Patent application number | Description | Published |
20130316485 | DYE ADSORPTION APPARATUS AND DYE ADSORPTION METHOD - [Problem] To significantly reduce the processing time of a step in which a coloring matter is adsorbed onto a porous semiconductor layer formed on the surface to be treated of a substrate. | 11-28-2013 |
20140134776 | DYE ADSORPTION DEVICE AND DYE ADSORPTION METHOD - The purpose of the present invention is to improve the throughput of a dye adsorption process in which a dye is adsorbed in a porous semiconductor layer on a substrate and to improve dye use efficiency. In a dye adsorption device of the present invention, a dye solution drop-coating unit | 05-15-2014 |
20140318680 | BONDING APPARATUS, BONDING SYSTEM AND BONDING METHOD - A bonding apparatus according to an exemplary embodiment of the present disclosure includes a first holding unit, a second holding unit, a pressing mechanism and a holding mechanism. The first holding unit is provided with a first heating mechanism and holds a first substrate. The second holding unit disposed facing the first holding unit and provided with a second heating mechanism, holds a second substrate. The pressing mechanism relatively moves the first holding unit and the second holding unit in order to contact and press the first substrate and the second substrate. The holding mechanism elastically holds an outer periphery of the first holding unit and the second holding unit. | 10-30-2014 |
20140318711 | BONDING APPARATUS, BONDING SYSTEM AND BONDING METHOD - A bonding apparatus according to an exemplary embodiment of the present disclosure includes a first holding unit, a second holding unit, a first cooling mechanism, a second cooling mechanism, a third heating mechanism and a fourth heating mechanism. The first holding unit has a first heating mechanism and holds a first substrate. The second holding unit has a second heating mechanism and holds a second substrate. The pressing mechanism contacts and presses the first substrate and the second substrate. The first cooling mechanism cools the first substrate through the first holding unit. The second cooling mechanism cools the second substrate through the second holding unit. The third heating mechanism heats the first cooling mechanism. The fourth heating mechanism heats the second cooling mechanism. | 10-30-2014 |
20140329341 | BONDING METHOD, BONDING APPARATUS AND BONDING SYSTEM - A bonding method according to an exemplary embodiment of the present disclosure includes a first holding processing, a second holding processing, a temporary bonding processing, a temperature increasing processing and a main bonding processing. In the first holding processing, a target substrate is held. In the second holding processing, a glass substrate held by electrostatic adsorption. In the temporary bonding processing, the target substrate and the glass substrate are temporarily bonded with a pressing force lower than a predetermined pressing force at a temperature lower than a predetermined temperature. In the temperature increasing processing, while releasing the electrostatic adsorption of the glass substrate at the same time as or after the temporary bonding, the temperature is increased to the predetermined temperature. In the main bonding processing, a main bonding of the target substrate and the glass substrate is performed with the predetermined pressing force. | 11-06-2014 |
Patent application number | Description | Published |
20150331314 | PATTERN FORMING METHOD, COMPOUND USED THEREIN, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, MANUFACTURING METHOD OF ELECTRONIC DEVICE, AND ELECTRONIC DEVICE - There is provided an actinic ray-sensitive or radiation-sensitive resin composition comprising: (A) a resin having a group capable of decomposing by an action of an acid to produce a polar group, (C1) a compound containing a group capable of generating a first acidic functional group upon irradiation with an actinic ray or radiation and a group capable of generating a second acidic functional group different from the first acidic functional group upon irradiation with an actinic ray or radiation, and (C2) at least one compound containing two or more groups selected from the group consisting of the groups capable of generating the structures represented by the specific formulae upon irradiation with an actinic ray or radiation. | 11-19-2015 |
20160048082 | PATTERN-FORMING METHOD, ELECTRONIC DEVICE AND METHOD FOR PRODUCING SAME, AND DEVELOPING FLUID - A pattern-forming method includes forming a film on a substrate by using an actinic ray-sensitive or radiation-sensitive resin composition containing at least a resin that exhibits, due to an action of an acid, increase in polarity and decrease in solubility with respect to a developer including an organic solvent, and a compound that generates an acid by being irradiated with actinic rays or radiation; exposing the film; and forming a negative tone pattern by developing the exposed film with a developer including an organic solvent, in which the developer includes at least one compound A selected from the group consisting of an onium salt, a polymer having an onium salt, a nitrogen-containing compound including three or more nitrogen atoms, a basic polymer, and a phosphorus-based compound. | 02-18-2016 |
20160070167 | PATTERN FORMING METHOD, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, MANUFACTURING METHOD OF ELECTRONIC DEVICE, ELECTRONIC DEVICE AND COMPOUND - There is provided a pattern forming method comprising (i) a step of forming a film containing an actinic ray-sensitive or radiation-sensitive resin composition containing (A) a compound represented by the specific formula, (B) a compound different from the compound (A) and capable of generating an acid upon irradiation with an actinic ray or radiation, and (P) a resin that does not react with the acid generated from the compound (A) and is capable of decreasing the solubility for an organic solvent-containing developer by the action of the acid generated from the compound (B), (ii) a step of exposing the film, and (iii) a step of developing the exposed film by using an organic solvent-containing developer to form a negative pattern; the actinic ray-sensitive or radiation-sensitive resin composition above; a resist film using the composition. | 03-10-2016 |
Patent application number | Description | Published |
20100079203 | Semiconductor Device - An object is to provide a semiconductor device which operates normally even when the communication distance is extremely short, while the maximum communication distance is maintained, and which can make amplitude of a response waveform large even when a large amount of electric power is supplied to the semiconductor device and a protection circuit operates. The object is achieved with a semiconductor device including a first modulation circuit and a second modulation circuit each of which performs load modulation by an input signal, a detection circuit which determines an output signal by electric power supplied externally, a protection circuit which is controlled by the output signal of the detection circuit, and a modulation selecting circuit which switches the first modulation circuit and the second modulation circuit depending on the output signal of the detection circuit. | 04-01-2010 |
20110176355 | SEMICONDUCTOR DEVICE AND DRIVING METHOD THEREOF - A semiconductor device has a non-volatile memory cell including a write transistor which includes an oxide semiconductor and has small leakage current in an off state between a source and a drain, a read transistor including a semiconductor material different from that of the write transistor, and a capacitor. Data is written or rewritten to the memory cell by turning on the write transistor and applying a potential to a node where one of a source electrode and drain electrode of the write transistor, one electrode of the capacitor, and a gate electrode of the read transistor are electrically connected to one another, and then turning off the write transistor so that the predetermined amount of charge is held in the node. | 07-21-2011 |
20110254538 | CURRENT MEASUREMENT METHOD, INSPECTION METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND TEST ELEMENT GROUP - One object is to provide a method for measuring current by which minute current can be measured. A value of current flowing through an electrical element is not directly measured but is calculated from change in a potential observed in a predetermined period. The method for measuring current includes the steps of: applying a predetermined potential to a first terminal of an electrical element having the first terminal and a second terminal; measuring an amount of change in a potential of a node connected to the second terminal; and calculating, from the amount of change in the potential, a value of current flowing between the first terminal and the second terminal of the electrical element. Thus, the value of minute current can be measured. | 10-20-2011 |
20110278571 | SEMICONDUCTOR DEVICE - A semiconductor device including a first transistor and a second transistor and a capacitor which are over the first transistor is provided. A semiconductor layer of the second transistor includes an offset region. In the second transistor provided with an offset region, the off-state current of the second transistor can be reduced. Thus, a semiconductor device which can hold data for a long time can be provided. | 11-17-2011 |
20120063206 | SEMICONDUCTOR MEMORY DEVICE - An object is to provide a semiconductor memory device capable of copying memory data without using an external circuit. The semiconductor memory device includes a bit line to which first terminals of a plurality of memory cells are connected in common; a pre-charge circuit which is connected to the bit line and pre-charges the bit line with a specific potential in data reading; a data holding circuit comprising a capacitor which temporarily holds data read out from the memory cell or data which is written to the memory cell; and an inverted data output circuit which outputs inverted data of data held in the data holding circuit to the bit line. The inverted data output circuit includes a means for controlling output of inverted data of data held in the data holding circuit. | 03-15-2012 |
20120287693 | SEMICONDUCTOR DEVICE AND MEMORY DEVICE INCLUDING SEMICONDUCTOR DEVICE - To provide a semiconductor device whose power can be turned off without the need for a peripheral circuit for data to escape temporarily and in which stored data is not lost even in an off state of the power of the device, and a memory device including the semiconductor device. In a holding circuit of the semiconductor device, a transistor that includes a semiconductor layer (at least a channel formation region) including an oxide semiconductor material with which small off-state current can be achieved is used. Further, the semiconductor device includes a switching element which enables a comparison circuit in which comparison between data stored in the holding circuit and reference data input from the outside does not need to be performed to become forcibly inactive. | 11-15-2012 |
20140319518 | SEMICONDUCTOR DEVICE AND DRIVING METHOD THEREOF - A semiconductor device has a non-volatile memory cell including a write transistor which includes an oxide semiconductor and has small leakage current in an off state between a source and a drain, a read transistor including a semiconductor material different from that of the write transistor, and a capacitor. Data is written or rewritten to the memory cell by turning on the write transistor and applying a potential to a node where one of a source electrode and drain electrode of the write transistor, one electrode of the capacitor, and a gate electrode of the read transistor are electrically connected to one another, and then turning off the write transistor so that the predetermined amount of charge is held in the node. | 10-30-2014 |
20150241510 | CURRENT MEASUREMENT METHOD - A minute current measurement method is provided. In the current measurement method, a first potential is applied to a first terminal of a transistor under test, a second potential is applied to a first terminal of a first transistor, the first transistor is turned on to accumulate a predetermined charge in a node electrically connecting a second terminal of the transistor under test with a second terminal of the first transistor, a third potential of an output terminal of a read circuit electrically connected to the node is measured, the first transistor is turned off, a fourth potential of the output terminal of the read circuit electrically connected to the node is measured, the amount of the charge held by the node is estimated from the amount of change in the potential of the output terminal of the read circuit (e.g., a difference between the third potential and the fourth potential), and a value of current flowing between the first terminal of the transistor under test and the second terminal of the first transistor is calculated from the amount of the charge held by the node. | 08-27-2015 |
Patent application number | Description | Published |
20110174526 | CIRCUIT MODULE - A circuit board includes a recess in a principal surface thereof. An IC chip is mounted in the recess. An insulating resin is filled in the recess. Via-hole conductors are provided in the insulating resin. A ground electrode covers the recess filled with the insulating resin. First ends of the via-hole conductors are in contact with the ground electrode. Second ends of the via-hole conductors are in contact with the IC chip. | 07-21-2011 |
20110279177 | DUPLEXER MODULE - A duplexer module prevents a transmission signal and a reception signal in the same band from interfering with each other. The duplexer module includes a transmission line, a reception line, and an antenna common line. In addition, the duplexer module includes a plurality of mounting electrodes arranged along the four sides of an outer edge of a mounting surface of a multilayer substrate. The fourth mounting electrode defining a monitoring port is disposed on a side different from a side on which each of the first mounting electrode defining a transmission port, the second mounting electrode defining a reception port, and the third mounting electrode defining an antenna port is disposed. The fourth mounting electrode defining the monitoring port is a mounting electrode used to output a signal of the monitoring line through which a portion of electrical power is transmitted from the transmission line. | 11-17-2011 |
20110279193 | DUPLEXER MODULE - A duplexer module that prevents degradation of isolation between signal lines includes transmission filters, reception filters, phase adjusting circuits, and a multilayer substrate. The transmission filters and the reception filters are constituted as separate discrete components. The multilayer substrate includes filter mount terminals to which the transmission filters are mounted, and filter mount terminals to which the reception filters are mounted. The filter mount terminals are arranged along an upper side of the multilayer substrate, and the filter mount terminals are arranged along a lower side of the multilayer substrate. | 11-17-2011 |
20110279194 | DUPLEXER MODULE - In a duplexer module, a transmitting signal is correctly monitored without deteriorating receiving sensitivity. The duplexer module includes a transmission line, a reception line, and an antenna common line, and performs conversion between a transmission signal and a reception signals and antenna common signals. A transmission filter is inserted into the transmission line, and the transmission filter allows the transmission signal to pass therethrough and stops the reception signal. A reception filter is inserted into the reception line, and the reception filter allows the reception signal to pass therethrough and stops the transmission signal. A first line of a coupler which detects the transmitting signal is inserted into the transmission line at a stage subsequent to the transmission filter. | 11-17-2011 |
20110281540 | ANTENNA COMBINING MODULE - In an antenna combining module, coupling of an inductor and individual signal lines provided in a matching circuit is prevented and minimized and isolation of lines from one another and communication performance are improved. The antenna combining module includes a duplexer DUP and a multilayer substrate. The multilayer substrate includes a reception signal line, a transmission signal line, an antenna common line, a matching line and a ground line. A wiring electrode for an inductor is inserted into the matching line from the mounting electrode for grounding up to the position where it combines with the antenna common line. The wiring electrode for the inductor wraps around the outside of a via hole filled with a conductive material of the antenna common line. The ground line is arranged between the wiring electrode for the inductor and the reception signal line, and the transmission signal line. | 11-17-2011 |
20120200965 | ELECTRONIC COMPONENT DEVICE AND PACKAGE SUBSTRATE - In an electronic component device, an ESD protection element including a cavity portion and a pair of opposed discharge electrodes is disposed inside a package substrate. A composite portion made of a composite material including a metal material and an insulating material is disposed on a bottom of the cavity portion. The package substrate including the ESD protection element disposed therein reduces the size of the electronic component device and reliably prevents damage to and malfunctioning of the electronic component device. | 08-09-2012 |
20130176083 | CIRCUIT MODULE - In a circuit module in which a plurality of non-reciprocal circuit elements, each of which does not have a yoke, are mounted, the occurrence of magnetic coupling between the non-reciprocal circuit elements is significantly reduced and prevented. Core isolators are not arranged such that, in a state in which the direction of magnetic flux and the direction of magnetic flux are the same, the core isolators are aligned in the direction of the magnetic flux. Specifically, the core isolators generate the magnetic flux from left to right. The core isolators are aligned so as to be inclined relative to the magnetic flux. Thus, extension of the magnetic flux through the core isolator in a state of being directed in the same direction as that of the magnetic flux is significantly reduced and prevented. | 07-11-2013 |
20130181786 | CIRCUIT MODULE - A circuit module having reduced magnetic coupling between core isolators. A substrate body includes principal surfaces. A core isolator includes a ferrite, a permanent magnet that applies a DC magnetic field to the ferrite, a first center electrode provided for the ferrite and including one end connected to an input port and another end connected to an output port, and a second center electrode provided for the ferrite so as to intersect the first center electrode insulated from the second center electrode and that includes one end connected to the output port and another end connected to a ground port. The core isolator also includes no yokes preventing leakage of the DC magnetic field to the outside. The core isolators are mounted on the respective principal surfaces such that directions of the DC magnetic fields are parallel or substantially parallel to the principal surface. | 07-18-2013 |
20140169422 | HIGH FREQUENCY FRONT END MODULE - A high frequency front end module includes a variable circulator, a transmission side filter, and a reception side filter. Capacitors that are to be selectively connected by a switch are provided between an antenna side port and a transmission side port of a circulator of the variable circulator. Capacitors that are to be selectively connected by a switch are provided between the antenna side port and a reception side port of the circulator. Capacitors that are to be selectively connected by a switch are provided between the transmission side port and the reception side port of the circulator. By selecting the capacitors, phase characteristics between the ports are adjusted to the characteristics in accordance with a transmission signal and a reception signal to be transmitted. | 06-19-2014 |
Patent application number | Description | Published |
20130109057 | METHOD FOR IMMUNIZING ANIMAL, COMPOSITION FOR IMMUNIZATION, METHOD FOR PRODUCING ANTIBODY, METHOD FOR PRODUCING HYBRIDOMA, AND METHOD FOR PRODUCING MONOCLONAL ANTIBODY | 05-02-2013 |
20130195869 | ANTI-HUMAN CCR7 ANTIBODY, HYBRIDOMA, NUCLEIC ACID, VECTOR, CELL, PHARMACEUTICAL COMPOSITION, AND ANTIBODY-IMMOBILIZED CARRIER - An object of the present invention is to provide a novel anti-human CCR7 antibody useful as a therapeutic agent for tissue fibrosis or cancer, and a pharmaceutical composition containing the anti-human CCR7 antibody, and the like. An anti-human CCR7 antibody specifically binding to an extracellular domain of human CCR7, having a heavy chain CDR3 containing an amino acid sequence represented by SEQ ID NO: 7, SEQ ID NO: 17, SEQ ID NO: 27, SEQ ID NO: 37, SEQ ID NO: 47, SEQ ID NO: 57, SEQ ID NO: 67, or SEQ ID NO: 77 is provided. Also provided is an anti-human CCR7 antibody having heavy chain CDRs 1-3 and light chain CDRs 1-3 containing amino acid sequences represented by SEQ ID NOs: 5-10, 15-20, 25-30, 35-40, 45-50, 55-60, 65-70, or 75-80. Preferably, the antibody has an activity of interfering with a CCR7-dependent intracellular signal transduction mechanism caused by CCR7 ligand stimulation. The anti-human CCR7 antibody of the present invention may be used as an active ingredient of a therapeutic agent for tissue fibrosis or cancer. | 08-01-2013 |
20150017167 | ANTI-HUMAN CCR7 ANTIBODY, HYBRIDOMA, NUCLEIC ACID, VECTOR, CELL, PHARMACEUTICAL COMPOSITION, AND ANTIBODY-IMMOBILIZED CARRIER - An object of the present invention is to provide a novel anti-human CCR7 antibody useful as a therapeutic agent for tissue fibrosis or cancer, and a pharmaceutical composition containing the anti-human CCR7 antibody, and the like. An anti-human CCR7 antibody specifically binding to an extracellular domain of human CCR7, having a heavy chain CDR3 containing an amino acid sequence represented by SEQ ID NO: 7, SEQ ID NO: 17, SEQ ID NO: 27, SEQ ID NO: 37, SEQ ID NO: 47, SEQ ID NO: 57, SEQ ID NO: 67, or SEQ ID NO: 77 is provided. Also provided is an anti-human CCR7 antibody having heavy chain CDRs 1-3 and light chain CDRs 1-3 containing amino acid sequences represented by SEQ ID NOs: 5-10, 15-20, 25-30, 35-40, 45-50, 55-60, 65-70, or 75-80. Preferably, the antibody has an activity of interfering with a CCR7-dependent intracellular signal transduction mechanism caused by CCR7 ligand stimulation. The anti-human CCR7 antibody of the present invention may be used as an active ingredient of a therapeutic agent for tissue fibrosis or cancer. | 01-15-2015 |
Patent application number | Description | Published |
20150337338 | RECOMBINANT CELL AND METHOD FOR PRODUCING ISOPRENE - An object of the present invention is to provide a series of techniques for producing isoprene from methanol or the like. Provided is a recombinant cell prepared by introducing a gene encoding isoprene synthase, into a host cell which is a methylotroph, wherein the gene is expressed in the host cell, and the recombinant cell is capable of producing isoprene from at least one C1 compound selected from the group consisting of methane, methanol, methylamine, formic acid, formaldehyde, and formamide. Preferably, it has at least one C1 carbon assimilating pathway selected from the group consisting of a serine pathway, a ribulose monophosphate pathway, and a xylulose monophosphate pathway as a fixing pathway of formaldehyde. Also provided is a method for producing isoprene using the recombinant cell. | 11-26-2015 |
20150368677 | RECOMBINANT CELL, AND METHOD FOR PRODUCING 1,4-BUTANEDIOL - An object of the present invention is to provide a series of techniques for producing 1,4-butanediol from methanol or the like. Provided is a recombinant cell prepared by introducing a gene encoding at least one enzyme selected from the group consisting of succinate semialdehyde dehydrogenase, succinyl-CoA synthase, CoA-dependent succinate semialdehyde dehydrogenase, 4-hydroxybutyrate dehydrogenase, 4-hydroxybutyryl-CoA transferase, 4-hydroxybutyryl-CoA reductase, 4-hydroxybutyraldehyde dehydrogenase, and alcohol dehydrogenase, into a host cell which is a methylotroph, wherein the gene is expressed in the host cell, and the recombinant cell is capable of producing 1,4-butanediol from at least one C1 compound selected from the group consisting of methane, methanol, methylamine, formic acid, formaldehyde, and formamide. | 12-24-2015 |
Patent application number | Description | Published |
20100214188 | ANTENNA AND ELECTRONIC DEVICE EQUIPPED WITH THE SAME - An antenna includes a dielectric substrate, a ground electrode provided on a first surface of the dielectric substrate, a first antenna element and a second antenna elements provided to a second surface of the dielectric substrate, the first and second antenna elements having an identical resonance frequency and an identical Q value, a transmission line connecting the first and second antenna elements, and a feed part provided in the transmission line. | 08-26-2010 |
20100253583 | ELECTRONIC DEVICE, ANTENNA AND ARTICLE - An electronic device includes an antenna and a semiconductor element. The antenna includes a first conductor section that includes a first feeding point and spreads flatly, and a second conductor section that includes a second feeding point and spreads flatly while facing the first conductor section, the first conductor section and the second conductor section being disposed so as to be symmetric with respect to a plane, including a position of the first feeding point and a position of the second feeding point. The semiconductor element supplies the first feeding point and the second feeding point with signals opposite to each other in polarity, respectively, thereby communicating via the antenna. | 10-07-2010 |
20110240744 | ANTENNA SUBSTRATE AND RFID TAG - An antenna substrate is provided with a conductor layer, a soft magnetic layer, a patch layer, and a dielectric layer. The soft magnetic layer is disposed on the conductor layer. The patch layer includes a plurality of electromagnetic band gap electrodes which are two-dimensionally arranged on the soft magnetic layer. The dielectric layer is disposed on the patch layer. | 10-06-2011 |
Patent application number | Description | Published |
20120068312 | ADHESIVE SHEET AND METHOD FOR MANUFACTURING THE SAME, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE - An adhesive sheet comprising a release substrate | 03-22-2012 |
20120073743 | ADHESIVE SHEET AND METHOD FOR MANUFACTURING THE SAME, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE - An adhesive sheet comprising a release substrate | 03-29-2012 |
20120135176 | ADHESIVE SHEET AND METHOD FOR MANUFACTURING THE SAME, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE - An adhesive sheet comprising a release substrate | 05-31-2012 |
20120171475 | ADHESIVE SHEET AND METHOD FOR MANUFACTURING ADHESIVE SHEETS - A method for manufacturing an adhesive sheet according to the present invention is a method for manufacturing an adhesive sheet including a long peeling base material | 07-05-2012 |
20130143390 | DICING/DIE BONDING INTEGRAL FILM, DICING/DIE BONDING INTEGRAL FILM MANUFACTURING METHOD, AND SEMICONDUCTOR CHIP MANUFACTURING METHOD - A dicing/die bonding integral film of the present invention includes a base film, a pressure-sensitive adhesive layer which is formed on the base film and to which a wafer ring for blade dicing is bonded, and a bonding layer formed on the adhesive layer and having a central portion to which a semiconductor wafer to be diced is bonded, wherein a planar shape of the bonding layer is circular, an area of the bonding layer is greater than an area of the semiconductor wafer and smaller than an area of each of the base film and the adhesive layer, and a diameter of the bonding layer is greater than a diameter of the semiconductor wafer and less than an inner diameter of the wafer ring, and a difference in diameter between the bonding layer and the semiconductor wafer is greater than 20 mm and less than 35 mm, | 06-06-2013 |
20130295314 | ADHESIVE SHEET AND METHOD FOR MANUFACTURING THE SAME, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE - An adhesive sheet comprising a release substrate | 11-07-2013 |
20130302570 | ADHESIVE SHEET AND METHOD FOR MANUFACTURING THE SAME, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE - An adhesive sheet comprising a release substrate | 11-14-2013 |
Patent application number | Description | Published |
20130244116 | ELECTRODE FOR NON-AQUEOUS ELECTROLYTE SECONDARY BATTERY, NON-AQUEOUS ELECTROLYTE SECONDARY BATTERY, AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to an electrode for a non-aqueous electrolyte secondary battery, a non-aqueous electrolyte secondary battery using the electrode, and a method for manufacturing the non-aqueous electrolyte secondary battery. The electrode for a non-aqueous electrolyte secondary battery includes a material mixture layer containing an active material and a porous insulating layer. The insulating layer is formed on the material mixture layer. The insulating layer contains a resin having a cross-linked structure and inorganic particles. A mixed layer that includes components of the insulating layer and components of the material mixture layer is provided at the interface between the insulating layer and the material mixture layer. | 09-19-2013 |
20140030606 | SEPARATOR FOR ELECTROCHEMICAL DEVICE, METHOD FOR PRODUCING THE SAME, AND ELECTROCHEMICAL DEVICE - The method for producing a separator for an electrochemical device of the present invention includes: obtaining a separator forming composition, wherein the separator forming composition contains a resin raw material including a monomer or an oligomer, a solvent (a) capable of dissolving the resin raw material; and a solvent (b) capable of causing the resin raw material to agglomerate by solvent shock, and V | 01-30-2014 |
20140186682 | NON-AQUEOUS ELECTROLYTE SECONDARY BATTERY - A non-aqueous electrolyte secondary battery of the present invention includes a positive electrode, a negative electrode, and a non-aqueous electrolyte. An insulating layer is provided between the positive electrode and the negative electrode. The insulating layer contains at least one type of hydrogen carbonate selected from a sodium hydrogen carbonate and a potassium hydrogen carbonate. The hydrogen carbonate has an average particle size of 2 to 20 μm. A content of the hydrogen carbonate is 5 to 80 vol % of the total volume of the insulating layer. The insulating layer has a thickness of 4 to 40 μm. | 07-03-2014 |
Patent application number | Description | Published |
20130078526 | SEPARATOR FOR ELECTROCHEMICAL DEVICE, METHOD FOR PRODUCING THE SAME, AND ELECTROCHEMICAL DEVICE - A production method for producing a separator for an electrochemical device including the steps of: applying, to a base material, a separator forming composition containing a monomer or an oligomer and a solvent; irradiating the thus formed coating with an energy ray to form a resin (A) having a cross-linked structure; and drying the coating after formation of the resin (A) to form pores, wherein, as a solvent of the separator forming composition, a solvent (a) having a solubility parameter (SP value) of 8.1 or more and less than 8.9 is used, or a solvent (b) having an SP value of 7 or more and 8 or less and a solvent (c) having an SP value of 8.9 or more and 9.9 or less are used in combination. A separator for an electrochemical device produced by the production method, and an electrochemical device of the invention including the separator. | 03-28-2013 |
20130084494 | SEPARATOR FOR NON-AQUEOUS ELECTROLYTE SECONDARY BATTERY, METHOD FOR PRODUCING THE SAME, AND NON-AQUEOUS ELECTROLYTE SECONDARY BATTERY - The separator for non-aqueous electrolyte secondary batteries according to the present invention includes at least a resin (A) having a crosslinked structure. The resin having the crosslinked structure is obtained by applying energy rays to at least an oligomer that is capable of being polymerized by irradiation with energy rays, and the resin (A) has a glass transition temperature higher than 0° C. and lower than 80° C. The separator for non-aqueous electrolyte secondary batteries according to the present invention can be produced using a method of the present invention including the steps of applying a separator-forming composition containing an oligomer and a solvent to a base substrate, forming a resin (A) by irradiation with energy rays, and forming pores by drying a coating film after the resin (A) has been formed. Furthermore, the non-aqueous electrolyte secondary battery of the present invention includes the separator for non-aqueous electrolyte secondary batteries according to the present invention. | 04-04-2013 |
20130224559 | SEPARATOR FOR NONAQUEOUS ELECTROLYTE SECONDARY BATTERY, METHOD FOR PRODUCING THE SAME, AND NONAQUEOUS ELECTROLYTE SECONDARY BATTERY - A separator for a nonaqueous electrolyte secondary battery that at least includes a resin (A) having a crosslinked structure, which is obtained by irradiating with an energy ray an oligomer polymerizable by irradiation with an energy ray. The separator has an average pore size of 0.005 to 0.5 μm, an air permeability of 50 sec/100 mL or more and less than 500 sec/100 mL, where the air permeability is expressed as a Gurley value, and a thermal shrinkage of less than 2% at 175° C. The separator for a nonaqueous secondary battery can be produced by the production method of the present invention, which includes the steps of: applying to a substrate a separator forming composition containing the oligomer, two or more kinds of solvents having different polarity from each other, and the like; irradiating the applied composition with an energy ray; and drying the energy ray-irradiated composition. | 08-29-2013 |
20130224575 | LITHIUM ION SECONDARY BATTERY - A lithium ion secondary battery containing a negative electrode active material containing Si and O as constituent elements and exhibiting excellent charge-discharge cycle characteristics. The lithium ion secondary battery has a positive electrode having a positive electrode material mixture layer, a negative electrode, a separator and a nonaqueous electrolyte containing at least an electrolyte salt and an organic solvent, where the negative electrode has a negative electrode material mixture layer containing a negative electrode active material containing Si and O as constituent elements (the atomic ratio x of O to Si is 0.5≦x≦1.5). The nonaqueous electrolyte contains the electrolyte salt at a concentration exceeding a concentration at which conductivity in the nonaqueous electrolyte containing the electrolyte salt and the organic solvent is maximized, and the conductivity at 25° C. is 6.5 to 16 mS/cm | 08-29-2013 |
Patent application number | Description | Published |
20140162085 | ALUMINUM ALLOY FOIL FOR ELECTRODE COLLECTOR AND PRODUCTION METHOD THEREFOR - An object of the present invention is to provide an aluminum alloy foil for an electrode current collector, the foil having a high strength after the drying step while keeping a high electrical conductivity. Disclosed is a method for manufacturing an aluminum alloy foil for electrode current collector, including: maintaining an aluminum alloy ingot comprising 0.03 to 0.1% of Fe, 0.01 to 0.1% of Si, 0.0001 to 0.01% of Cu, 0.005% or less of Mn, with the rest being Al and unavoidable impurities, at 550 to 620° C. for 1 to 20 hours, and subjecting the resulting ingot under a hot rolling with a starting temperature of 500° C. or higher and an end-point temperature of 255 to 300° C. | 06-12-2014 |
20140178709 | ALUMINUM ALLOY FOIL FOR ELECTRODE COLLECTORS AND PRODUCTION METHOD THEREFOR - An object of the present invention is to provide an aluminum alloy foil for an electrode current collector, the foil having a high strength after the drying step while keeping a high electrical conductivity. Disclosed is a method for manufacturing an aluminum alloy foil for electrode current collector, including: maintaining an aluminum alloy ingot comprising 0.1 to 0.5% of Fe, 0.01 to 0.3% of Si, 0.01 to 0.2% of Cu, 0.01% or less of Mn, with the rest being Al and unavoidable impurities, at 550 to 620° C. for 1 to 20 hours, and subjecting the resulting ingot under a hot rolling with a starting temperature of 500° C. or higher and an end-point temperature of 255 to 300° C. | 06-26-2014 |
20140205900 | ALUMINUM ALLOY FOIL FOR ELECTRODE COLLECTOR AND PRODUCTION METHOD THEREFOR - An object of the present invention is to provide an aluminum alloy foil for an electrode current collector, the foil having a high strength and high strength after a drying process. The aluminum alloy foil can be manufactured at low cost. Disclosed is an aluminum alloy foil for electrode current collector, including 0.03 to 1.0% of Fe, 0.01 to 0.2% of Si, 0.0001 to 0.2% of Cu, 0.005 to 0.03% of Ti, with the rest being Al and unavoidable impurities. The aluminum alloy foil has Fe solid solution content of 200 ppm or higher, and an intermetallic compound having a maximum diameter length of 0.1 to 1.0 μm in an number density of 2.0×10 | 07-24-2014 |
20140261908 | ALUMINUM ALLOY FOIL FOR ELECTRODE COLLECTOR AND PRODUCTION METHOD THEREFOR - An object of the present invention is to provide an aluminum alloy foil for an electrode current collector and a manufacturing method thereof, the foil having a high strength and high strength after a drying process after the application of the active material while keeping a high electrical conductivity. Disclosed is a method for manufacturing an aluminum alloy foil for electrode current collector, including: forming by continuous casting an aluminum alloy sheet containing 0.03 to 1.0% of Fe, 0.01 to 0.2% of Si, 0.0001 to 0.2% of Cu, with the rest being Al and unavoidable impurities, performing cold rolling to the aluminum alloy sheet at a cold rolling reduction of 80% or lower, and performing heat treatment at 550 to 620° C. for 1 to 15 hours. | 09-18-2014 |
20150248973 | ALUMINUM ALLOY FOIL FOR ELECTRODE CHARGE COLLECTOR, AND METHOD FOR PRODUCING SAME - An object of the present invention is to provide an aluminum alloy foil for electrode current collectors having superior rolling properties, high conductivity, and high strength after the drying step following the application of the active material. According to the present invention, an aluminum alloy foil for electrode current collector, including 0.03 to 0.1% of Fe, 0.005 to 0.02% of Ti, 0 to 0.1% of Si, 0 to 0.01% of Cu, 99.85% or more of Al, with the rest being unavoidable impurities, wherein tensile strength of the aluminum alloy foil is 175 MPa or higher, and electrical conductivity of the aluminum alloy foil is 60% IACS or higher, is provided. | 09-03-2015 |
Patent application number | Description | Published |
20130269842 | ALUMINUM ALLOY FOIL FOR ELECTRODE CURRENT COLLECTORS AND MANUFACTURING METHOD THEREOF - It is an object to provide an aluminum alloy foil for an electrode current collector, the foil having a high post-drying strength after application of an active material while keeping a high electrical conductivity. Disclosed is an aluminum alloy foil for an electrode current collector, comprising 0.03 to 0.1 mass % (hereinafter, “mass %” is simply referred to as “%”) of Fe, 0.01 to 0.1% of Si, and 0.0001 to 0.01% of Cu, with the rest consisting of Al and unavoidable impurities, wherein the aluminum alloy foil after final cold rolling has a tensile strength of 180 MPa or higher, a 0.2% yield strength of 160 MPa or higher, and an electrical conductivity of 60% IACS or higher; and the aluminum alloy foil has a tensile strength of 170 MPa or higher and a 0.2% yield strength of 150 MPa or higher even after the aluminum alloy foil is subjected to heat treatment at any of 120° C. for 24 hours, 140° C. for 3 hours, and 160° C. for 15 minutes. | 10-17-2013 |
20130302676 | ALUMINUM ALLOY FOIL FOR ELECTRODE CURRENT COLLECTORS AND MANUFACTURING METHOD THEREOF - It is an object to provide an aluminum alloy foil for an electrode current collector, the foil having a high post-drying strength after application of an active material while keeping a high electrical conductivity. Disclosed is an aluminum alloy foil for an electrode current collector, comprising 0.1 to 1.0 mass % (hereinafter, “mass %” is simply referred to as “%”) of Fe, 0.01 to 0.5% of Si, and 0.01 to 0.2% of Cu, with the rest consisting of Al and unavoidable impurities, wherein the aluminum alloy foil after final cold rolling has a tensile strength of 220 MPa or higher, a 0.2% yield strength of 180 MPa or higher, and an electrical conductivity of 58% IACS or higher; and the aluminum ally foil has a tensile strength of 190 MPa or higher and a 0.2% yield strength of 160 MPa or higher even after the aluminum alloy foil is subjected to heat treatment at any of 120° C. for 24 hours, 140° C. for 3 hours, and 160° C. for 15 minutes. | 11-14-2013 |
20150132657 | ALUMINUM ALLOY FOIL FOR ELECTRODE CURRENT COLLECTOR, METHOD FOR MANUFACTURING SAME, AND LITHIUM ION SECONDARY BATTERY - The present invention provides an aluminum alloy foil for electrode current collector, high in strength and superior in heat resistance after the active material coating/drying process of the manufacture of the battery, a manufacturing method thereof, and a lithium ion secondary battery. According to the present invention, an aluminum alloy foil for electrode current collector, including 0.1 to 0.5 mass % (hereinafter mass % is referred to as %) of Fe, 0.01 to 0.5% of Si, 0.01 to 0.2% of Cu, 0.01 to 0.5% of Mn, with the rest being Al and unavoidable impurities, wherein tensile strength of an aluminum alloy foil and a heat treatment selected from 24 hours at 100° C., 3 hours at 150° C., and 15 minutes at 200° C., is 210 MPa or higher, a manufacturing method thereof, and a lithium ion secondary battery are provided. | 05-14-2015 |
20150188145 | ALUMINUM ALLOY FOIL FOR ELECTRODE CURRENT COLLECTOR, METHOD FOR MANUFACTURING SAME, AND ELECTRODE MATERIAL - The present invention provides an aluminum alloy foil, capable of going under thin rolling during its manufacture. The aluminum alloy foil shall also avoid cuts during the active material paste coating process and wrinkles during the press working process, and have suitable strength for the series of manufacturing processes from the manufacture of the aluminum alloy foil to the manufacture of the electrode material. Further, the present invention provides an aluminum alloy foil for electrode current collector, including 0.50 to 1.50 mass % (hereinafter mass % is referred to as %) of Mn, 0.05 to 0.50% of Cu, 0.20 to 1.00% of Fe, 0.01 to 0.60% of Si, with the rest consisting of Al and unavoidable impurities, a manufacturing method thereof, and an electrode material. Here, regarding the aluminum alloy foil, a solid solution amount of Mn is 1500 ppm or more, a solid solution amount of Cu is 40 ppm or more, and a tensile strength after a final cold rolling (T1) is 260 MPa or higher and 350 MPa or lower. | 07-02-2015 |