Jatinder
Jatinder Dhami, Leicester GB
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20130205524 | Toothpaste Dispensing Toothbrush - A toothbrush comprising a toothpaste dispenser that is removably connectable to a head, wherein when connected the toothpaste dispenser can dispense toothpaste from a dispensing aperture, through a passage formed in a shaft of the head and out through at least one aperture formed in a brush portion of the head. As the head is removably connected to the dispenser it is possible for a user to replace either the head or dispenser when needed. For example, a dispenser can be changed when it is empty. Alternatively, a head can be replaced when a different user wants to use the toothbrush when a head is too worn or when it a user desires to use a different shape or hardness head. | 08-15-2013 |
Jatinder Gogna, Baldwin Place, NY US
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20090307152 | Cost Management System - A cost management system for an inventory item defines a set of one or more attributes or “valuation structures”, and at least one value for each of the attributes in the set or “valuation unit”. The system receives a transaction involving the inventory item. The system then determines the cost of the inventory item based on the attribute values for the valuation structure of the item. Therefore, the cost of the inventory item will vary based on the attribute values. | 12-10-2009 |
20100049634 | COST MANAGEMENT SYSTEM WITH FLEXIBLE UNIT OF MEASURE - A system determines the cost of a transaction. The system receives a transaction for an item. The transaction is in terms of a first unit of measure. The system then determines the quantity in terms of a second unit of measure and calculates the cost of the transaction based on the second unit of measure. | 02-25-2010 |
20140095361 | SUPPLY CHAIN FINANCIAL ORCHESTRATION SYSTEM WITH TRADE ACCOUNTING - A system that processes trade events is provided. The system receives events associated with a supply chain financial orchestration flow, where a supply chain financial orchestration flow defines a trade relationship between a first entity and a second entity. The system further determines whether at least one event indicates an ownership change of an item between a first entity and a second entity. The system further generates trade events where at least one event indicates an ownership change. The system further sends the trade events to a cost accounting system. The cost accounting system further performs accounting based on the trade events and generates trade accounting events. | 04-03-2014 |
Jatinder Jatinder, Rockville, MD US
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20090073254 | OMNIDIRECTIONAL IMAGING SYSTEM WITH CONCURRENT ZOOM - An optical system configured to simultaneously image an omnidirectional field-of-view and a concurrent narrow field on a single focal plane. | 03-19-2009 |
Jatinder Kullar, West Yorkshire GB
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20090269822 | MICROORGANISM - A microorganism which is | 10-29-2009 |
Jatinder Kumar, Jalandhar City IN
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20090102028 | METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT AND STRUCTURE THEREFOR - A method for manufacturing a semiconductor component that includes a leadframe having a non-metallic base structure and an intermediate leadframe structure. The non-metallic base structure may be, among other things, paper, cellulose, or plastic. A layer of electrically conductive material is formed over the non-metallic base structure. A circuit element attach structure and a plurality of leadframe leads are formed from the layer of electrically conductive material. A circuit element is coupled to the circuit element attach structure and electrically coupled to the plurality of leadframe leads. The circuit element is encapsulated and at least the non-metallic base structure is removed. Alternatively, a plurality of leadframe leads may be formed on the electrically conductive layer and a circuit element is placed over the electrically conductive layer. The circuit element is electrically coupled to the plurality of leadframe leads and encapsulated. The non-metallic base structure and the electrically conductive layer are removed. | 04-23-2009 |
20110115061 | ELECTRONIC DEVICE INCLUDING A PACKAGING SUBSTRATE HAVING A TRENCH - An electronic device can include a packaging material having a first surface and a second surface opposite the first surface, and leads including die connection surfaces and external connection surfaces. The electronic device can further include a trench extending from an upper surface of the packaging substrate towards a lower surface of the packaging substrate, wherein a set of leads lie immediately adjacent to the trench, and the packaging material is exposed at the bottom of the trench. In an embodiment, an encapsulant is formed over the upper surface of the packaging substrate and within the trench. In a particular embodiment, the trenches may be formed before or after placing a die over the packaging substrate, or before or after forming electrical connections between the die and leads of the packaging substrate. | 05-19-2011 |
20120306066 | ELECTRONIC DEVICE INCLUDING A PACKAGING SUBSTRATE HAVING A TRENCH - An electronic device can include a packaging material having a first surface and a second surface opposite the first surface, and leads including die connection surfaces and external connection surfaces. The electronic device can further include a trench extending from an upper surface of the packaging substrate towards a lower surface of the packaging substrate, wherein a set of leads lie immediately adjacent to the trench, and the packaging material is exposed at the bottom of the trench. In an embodiment, an encapsulant is formed over the upper surface of the packaging substrate and within the trench. In a particular embodiment, the trenches may be formed before or after placing a die over the packaging substrate, or before or after forming electrical connections between the die and leads of the packaging substrate. | 12-06-2012 |
20130307134 | CONDUCTIVE CHIP DISPOSED ON LEAD SEMICONDUCTOR PACKAGE AND METHODS OF MAKING THE SAME - In one implementation, a method of forming a conductive device can include depositing a non-conductive epoxy on a first portion of a lower surface of a semiconductor die, and can include depositing a conductive epoxy on a second portion of the lower surface of the semiconductor die. | 11-21-2013 |
Jatinder Kumar, Punjab IN
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20130009309 | CONDUCTIVE CHIP DISPOSED ON LEAD SEMICONDUCTOR PACKAGE AND METHODS OF MAKING THE SAME - In one implementation, an apparatus includes a semiconductor die, a lead, a non-conductive epoxy, and a conductive epoxy. The semiconductor die includes an upper surface and a lower surface opposite the upper surface. The lead is electrically coupled to the upper surface of the semiconductor die. The non-conductive epoxy is disposed on a first portion of the lower surface of the semiconductor die. The conductive epoxy is disposed on a second portion of the lower surface of the semiconductor die. In some implementations, a conductive wire extends from the lead to the upper surface of the semiconductor die to electrically couple the lead to the upper surface of the semiconductor die. | 01-10-2013 |
Jatinder Palta, Newberry, FL US
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20080240348 | Variable Feathering Field Splitting For Intensity Modulated Fields of Large Size - A method and associated system | 10-02-2008 |
Jatinder Singh, Tucson, AZ US
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20090122950 | AFSM circuit and method for low jitter PLL CMOS programmable divider - A frequency divider ( | 05-14-2009 |