Patent application number | Description | Published |
20090140248 | On-Chip Test Circuit for an Embedded Comparator - A semiconductor chip including an embedded comparator is provided with an on-chip test circuit for the comparator. The test circuit includes an analog input unit which, during a test mode of the chip, produces a range of analog voltage signals that are applied to a first input of the comparator and a threshold voltage signal that is applied to a second input of the comparator. A switch control unit is provided to control the application of a predetermined sequential pattern of these analog voltage signals to the first input of the comparator in synchrony with a clock signal supplied to the switch control unit during a predetermined test period. A digital measurement unit is provided to receive output signals from the comparator during the test period in response to the input patterns, to compare the output signals with the clock signal, and to measure and to store data relating thereto. | 06-04-2009 |
20100075615 | High Speed Serial Link with Power Spectral Density Frequency Response Suppression - This disclosure relates to noise suppression in data transfers in transceivers of wireless devices. | 03-25-2010 |
20130043878 | COMMUNICATION LINE DRIVER PROTECTION CIRCUITRY, SYSTEMS AND METHODS - Embodiments relate to fault detection comparator circuitry and methods that can operate in conjunction with a power-on-reset (POR) scheme to put a chip into a reliable power-down mode upon fault detection to avoid disrupting the communication bus link such that other connected chips and the host can continue to operate. Power-on of the affected chip can then be carried out when the connection with that chip is restored. | 02-21-2013 |
20140145777 | System and Method for a Level Shifter - In accordance with an embodiment, a level shifter circuit includes a reconfigurable level shifting core coupled to a first node and a second node. The reconfigurable level shifting core is configured as a current mirror in a first mode, and as a cross-coupled device in a second mode. In the first mode, the current mirror mirrors a current at the first node to the second node, and in the second mode, the cross-coupled device produces a current at the second node in response to a voltage at the first node, and a current at the first node in response to a voltage at the second node. | 05-29-2014 |
Patent application number | Description | Published |
20080315720 | Ultrasonic Mechanical Emulsifier - A tubular piezoelectric transducer comprising a tube of piezoelectric material and having a plurality of external electrodes for inducing in a first end of the tube at least one movement of a plurality of possible movements; at least two spokes attached to and extending radially inwardly of the tube for movement with the first end; a hub at an inner end of the at least two spokes and being located on the longitudinal axis of the tube, the hub being attached to the at least two spokes for movement therewith; the hub being for receiving therein a probe for movement of the probe with the hub. A phaco-probe incorporating the transducer is also disclosed. | 12-25-2008 |
20090312709 | SELF-CONTAINED PUMP - A self-contained pump is disclosed that is an integrated pump. It has a reservoir, a pumping mechanism, and at least one outlet. The pumping mechanism is for controlled compression of the reservoir to force a required volume of fluid in the reservoir through the at least one outlet. | 12-17-2009 |
20100057097 | Micro-emulsifier for arterial thrombus removal - Disclosed is a micro-emulsifier comprising a stack of piezoelectric materials, a horn at a proximal end of the stack of piezoelectric materials, and a transmission wire receivable in the horn for transmission of ultrasound waves able to be produced by the stack of piezoelectric materials. The ultrasound waves are able to be produced in a direction parallel to a longitudinal axis of the stack of piezoelectric materials and the horn. The transmission wire comprises a first end receivable in the horn and a second end remote from the first end, the second end having a bulb thereon. | 03-04-2010 |
20110027376 | Hollow Multi-Layered Microspheres for Delivery of Hydrophilic Active Compounds - The present invention refers to a method of synthesizing a multi-walled microsphere comprising at least one hydrophilic active compound as well as to a multi-walled microsphere obtained by the method of the present invention. The present invention further refers pharmaceutical compositions including multi-walled microspheres of the present invention. | 02-03-2011 |
20110151569 | IDENTIFICATION OF SAMPLE COMPONENTS - The present disclosure relates to the identification of components in a sample based on the chemical nature of the component. In particular, although not exclusively, the present disclosure relates to the identification of hydrophobic and hydrophilic components using a mass spectrometric technique. The present invention also relates to kits and products used in the identification of the components, as well as other subject matter. | 06-23-2011 |
20110268594 | ELECTRO-ACTIVE VALVELESS PUMP - An electro-active, valveless pump having a pumping chamber with at least one chamber wall. There is at least one opening in the at least one chamber wall. An electro-active actuator is located over each of the openings for inducing fluid flow. | 11-03-2011 |
20120275941 | ULTRASONIC FLUID PRESSURE GENERATOR - An ultrasonic fluid pressure generator for generating high pressure head in a fluid. The ultrasonic fluid pressure generator comprises a transducer comprising a piezoelectric actuator and a displacement amplifier, the displacement amplifier having a fluid channel therethrough, the displacement amplifier being connected to the piezoelectric actuator at one end and having a free vibrating tip at another end; a reflecting condenser disposed at the vibrating tip of the displacement amplifier to form a gap between the vibrating tip and a reflecting surface of the reflecting condenser; and a casing configured for establishing a standing wave in the fluid contained within the casing, the transducer and the reflecting condenser being at least in part within the casing. | 11-01-2012 |
20130314844 | METHOD OF PREPARING REDUCED GRAPHENE OXIDE FOAM - A method of preparing a reduced graphene oxide foam, the method comprising the steps of: preparing a colloidal suspension of graphene oxide; forming a graphene oxide compact layered film from the colloidal suspension of graphene oxide using flow-directed assembly; and chemically reducing the graphene oxide compact layered film using a chemical reducing agent to form a porous and continuous cross-linked structure that is the reduced graphene oxide foam. | 11-28-2013 |
Patent application number | Description | Published |
20130307630 | Integrated Circuit Architecture with Strongly Coupled LC Tanks - An integrated circuit for a radio frequency (RF) circuit such as a voltage controlled oscillator or an injection locked frequency divider is provided. The integrated circuit architecture includes a primary LC tank circuit comprising a first inductor and a first capacitive device connected in parallel and one or more secondary LC tank circuits, each comprising an inductor and a capacitive device connected in parallel. Each of the one or more secondary LC tank circuits is strongly coupled to the primary LC tank circuit and to each other either electrically, magnetically or a combination of electrically and magnetically. | 11-21-2013 |
20130328642 | Miniaturized Passive Low Pass Filter - A low pass filter circuit ( | 12-12-2013 |
20130335147 | Power Amplifier and Linearization Techniques Using Active and Passive Devices - Designs and techniques for improving the linearity of the power amplifiers, especially of the non-linear types, operated in microwave and millimeter-wave frequency using method through purposely designed active transistors or passive devices or both, are disclosed. The techniques use the manipulation of transistors' cut-off frequencies (fT) design, attached loaded linearization stub and characteristics of space attenuation of microwave signals individually or in combination of them. The disclosed techniques provide the advantages to compromise the performance among linearity, gain and power consumption in a wide range of power amplifier types, such as Class- AB, B, C, D, E and F in the different application scenarios. | 12-19-2013 |
20140035703 | Multiple-Mode Filter for Radio Frequency Integrated Circuits - A fully integrated silicon-based bandpass filter which lends itself to applications in the gigahertz region is disclosed. The bandpass filter is fabricated on an integrated circuit and operates as a microwave/millimeter-wave filtering circuit. In accordance with one aspect, the bandpass filter includes a first set and a second set of filter coupled elements, a three-port “T” transmission line junction and a perturbing element. The three-port “T” transmission line junction has a first port coupled to a first end of a first one of the first set of filter coupled elements and a second port coupled to a first end of a first one of the second set of filter coupled elements. The perturbing element is coupled to a third port of the three-port “T” transmission line junction. A second one of the first set of filter coupled elements includes an input transmission line and has a first end thereof coupled to an input port and an opposite end thereof having an open end. A second one of the second set of filter coupled elements includes an output transmission line and has a first end thereof coupled to an output port and an opposite end thereof having an open end. | 02-06-2014 |
20140049862 | Miniature Passive Structures for ESD Protection and Input and Output Matching - A miniature passive structure for electrostatic discharge (ESD) protection and input/output (I/O) matching for a high frequency integrated circuit is provided. The miniature passive structure includes at least one shunt stub and at least one load line. The shunt stub(s) each provide a corresponding ESD discharge path. The load line(s) are coupled to the shunt stub(s) and provide loading effects for the shunt stub(s). | 02-20-2014 |
20150145098 | MINIATURE PASSIVE STRUCTURES, HIGH FREQUENCY ELECTROSTATIC DISCHARGE PROTECTION NETWORKS, AND HIGH FREQUENCY ELECTROSTATIC DISCHARGE PROTECTION SCHEMES - According to various embodiments, a miniature passive structure for electrostatic discharge protection and input/output matching for a high frequency integrated circuit may be provided. The structure may include: either a transmission line or an inductor for providing at least one electrostatic discharge path; and a capacitor with a first end connected to the transmission line or inductor and a second end connected to ground. | 05-28-2015 |
Patent application number | Description | Published |
20090050169 | HAIR TREATMENT FLUID APPLICATION DEVICE - A hair treatment fluid application device includes a flexible container for containing a hair treatment fluid, an applicator body having outlet orifices for applying the hair treatment fluid to hair, the flexible container having a passage opening for allowing egress of the hair treatment fluid from the flexible container to the applicator body, a housing for accommodating the flexible container, a piston for exerting pressure on the flexible container for forcing the hair treatment fluid from the flexible container through the passage opening to the applicator body by deforming the flexible container, and a driver for driving the piston. | 02-26-2009 |
20090293897 | HAIR TREATMENT FLUID APPLICATION DEVICE - A hair treatment fluid application device includes a flexible container for containing a hair treatment fluid, an applicator body having outlet orifices for applying the hair treatment fluid to hair, the flexible container having a passage opening for allowing egress of the hair treatment fluid from the flexible container to the applicator body, a housing for accommodating the flexible container, a piston for exerting pressure on the flexible container for forcing the hair treatment fluid from the flexible container through the passage opening to the applicator body by deforming the flexible container, and a driver for driving the piston. | 12-03-2009 |
20100043260 | METHOD FOR OPERATING AN ACTIVE IRONING BOARD - An ironing board ( | 02-25-2010 |
20100095565 | IRONING BOARD HAVING A TILTABLE BODY - An ironing board for multifunctional use comprising a base ( | 04-22-2010 |
20100146827 | IRONINGBOARD ADUSTABLE IN HEIGHT - An ironing board comprises a base ( | 06-17-2010 |
20100162596 | IRONING BOARD HAVING AN EXTENDABLE AND RECTRACTABLE BASE - An ironing board ( | 07-01-2010 |
Patent application number | Description | Published |
20100019417 | DEVICE AND METHOD FOR CURING HEARING AID HOUSINGS - A device and a method for curing plastic moldings are particularly suited for curing hearing aid housings. A light source emits curing light and a holder, at least partially transparent to curing light, holds the plastic moldings. The holder has an elongate light guiding element, which is transparent to curing light, which has an emission portion for emitting curing light in a number of spatial directions, and which is formed in such a way that at least the emission portion can protrude into a convex curvature or an interior space of a plastic molding that is being held by the holder. The light guiding element guides curing light emitted from the light source to the emission portion and emits from there. The light guiding element may have a holding portion for holding the plastic molding. The holding portion and the emission portion may spatially overlap. The method includes a step of irradiating the plastic molding with curing light simultaneously on the outside and the inside by the light source and by the light guiding element. Particularly uniform curing without localized temperature peaks is achieved. | 01-28-2010 |
20100160714 | Hearing Aid - A hearing aid has a hearing aid component, a brain wave signal receiver configured to receive brain wave signals, and a hearing aid controller configured to control the hearing aid component dependent on the detected brain wave signals. Therefore the hearing aid can be controlled by the detected brain wave signals. | 06-24-2010 |
20100224605 | RAPID PROTOTYPING DEVICE AND METHOD WITH INDIRECT LASER EXPOSURE - It is desirable for the production of workpieces, which are sometimes produced by a rapid prototyping method, to be further automatable. To this end a device is provided having a laser for generating a laser beam in order to set a material, and a workpiece support which can be exposed directly to the laser. There is also provided an optical instrument for redirecting and deviating the laser beam so that the workpiece support can also be exposed indirectly to the laser. Material can therefore also be cured more easily in undercuts of workpiece blanks. | 09-09-2010 |
20100272273 | DEVICE FOR ACOUSTICALLY ANALYZING A HEARING DEVICE AND ANALYSIS METHOD - A device for acoustic analysis has a first hearing device with a first sound input and a first sound output and a second hearing device with a second sound input and a second sound output. The first hearing device is in acoustic communication with the second hearing device. The first hearing device can analyze the acoustic communication and output a corresponding result. Consequently, two hearing aids, for example, can test each other, and permit a user to check hearing devices and, in particular, hearing aids in a simple fashion without the hearing aid wearer having to visit an audiologist for the test. | 10-28-2010 |
Patent application number | Description | Published |
20110156236 | THERMALLY ENHANCED EXPANDED WAFER LEVEL PACKAGE BALL GRID ARRAY STRUCTURE AND METHOD OF MAKING THE SAME - A thermally enhanced expanded wafer level ball grid array package. The expanded wafer level ball grid array package includes an integrated thermally conductive heat dissipater. In one embodiment the heat dissipater is positioned in close proximity to a non-active face of a die and is separated from the non-active face by a thermal interface material. In another embodiment the heat dissipater includes legs that displace the heat dissipater a short distance from the non-active die face, with the intervening space occupied by encapsulation material. In yet another embodiment, the thermal interface material exists between the non-active die face and the heat dissipater, but extends beyond the edge of the semiconductor die to also cover a portion of the encapsulation material. Methods for making the various embodiments of the expanded wafer level ball grid array package are also shown. | 06-30-2011 |
20130001740 | HEAT SPREADER FOR THERMALLY ENHANCED FLIP-CHIP BALL GRID ARRAY PACKAGE - A heat spreader is provided for use with a thermally enhanced flip-chip ball grid array package. In the package, a semiconductor die is positioned front-side down on a package substrate, coupled thereto via solder balls. Passive devices can also be coupled to the substrate alongside the die. The heat spreader is positioned over the substrate and die, in thermal contact with the die. A projection in the center of the heat spreader makes contact with the back surface of the die via a thermal interface material, to draw heat from the die for improved cooling. The projection enables close contact with a thinned die while accommodating thicker passive devices positioned around the die on the substrate. | 01-03-2013 |
20130093072 | LEADFRAME PAD DESIGN WITH ENHANCED ROBUSTNESS TO DIE CRACK FAILURE - A leadframe includes a die pad and a protective wall surrounding the die pad. A semiconductor die is situated on the die pad. Indentations are formed on the four inner corners of the protective wall adjacent the corners of the semiconductor die. | 04-18-2013 |
20140291782 | METHODS AND DEVICES FOR PACKAGING INTEGRATED CIRCUITS - Methods and devices for packaging integrated circuits. A packaged device may include an integrated circuit, a first packaging component including a patterned surface, and a second packaging component. The patterned surface of the first packaging component may be adhesively coupled to a surface of the second packaging component or a surface of the integrated circuit. The integrated circuit may be at least partially enclosed between the first and second packaging components. A packaging method may include patterning a surface of a packaging component of an integrated circuit package. The surface of the packaging component may be for adhesively coupling to a second component to at least partially enclose an integrated circuit in the integrated circuit package. | 10-02-2014 |
20140291812 | SEMICONDUCTOR PACKAGES HAVING AN ELECTRIC DEVICE WITH A RECESS - Embodiments are directed to a package that includes an electric device having a recess. In one embodiment, the electric device is a sensor and the recess reduces signal drift of the sensor caused by thermal expansion of the package. In another embodiment, the recess is substantially filled with adhesive material, thus increasing adhesion between the electric device and a substrate of the package while at the same time allowing for lower adhesive fillets. | 10-02-2014 |
20150084171 | NO-LEAD SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A non-lead (QFN) semiconductor package is disclosed. The package includes a die attach pad and a semiconductor die supported by the die attached pad. The semiconductor die includes a plurality of pads on an active surface thereof. The package further includes a plurality of terminal leads, an encapsulant that encapsulates the semiconductor die, and a redistribution layer including a plurality of interconnections electrically connecting the pads to the terminal leads. A method of making the package is also disclosed. | 03-26-2015 |
Patent application number | Description | Published |
20080218404 | SYSTEM AND METHOD FOR DETERMINING POSITION OF RADAR APPARATUS BASED ON REFLECTED SIGNALS - A system and method for determining position of, for example, a robot based on reflected signals comprises a transmitter for transmitting signals in a number of directions within a range of directions and a receiver for receiving echoes of the signals from any direction in the range. The transmitter has a first rotatable antenna and the receiver has a second rotatable antenna which is mechanically couplable to the second antenna. The received echoes are processed by a processor to derive echo data signals indicative of the distance of the system to one or more reflective surfaces and the direction of the reflective surface(s) relative to the system. The processor is arranged to determine the position of the system relative to a starting position from the derived echo data signals indicative of the distance of the system to the reflective surface(s) and the direction of the reflective surface(s) relative to the system. | 09-11-2008 |
20080298432 | RANGING SYSTEM AND METHOD - A system for estimating range to an object comprising a system for estimating range to an object comprising a transmitter to transmit at least one UWB signal, a receiver to receive at least one UWB signal, a sampler to sample the received UWB signal depending on a plurality of clock and/or sample pulses having a first frequency, and a circuit and/or processor configured to generate a fractional signal having a second frequency that is lower that the first frequency and a phase that is dependant on the delay between when the UWB signal is actually received and when the received UWB signal is first sampled, and determine the range based on at least a first number of clock or sample pulses between transmitting and receiving the UWB signal and the phase of the fractional signal. Also a method of estimating range to an object. | 12-04-2008 |
20130314181 | COUPLER - An electromagnetic coupler comprising: a transmitter configured to operate at a first central frequency, a first termination configured to connect to the transmitter and having a second resonant frequency, a receiver configured to operate at the first frequency, a second termination configured to connect to the receiver and having a third resonant frequency, wherein when the first and second terminations are bought into close proximity when engaged, the equivalent resonant frequency is substantially the first frequency, and wherein the second and/or third frequencies being substantially spectrally spaced from the first frequency. | 11-28-2013 |
Patent application number | Description | Published |
20130021764 | WAVEGUIDE AND METHOD FOR MAKING A WAVEGUIDE - A waveguide, printed circuit board and a method of fabricating a waveguide that includes: providing a ceramic powder and polymer binder slurry, and forming the waveguide from the slurry. The waveguide and a printed circuit that includes the waveguide are also described. | 01-24-2013 |
20130049883 | WAVEGUIDE NETWORK - Conventional technologies using copper tracks to couple integrated circuits (ICs) disposed on printed circuit boards (PCBs) face limitations in scaling beyond a certain transmission rate, restricting their future applications. Described herein is a waveguide network, in which the network comprises ICs on a PCB coupled via a dielectric waveguide, which advantageously overcomes these limitations. The dielectric waveguide is able to transmit radio frequency (RF) signals and has a bandwidth of at least 100 GHz, among other features. Further, the network can be arranged with different topologies such as ring, star or bus based, and is also couplable to other equivalent networks on the PCB using suitable waveguide-based networking devices. | 02-28-2013 |
20130104387 | ON PCB DIELECTRIC WAVEGUIDE | 05-02-2013 |
20130314180 | CONNECTING MULTIPLE ELECTRONIC DEVICES - A data processing system is proposed which comprises two electronic devices, each of them having an electro-magnetic coupler embedded on the exterior casing, at least one of the electronic device having one or more sliding surfaces for directing relative movement between the two devices, such that they automatically come into correct alignment during the sliding. | 11-28-2013 |