SAME - A display unit includes, on an insulating substrate, a plurality of wirings formed to extend in different directions, a thin-film transistor, and a display element. At least one of the plurality of wirings is a divided wiring having a crossing portion formed at an intersection with the other of the plurality of wirings, and a main portion which is formed in a layer same as the other of the plurality of wirings with an insulating film in between and which is electrically connected to the crossing portion via an conductive connection provided in the insulating film. At least one of the main portion and the crossing portion includes a first layer and a second layer stacked in order from the insulating substrate side, the second layer being in direct contact with the first layer and made of a material of a higher melting point than the first layer. | 04-23-2009 |
Daisuke Makita, Tokyo JP
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20120187973 | TEST APPARATUS - An existing test head is made best use of and a capital investment is reduced. A test apparatus for testing a plurality of devices under test includes: a plurality of test heads for retaining therein at least one test board to test devices under test; a connecting section mounted on upper surfaces of the plurality of test heads and is independently fixed to each of the plurality of test heads; and a DUT board on which the plurality of devices under test are mounted, the DUT board being mounted to the connecting section, where the at least one test board is mountable and removable through a side surface of each of the plurality of test heads while the connecting section is mounted to the test head. | 07-26-2012 |
20120198292 | TEST APPARATUS AND TEST METHOD - Provided is a test apparatus that tests a memory under test, comprising a testing integrated circuit device that tests the memory under test and includes an internal memory storing test information including at least one of a test result and test data for a partial memory region of the memory under test; an external memory that stores the test information for an entire memory region of the memory under test; and a memory controller that is connected to the external memory and transmits test information for a memory region of a test target between the external memory and the internal memory. Also provided is a test method. | 08-02-2012 |
20120280705 | TEST HEAD, TEST BOARD AND TEST APPARATUS - A test board can be inserted to a test head and removed from the test head while the connecting section for mounting thereon devices under test is mounted on the upper portion of the test head. A test head for retaining therein at least one test board for testing devices under test, includes: a casing provided with, on one side surface thereof, an opening through which the at least one test board is inserted and removed, the casing retaining therein the at least one test board with an upper side thereof oriented towards an upper surface of the casing; and a mounting member that guides a lower side of the at least one test board through the opening to a pre-set position, imposes an upward force to the lower side of the at least one test board, thereby mounting the at least one test board to the casing. | 11-08-2012 |
Junko Makita, Tokyo JP
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20090109296 | Pxiel signal processing apparatus and pixel signal processing method - The difference between the output of a k-signal nonlinear low-pass filter ( | 04-30-2009 |
Kazuyuki Makita, Tokyo JP
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20090286093 | LEAD-FREE SOLDER - According to one embodiment of the invention, there is provided a lead-free solder including an alloy rolled into a shape of sheet. The alloy includes: tin; from 10 wt % to less than 25 wt % of silver; and from 3 wt % to 5 wt % of copper. The alloy is free from lead. | 11-19-2009 |
20120111924 | LEAD-FREE SOLDER - According to one embodiment of the invention, there is provided a lead-free solder including an alloy rolled into a shape of sheet. The alloy includes: tin; from 10 wt % to less than 25 wt % of silver; and from 3 wt % to 5 wt % of copper. The alloy is free from lead. | 05-10-2012 |
Kikuo Makita, Tokyo JP
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20090050933 | SEMICONDUCTOR LIGHT-RECEIVING DEVICE AND METHOD FOR MANUFACTURING THE SAME - Disclosed is a semiconductor light-receiving device having high reproducibility and reliability. Also disclosed is a method for manufacturing a semiconductor light-receiving device. Specifically disclosed is a semiconductor light-receiving device | 02-26-2009 |
20090176327 | PHOTODIODE AND METHOD FOR FABRICATING SAME - A Schottky photodiode includes a semiconductor layer and a conductive film provided in contact with the semiconductor layer. The conductive film has an aperture and a periodic structure provided around said aperture for producing a resonant state by an excited surface plasmon in a film surface of the conductive film by means of the incident light to the film surface. The photodiode detects near-field light that is generated by at the interface between the conductive film and semiconductor layer the excited surface plasmon. The aperture has a diameter smaller than the wavelength of the incident light. | 07-09-2009 |
20100200941 | PHOTODIODE, OPTICAL COMMUNICATION DEVICE, AND OPTICAL INTERCONNECTION MODULE - Intended is to provide a device structure, which makes the light receiving sensitivity and the high speediness of a photodiode compatible. Also provided is a Schottky barrier type photodiode having a conductive layer formed on the surface of a semiconductor layer. The photodiode is so constituted that a light can be incident on the back side of the semiconductor layer, and that a periodic structure, in which a light incident from the back side of the semiconductor layer causes a surface plasmon resonance, is made around the Schottky junction of the photodiode. | 08-12-2010 |
20100279457 | METHOD FOR MANUFACTURING A SEMICONDUCTOR LIGHT-RECEIVING DEVICE - Disclosed is a method for manufacturing a semiconductor light-receiving device having high reproducibility and reliability. Specifically disclosed is a semiconductor light-receiving device | 11-04-2010 |
Masahiro Makita, Tokyo JP
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20110096132 | INK JET RECORDING DEVICE AND INK JET RECORDING METHOD - Provided are an inkjet recording device and an inkjet recording method for providing an image wherein concentration nonunifomiity is reduced with less ink bleed between inks of different colors, in high speed multicolor printing of single path system. In the device and the method, a conditional expression of 0.6≦R/R0≦0.9 is satisfied, where, R is a dot radius of a second ink jetted on a first ink which is jetted on the recording medium and semi-cured by a beam applied, and R0 is a dot radius of the second ink directly jetted on the recording medium. | 04-28-2011 |
20110187801 | INKJET RECORDING DEV ICE - An inkjet recording device, wherein air can be retained in an ink supply pipe by using a simple structure without applying substantial changes to the inkjet recording device, a variation in an ink supply pressure is mitigated by the retained air, and ink can be ejected with high stability. An inkjet recording device is provided with an inkjet head for ejecting ink, an ink flow path for supplying the ink, which is supplied from an ink supply source, to a pressure chamber of the inkjet head and having at least a portion thereof constructed from an ink supply pipe, and an air retaining member inserted in the ink supply pipe, with the ink allowed to pass through the air retaining member, and retaining air in at least a portion of a space formed between the air retaining member and the inner surface of the ink supply pipe. | 08-04-2011 |
Naoyuki Makita, Tokyo JP
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20120200127 | STRUCTURE OF CONTAINER MOUNTED TO VEHICLE SEAT AND METHOD FOR MOUNTING CONTAINER TO VEHICLE SEAT - Container for accommodating small article(s) comprises: a container body including flange portion wherein connecting slits are formed; and a container lid element including lateral wall region having projected connecting pieces. A trim cover assembly of the seat includes: a peripheral end area or margin defined in a container mounting hole formed in the trim cover assembly; and connecting slits formed in that margin. In assembly, the connecting pieces are inserted through those flanged portion, while simultaneously the margin of trim cover assembly is sandwiched between the flanged portion and lateral wall region. Those free ends are flattened to connecting slits, respectively, so that free ends of the connecting pieces project from the connect together all the container body, container lid element and trim cover assembly. Finally, the trim cover assembly is attached upon a foam padding, with the container body inserted in a recession of the foam padding. | 08-09-2012 |
Norikazu Makita, Tokyo JP
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20100253622 | POSITION INFORMATION DETECTION DEVICE, POSITION INFORMATION DETECTION METHOD, AND POSITION INFORMATION DETECTION PROGRAM - A position information detection device, method, and program are provided, which are capable of detecting position information with high precision using simple and easily identified discrimination marks. A position information detection device has an image capture portion | 10-07-2010 |
Taiyo Makita, Tokyo JP
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20090270565 | Fuel Cell Separator Material and Process of Producing the Same - A fuel cell separator material which exhibits a high fracture strain and a high strength, prevents breakage during cell stack assembly or cracking during a cell operation, and exhibits excellent properties such as conductivity and gas impermeability, and a method of producing the same are provided. The fuel cell separator material includes a carbon/cured resin molded product in which a carbon powder is bound with a binder which comprises a mixed resin of a bifunctional aliphatic alcohol ether-type epoxy resin and a polyfunctional phenol-type epoxy resin, a phenol resin curing agent, and a curing accelerator as essential components. The method of producing a fuel cell separator material includes preparing a resin solution by dissolving a bifunctional aliphatic alcohol ether-type epoxy resin, a polyfunctional phenol-type epoxy resin, a phenol resin curing agent, and a curing accelerator in an organic solvent, mixing a carbon powder with the resin solution, removing the organic solvent by volatilization, grinding the mixture to obtain a molding powder, filling a preforming mold with the molding powder, providing an upper mold, preforming the molding powder at a pressure of 1 to 10 MPa to obtain a preform, inserting the preform into a mold, and thermocompression-molding the preform at a pressure of 20 to 50 MPa and a temperature of 150 to 250° C. | 10-29-2009 |
Takehiko Makita, Tokyo JP
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20100079222 | Coplanar waveguide and fabrication method thereof - A coplanar waveguide includes a signal line formed on a major surface of a high-resistivity silicon substrate, a pair of ground conductors placed on opposite sides of the signal line, and a pair of trenches formed in the substrate between the signal line and the ground conductors. Because of the trenches, the attenuation characteristics of the coplanar waveguide are highly uniform, and are comparable to the attenuation characteristics of coplanar waveguides formed on compound semiconductor substrates. | 04-01-2010 |
20110042672 | Coplanar waveguide having amorphous silicon layer between substrate and insulated layer and a manufacturing method thereof - A coplanar waveguide includes a high resistance silicon substrate having one primary surface on which an amorphous silicon layer is formed, an insulated layer formed on the amorphous silicon layer, a signal line arranged on the insulated layer and a pair of ground planes arranged on the insulated layer so as to put the signal line between the planes. The coplanar waveguide is not structured as conventionally having a thick insulated layer formed on a single-crystalline silicon substrate, thereby reducing attenuation otherwise caused by leakage of electromagnetic wave in a frequency bandwidth of millimeter wave. | 02-24-2011 |
Takeshi Makita, Tokyo JP
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20100059896 | Coplaner waveguide and fabrication method thereof - A coplanar waveguide includes a substrate, a signal line formed on the substrate, a pair of ground conductors formed on the substrate on mutually opposite sides of the signal line, a signal line insulating film disposed between the signal line and the substrate, and a ground conductor insulating film disposed between the pair of ground conductors and the substrate. No corresponding insulating film is present on the substrate between the signal line and the ground conductors. Even if a silicon substrate is used, the attenuation characteristics of the coplanar waveguide are comparable to the attenuation characteristics of coplanar waveguides formed on compound semiconductor substrates. | 03-11-2010 |
Yo Makita, Tokyo JP
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20090261813 | CURRENT SENSOR - A core is divided by alternately arranging plural magnetic material portions and plural non-magnetic material portions in a circumferential direction of the core through which a primary conductor penetrates. A conductor is wound around the core under conditions in which each core cross section of the core intersects the magnetic material portion and the non-magnetic material portion, each core cross section including a cut end surface of each conductor of a secondary winding wound around the core, and a ratio of a magnetic material portion cross-sectional area of the magnetic material portion to a non-magnetic material portion cross-sectional area of the non-magnetic material portion at the core cross section is kept constant at each core cross section. | 10-22-2009 |
Yoshiaki Makita, Tokyo JP
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20090215204 | FABRICATION METHOD OF SEMICONDUCTOR DEVICE - A technique is provided which can exactly recognize a chip to be picked up when picking up the chip from a wafer sheet in a process of die bonding a thin chip. A camera is coupled to one end of a lens barrel, an objective lens is attached to an opposite end of the lens barrel, and an image of a main surface of a chip is photographed through the objective lens. A surface-emitting lighting unit, a diffusing plate and a half mirror are internally provided between the lens barrel and the chip. Further, another lens barrel having a coaxial drop lighting function of radiating light to the main surface of the chip along the same optical axis as that of the camera is disposed. | 08-27-2009 |
20100055878 | Fabrication Method of Semiconductor Device - A technique with which die bonding can be carried out without forming a void in a bond area is provided. A vacuum supply line that connects to a vacuum chuck hole formed in the bottom face of a vacuuming collet and supplies the vacuuming collet with reduced pressure for vacuum chucking a chip is constructed of two systems. That is, the vacuum supply line is so structured that a first pipe and a second pipe connect to the vacuuming collet. The first pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is unstuck from a dicing tape and transported to a mounting position on a wiring substrate. The second pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is mounted over a wiring substrate. The intensity of the vacuum (suction force) supplied to the vacuuming collet is controlled by opening or closing valves respectively installed in the pipes. | 03-04-2010 |
20100285615 | FABRICATION METHOD OF SEMICONDUCTOR DEVICE - A technique is provided which can exactly recognize a chip to be picked up when picking up the chip from a wafer sheet in a process of die bonding a thin chip. A camera is coupled to one end of a lens barrel, an objective lens is attached to an opposite end of the lens barrel, and an image of a main surface of a chip is photographed through the objective lens. A surface-emitting lighting unit, a diffusing plate and a half mirror are internally provided between the lens barrel and the chip. Further, another lens barrel having a coaxial drop lighting function of radiating light to the main surface of the chip along the same optical axis as that of the camera is disposed. | 11-11-2010 |
20130122615 | FABRICATION METHOD OF SEMICONDUCTOR DEVICE - A technique is provided which can exactly recognize a chip to be picked up when picking up the chip from a wafer sheet in a process of die bonding a thin chip. A camera is coupled to one end of a lens barrel, an objective lens is attached to an opposite end of the lens barrel, and an image of a main surface of a chip is photographed through the objective lens. A surface-emitting lighting unit, a diffusing plate and a half mirror are internally provided between the lens barrel and the chip. Further, another lens barrel having a coaxial drop lighting function of radiating light to the main surface of the chip along the same optical axis as that of the camera is disposed. | 05-16-2013 |
Yuji Makita, Tokyo JP
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20100061178 | Mixer Control Device And System - A mixer control device capable of manufacturing products of consistent quality without skilled personnel is provided. Said mixer control device includes: (1) a sensor | 03-11-2010 |