Patent application number | Description | Published |
20080198898 | APPARATUS, SYSTEM AND METHOD FOR HIGH RESOLUTION IDENTIFICATION WITH TEMPERATURE DEPENDENT RESISTIVE DEVICE - A temperature measuring and identification (TMID) device obtains identification information and temperature information of a connected device having a temperature sensing circuit (TSC). The TSC includes a temperature sensing element (TSE) connected in parallel with a voltage clamping network (VCN) that limits the voltage across the TSE to an identification voltage within an identification voltage range when the voltage is greater than or equal to a lower voltage of the identification voltage range. When a voltage below the lower range is applied to the TSC, the VCN appears as an open circuit and the resistance of the TSC corresponds to temperature. A translation circuit within the TMID shifts TSC voltages within the identification voltage range to a normalization voltage range. Accordingly, voltages corresponding to temperature as well as voltages corresponding to identification are within the normalization voltage range. As a result, the resolution of a voltage sensing device used for measuring the temperature and identification voltages is maximized. In addition, the translation circuit maintains a minimal current during a rest state. For cost or other concerns, a first TSC may omit the VCN to provide a maximum identification voltage and other TSCs may include VCNs with lower identification voltage ranges. | 08-21-2008 |
20090014309 | INITIALIZING A CAPACITIVE SENSING SWITCH FOR A WIRELESS DEVICE - An apparatus, system, and method that initialize a capacitive sensing switch and detects a pushed button are described. The apparatus comprises a keypad, a logic component, an initialization threshold, a measured capacitive value, and a processor. The keypad is disposed on the wireless device and comprises at least one capacitive sensing switch. The logic component is configured to determine a capacitive sensing range for each capacitive sensing switch, wherein the capacitive sensing range corresponds to the difference between the maximum capacitance and the minimum capacitance. The initialization threshold is associated with the capacitive sensing range and each capacitive sensing switch is initialized when the capacitive sensing range exceeds the initialization threshold. The measured capacitive value measures the capacitive value for each capacitive sensing switch and a corresponding push-button threshold determines whether the button has been pushed. The processor is configured to process computer instructions that correspond to each capacitive sensing switch when the capacitive sensing range exceeds the initialization threshold and when the measured capacitive value for each capacitive sensing switch exceeds the push-button threshold. | 01-15-2009 |
20090243695 | BI-DIRECTIONAL LEVEL SHIFTED INTERRUPT CONTROL - The present example provides a circuit offering interoperability between circuits that may be powered from differing voltages, and that may operate at differing logic levels. Isolation may be provided from the impedance provided by transistor circuits and level shifting may be provided by a divider network. Accordingly, an exemplary slave and a master (or equivalently two circuits which are being coupled together) can operate on different voltages. This may be useful because some circuits such as processors can require higher or lower voltage than other processors that are sought to be coupled together. The circuit also may require one “read only” and another “input/output” pin, therefore, reducing the resources needed to implement the circuit functions. The present example can be useful for microprocessors that can use a software algorithm for the communications protocol, which can be economical to implement as it utilizes one input/output pin and one input only pin. | 10-01-2009 |
20090248932 | BI-DIRECTIONAL SINGLE CONDUCTOR INTERRUPT LINE FOR COMMUNICATION BUS - A bi-directional single conductor interrupt line is used in conjunction with a master only initiated data communication bus, to allow a slave device to submit a slave service request to a master device and to acknowledge master service requests from the master device. When not submitting a master service request, the master device maintains an interrupt line voltage at an idle state voltage by setting the interrupt line voltage through a pull resistor. The slave and master devices submit service requests by respectively driving or pulling the interrupt line voltage from the idle voltage to the service request voltage. The slave responds to a master service request or initiates the master servicing of a slave service request by subsequently driving the interrupt line back to the idle state voltage giving a slower slave ample time to prepare for a pending master initiated data transaction. The master detects the change in the interrupt line voltage from the request to the idle state and communicates to the now readied slave device through the data communication bus. | 10-01-2009 |
20100277351 | CAPACITIVE SENSING USER INTERFACES AND IMPLEMENTATION THEREOF - Methods and apparatus for determining the operating states of a plurality of capacitive sensing buttons in a capacitive sensing user interface are disclosed. The capacitive sensing buttons are sampled in a round-robin fashion such that the decay time samples for the buttons are acquired in an interleaved manner during each sampling cycle. Provisions are made to reduce the initialization delay, to reduce transient-induced errors, and to obtain the operating states based on updated decay data samples for the buttons. | 11-04-2010 |
Patent application number | Description | Published |
20130201615 | THREE DIMENSIONAL PASSIVE MULTI-COMPONENT STRUCTURES - Stacked arrays of components are disclosed. In one embodiment, a first and a second layer of components are electrically and mechanically coupled to an interposer with an encapsulated third layer of components disposed between the first and second layers. The first layer can be configured to attach the stacked array to a host printed circuit board. The interposer can couple signals between the components on the first and second layers. | 08-08-2013 |
20130201616 | THREE DIMENSIONAL PASSIVE MULTI-COMPONENT STRUCTURES - Stacked arrays of components are disclosed. In one embodiment, a first and a second layer of components are electrically and mechanically coupled to a thin interposer disposed between the first and second layers. The first layer can be configured to attach the stacked array to a host printed circuit board. The interposer can insulate the components from one another and also couple signals between the components on the first and second layers. In one embodiment, the components in the first and second layers are passive components. | 08-08-2013 |
20130223041 | LOW PROFILE, SPACE EFFICIENT CIRCUIT SHIELDS - A low profile, space efficient circuit shield is disclosed. The shield includes top and bottom metal layers disposed on the top of and below an integrated circuit. In one embodiment the shield can include edge plating arranged to encircle the edges of the integrated circuit and couple the top and bottom metal layers together. In another embodiment, the shield can include through vias arranged to encircle the edges of the integrated circuit and couple the top and bottom metal layers together. In yet another embodiment, passive components can be disposed adjacent to the integrated circuit within the shield. | 08-29-2013 |
20140028518 | Antenna Structures and Shield Layers on Packaged Wireless Circuits - An electronic device may be provided with antenna structures. Circuitry such as radio-frequency transceiver circuitry and impedance matching and filter circuitry may be implemented using one or more circuit components and embedded within an insulator to form packaged circuitry. The insulator may be formed from multiple layers of printed circuit board material or from plastic molded onto a printed circuit board substrate over the circuitry. A metal shield layer may be interposed between the packaged circuitry and the antenna structures. The metal shield layer may be mounted on the surface of the packaged circuitry using a layer of adhesive. A layer of polymer may be interposed between the layer of adhesive and the metal shielding layer. The metal shield layer may have an opening through which conductive paths may pass to couple the packaged circuitry to antenna terminals on the antenna structures. | 01-30-2014 |
20140076621 | ACOUSTICALLY QUIET CAPACITORS - The described embodiments relate generally to printed circuit boards (PCBs) including a capacitor and more specifically to designs for mechanically isolating the capacitor from the PCB to reduce an acoustic noise produced when the capacitor imparts a piezoelectric force on the PCB. Conductive features can be mechanically and electrically coupled to electrodes located on two ends of the capacitor. The conductive features can be placed in corners where the amplitude of vibrations created by the piezoelectric forces is relatively small. The conductive features can then be soldered to a land pattern on the PCB to form a mechanical and electrical connection while reducing an amount of vibrational energy transferred from the capacitor to the PCB. | 03-20-2014 |
20140085851 | SMALL FORM FACTOR STACKED ELECTRICAL PASSIVE DEVICES THAT REDUCE THE DISTANCE TO THE GROUND PLANE - The described embodiments relate generally to electronic components and more specifically to a capacitor array that can increase component density on a printed circuit board and reduce a distance to a ground plane. An array of capacitors can be formed by coupling a group of capacitors on their sides interspersed with interposer boards. The resulting configuration can increase component density and reduce an amount of resistance and effective series inductance between a set of power decoupling capacitors and an integrated circuit. | 03-27-2014 |
20140218841 | LOW ACOUSTIC NOISE CAPACITORS - The described embodiments relate generally to a capacitor assembly for mounting on a printed circuit board (PCB) and more specifically to designs for mechanically isolating the capacitor assembly from the PCB to reduce an acoustic noise produced when the capacitor imparts a piezoelectric force on the PCB. Termination elements in the capacitor assembly, including a porous conductive layer in the capacitor assembly may reduce an amount of vibrational energy transferred from the capacitor to the PCB. Termination elements including a soft contact layer may also reduce the amount of vibrational energy transferred to the PCB. Further, capacitor assemblies having thickened dielectric material may reduce the amount of vibrational energy transferred to the PCB. | 08-07-2014 |
20150070864 | Electronic Device With Printed Circuit Board Noise Reduction Using Elastomeric Damming and Damping Structures - An electronic device may be provided with integrated circuits and electrical components such as capacitors that are soldered to printed circuit boards. Liquid polymer adhesive such as encapsulant and underfill materials may be deposited on the printed circuit. Electrical components such as capacitors may be coated with the encapsulant. The underfill may be deposited adjacent to an integrated circuit, so that the underfill wicks into a gap between the integrated circuit and the printed circuit board. The encapsulant may be more viscous than the underfill and may therefore prevent the flowing underfill from reaching the electrical components. Some of the encapsulant may be located between the electrical components and the printed circuit board. The encapsulant can be cured to form an elastomeric material covering the electrical components that helps damp vibrations. The elastomeric material may be less stiff than the underfill. | 03-12-2015 |
Patent application number | Description | Published |
20090189416 | VEHICLE SKYLIGHT AND METHOD FOR INSTALLING SAME - A skylight is provided for mounting to a wall of a vehicle to allow passage of light through the wall. The skylight may include a frame having a window that is configured to allow passage of light through at least a portion of the frame, and the frame may define an inner periphery about the window. A wall member may extend away from the frame adjacent to and about the inner periphery of the frame. A plurality of spaced apart gripping arms may extend away from one of the wall member and the frame adjacent to the inner periphery of the frame with the plurality of gripping arms extending beyond the wall member. Each of the plurality of gripping arms may be configured to engage the wall of the vehicle. | 07-30-2009 |
20090206631 | LOGISTICS PANEL FOR USE IN A SIDEWALL OF A TRAILER - A logistics panel includes a composite panel that is formed of inner and outer skins and a core member secured therebetween. The composite panel has top and bottom end portions and first and second side end portions. The composite panel further has an aperture set provided therethrough which defines at least one aperture which extends through the inner and outer skins and the core member and between the end portions. Multiple logistics panels can be used to form a sidewall of a trailer by joining the first side end portion of one panel to the second side end portion of an adjacent panel. Top and bottom rails are secured to the top and bottom end portions, respectively, of the panels. | 08-20-2009 |
20100089917 | FOLDABLE MOBILE STORAGE CONTAINER - A foldable mobile storage container includes a floor assembly, first and second sidewall assemblies, a rear frame assembly, a front end assembly, and a roof assembly. The first and second sidewall assemblies, the rear end assembly, and the front end assembly are each pivotally coupled to the floor assembly to allow the mobile storage container to be moved between a use configuration for storing items therein and a stowed configuration. | 04-15-2010 |
20100259068 | LOGISTICS PANEL FOR USE IN A SIDEWALL OF A TRAILER - A logistics panel includes a composite panel that is formed of inner and outer skins and a core member secured therebetween. The composite panel has top and bottom end portions and first and second side end portions. The composite panel further has an aperture set provided therethrough which defines at least one aperture which extends through the inner and outer skins and the core member and between the end portions. Multiple logistics panels can be used to form a sidewall of a trailer by joining the first side end portion of one panel to the second side end portion of an adjacent panel. Top and bottom rails are secured to the top and bottom end portions, respectively, of the panels. | 10-14-2010 |
20110260500 | ROOF ASSEMBLY FOR STORAGE CONTAINER - A roof assembly for a storage container, such as a truck trailer, includes a sheet having a plurality of laterally-extending corrugations formed therein. Illustratively, each corrugation is configured to progressively flatten outwardly from a longitudinal centerline of the roof assembly towards an outer end of the sheet. The longitudinal centerline of the roof assembly extends perpendicular to each corrugation. The outer end of the sheet is configured to be coupled to a sidewall of the truck trailer. | 10-27-2011 |