Patent application number | Description | Published |
20090263671 | Ferroelectric Poly (Vinylidene Fluoride) Film on a Substrate and Method for its Formation - Ferroelectric Poly(vinylidene fluoride) Film on a Substrate and Method for its Formation A method of producing a poly(vinylidene fluoride) (“PVDF”) film on a substrate from a precursor solution is disclosed. The method comprises preparing the precursor solution for the PVDF film and dissolving an additive in the precursor solution, the additive being selected from the group consisting of: a hydrate salt, and a hygroscopic chemical. The PVDF is added to the precursor solution. The PVDF solution is coated on a substrate to form an as-deposited PVDF film which is dried and crystallized at an elevated temperature. The dried and crystallized as-deposited PVDF film is annealed at a further elevated temperature. The further elevated temperature is greater than the elevated temperature but less than a melting point of the as-deposited PVDF film. The additive dehydrates at the further elevated temperature. A corresponding product is also disclosed. | 10-22-2009 |
20100019623 | MICRO-ELECTROMECHANICAL DEVICES AND METHODS OF FABRICATING THEREOF - An electromechanical device includes a support structure formed by attaching inner surfaces of second and third substrates to a first substrate. The support structure includes at least one cavity between the second and third layers. An electromechanical active element is provided on an outer surface of at least one of the second or third layers. | 01-28-2010 |
20100221415 | Thin Films of Ferroelectric Materials and a Method for Preparing Same - Thin films of ferroelectric material with a high mole fraction of Pb(A | 09-02-2010 |
20110081733 | Thin film photovoltaic device - The present invention provides a thin film photovoltaic device and a method of forming a thin film photovoltaic device. The thin film photovoltaic device has a substrate, a thin film layer formed on the substrate and first and second electrodes formed on one side of the thin film layer. By applying an electric field over the first and second electrodes, the thin film layer is polarized in a direction parallel to the surface plane of the film. Upon exposure to light, the thin film layer converts light energy into electricity. According to the method, a thin film layer is formed on a substrate. A first electrode and a second electrode are formed on one side of the thin film layer. By applying an electric field over the first and second electrodes, the thin film layer is polarized in a direction parallel to the surface plane of the film. | 04-07-2011 |
20110084669 | POWER SUPPLY DEVICE AND SYSTEM - A power supply device and system have an electrically polarized element in which a remnant electrical polarization is formed and retained. Electrodes are formed on the electrically polarized elements and the remnant electrical polarization generates an electrical potential on the electrodes. Electrical circuits are coupled to the electrically polarized element to control the external electric charges attracted and distributed on the electrodes, for establishing the electrical potential on the electrodes. The electrodes can output electric currents by controlling the external electric charges distribution. The electrically polarized element may be made of ferroelectric material, including a ferroelectric bulk ceramic, ferroelectric multilayer ceramic, ferroelectric single crystal, ferroelectric thin film, ferroelectric thick film and ferroelectric polymer, and all the other materials with electric polarization retained therein. Power supply devices and systems made according to the present invention have very long standby time, small in size and efficient for many applications including RF systems. | 04-14-2011 |
20110296918 | MINIATURIZED PIEZOELECTRIC ACCELEROMETERS - The miniaturized piezoelectric accelerometer includes a support frame ( | 12-08-2011 |
20120137787 | PIEZOELECTRIC SENSOR AND A METHOD OF FABRICATING A PIEZOELECTRIC SENSOR - A piezoelectric sensor comprising a piezoelectric film formed on a surface of an object to be monitored; a plurality of electrodes formed on a surface of the piezoelectric film; and wherein electrical polarization of the piezoelectric film is about coplanar with the surface of the piezoelectric film. A method of forming a piezoelectric sensor. The method comprises forming a piezoelectric film on a surface of an object to be monitored; forming electrodes on a surface of the piezoelectric film; and orientating electrical polarization in the piezoelectric film to be about coplanar with the surface of the piezoelectric film. | 06-07-2012 |
20120313482 | METHOD OF FORMING A VDF OLIGOMER OR CO-OLIGOMER FILM ON A SUBSTRATE AND AN ELECTRICAL DEVICE COMPRISING THE VDF OLIGOMER OR CO-OLIGOMER FILM ON THE SUBSTRATE - A method of forming a vinylidene fluoride (VDF) oligomer or co-oligomer film on a substrate is disclosed. The method comprises forming a VDF oligomer or co-oligomer precursor solution; depositing the VDF oligomer or co-oligomer precursor solution onto the substrate to form a preliminary VDF oligomer or co-oligomer film on the substrate; and applying uniaxial pressure on the preliminary VDF oligomer or co-oligomer film and the substrate at an elevated temperature to form the VDF oligomer or co-oligomer film on the substrate. The substrate may comprise a metal surface which may be used as a bottom electrode and a top electrode may be deposited on the VDF oligomer or co- oligomer film The VDF oligomer or co-oligomer film, the bottom electrode on the substrate and the top electrode on the VDF oligomer or co-oligomer film form an electrical device. | 12-13-2012 |
20130026382 | PHOTOVOLTAIC UV DETECTOR - A photovoltaic UV detector configured to generate an electrical output under UV irradiation. The photovoltaic UV detector comprises a first layer comprising an electrically polarized dielectric thin layer configured to generate a first electrical output under the UV irradiation; and a second, layer configured to form an electrical energy barrier at an interface between the second layer and the first layer so as to generate a second electrical output under the UV irradiation, the second electrical output having a same polarity as the first electrical output, the electrical output of the photovoltaic UV detector being a sum of at least the first electrical output and the second electrical output. The electrically polarized dielectric thin layer may be a ferroelectric thin film, which may comprise PZT or PZLT. The second layer may be a metal and the electrical energy barrier may be a Schottky barrier. | 01-31-2013 |
20130064970 | METHOD FOR PREPARING A LEAD-FREE PIEZOELECTRIC THIN FILM - The present invention discloses a method of preparing a lead-free piezoelectric thin film comprising the steps of: providing a precursor solution comprising at least one alkali metal ion, a polyamine carboxylic acid, and an amine; depositing the precursor solution on a substrate to form a film; and annealing the film. The present invention also provides a lead-free piezoelectric thin film prepared according to the method, a precursor solution for use in the method and a method of preparing the precursor solution. | 03-14-2013 |
20130188282 | PEIZOELECTRIC ACTUATOR, HEAD GIMBAL ASSEMBLY INCLUDING THE SAME AND METHOD OF FORMING THE SAME - According to embodiments of the present invention, a piezoelectric actuator is provided. The piezoelectric actuator includes a shear mode piezoelectric material including a first arm and a second arm intersecting each other, the shear mode piezoelectric material having a polarization direction oriented at least substantially along a length of the first arm, wherein the shear mode piezoelectric material has a first surface and a second surface opposite to the first surface, the first surface and the second surface being adapted to undergo a shear displacement relative to each other along an axis at least substantially parallel to the polarization direction in response to an electric field applied between the first surface and the second surface in a direction at least substantially perpendicular to the polarization direction. | 07-25-2013 |
20140034815 | SELF-POWERED PHOTODETECTOR AND METHOD OF FABRICATION THEREOF - A self-powered photodetector is provided including: a photovoltaic sensor element for generating an electrical charge under exposure to electromagnetic radiation; a charge storage section for accumulating the electrical charge generated by the photovoltaic sensor element; an electrical load configured to be powered by the accumulated electrical charge from the charge storage section and outputs a signal in response thereto, the signal being analyzable to determine a measurement of the electromagnetic radiation; and a switch for controlling a flow of the accumulated electrical charge from the charge storage section to the electrical load for powering the electrical load. There is also provided a wireless receiver for analyzing a signal from the self-powered photodetector to provide a measurement of the electromagnetic radiation, a photodetector system including the self-powered photodetector and the wireless receiver, and a method of fabricating the self-powered photodetector. | 02-06-2014 |
20140319317 | PHOTO-SENSOR - According to one aspect of the invention, there is provided a photo-sensor comprising: an optically transparent substrate; an electrode pair; and a photoactive film with electrical polarization located between the optically transparent substrate and the electrode pair, wherein the optically transparent substrate is configured to transmit incident radiation received by the optically transparent substrate to the photoactive film and wherein the electrode pair is configured to receive charge carriers generated by the photoactive film in response to the transmitted incident radiation. | 10-30-2014 |
20150132475 | METHOD FOR PREPARING A LEAD-FREE PIEZOELECTRIC THIN FILM - The present invention discloses a method of preparing a lead-free piezoelectric thin film comprising the steps of: providing a precursor solution comprising at least one alkali metal ion, a polyamino carboxylic acid, and an amine; depositing the precursor solution on a substrate to form a film; and annealing the film. The present invention also provides a lead-free piezoelectric thin film prepared according to the method, a precursor solution for use in the method and a method of preparing the precursor solution. | 05-14-2015 |
20150376068 | ELECTRO-OPTIC CERAMIC MATERIALS - The present invention provides a product and manufacturing method for electro-optic ceramic material having the composition (A′(1-y)A″y) | 12-31-2015 |
Patent application number | Description | Published |
20110057102 | Multiple Transfer Molded Optical Proximity Sensor and Corresponding Method - Various embodiments of a multiple-stage-molded optical proximity sensor and method of making same are disclosed. According to one embodiment, the method comprises mounting an infrared light emitter atop a first portion of a substrate, and mounting an infrared light detector, an ambient light detector and an integrated circuit atop a second portion of the substrate. In a first molding step, an infrared light pass component is molded over the substrate and the infrared light emitter, the infrared light detector, the ambient light detector, and the integrated circuit. The infrared light pass component is then cured, followed by forming a slot in the cured infrared light pass component between the first and second portions of the substrate. In a second molding step, an infrared light cut component is molded over the slot, the integrated circuit, the ambient light detector, and over portions of the infrared light emitter and the infrared light detector. | 03-10-2011 |
20110057104 | Miniaturized Optical Proximity Sensor - Various embodiments of a miniaturized optical proximity sensor are disclosed. In one embodiment, an ambient light sensor and a light detector are mounted on first and second spacers, which in turn are mounted to a top surface of an integrated circuit die-attached to a substrate. An optically-transmissive infrared pass compound is molded over the ambient light sensor, the light detector, the integrated circuit, alight emitter and peripheral portions of the substrate. Next, an optically non-transmissive infrared cut compound is molded to over the optically-transmissive infrared pass compound to provide a miniaturized optical proximity sensor having no metal shield but exhibiting very low crosstalk characteristics. | 03-10-2011 |
20110057108 | Compact Optical Proximity Sensor with Ball Grid Array and Windowed Substrate - Various embodiments of a compact optical proximity sensor with a ball grid array and windowed or apertured substrate are disclosed. In one embodiment, the optical proximity sensor comprises a printed circuit board (“PCB”) substrate comprising an aperture and a lower surface having electrical contacts disposed thereon, an infrared light emitter and an infrared light detector mounted on an upper surface of the substrate, an integrated circuit located at least partially within the aperture, a molding compound being disposed between portions of the integrated circuit and substrate, an ambient light detector mounted on an upper surface of the integrated circuit, first and second molded infrared light pass components disposed over and covering the infrared light emitter and the infrared light detector, respectively, and a molded infrared light cut component disposed between and over portions of the first and second infrared light pass components. | 03-10-2011 |
20110057129 | Package-on-Package (POP) Optical Proximity Sensor - Various embodiments of a package-on-package optical sensor comprising three distinct different packages are disclosed. The three different packages are combined to form the optical proximity sensor, where the first package is a light emitter package, the second package is a light detector package, and the third package is an integrated circuit package. First and second infrared light pass components are molded or casted atop the light emitter package and the light detector package after they have been mounted atop the integrated circuit package. An infrared light cut component is then molded or casted between and over portions of the light emitter package and the light detector package. | 03-10-2011 |
20110133941 | Optical Proximity Sensor with Improved Shield and Lenses - Various embodiments of an optical sensor comprising a novel shield that may be quickly and accurately aligned and positioned with respect to an underlying light emitting and light detecting assembly are disclosed. Also disclosed are novel lens arrangements for efficiently collimating light emitted and received by the optical proximity sensor, and for reducing crosstalk. | 06-09-2011 |
20110186736 | Optical Proximity Sensor Package with Lead Frame - Various embodiments of an optical proximity sensor having a lead frame and no overlying metal shield are disclosed. In one embodiment, a light emitter and a light detector are mounted on a lead frame comprising a plurality of discrete electrically conductive elements having upper and lower surfaces, at least some of the elements not being electrically connected to one another. An integrated circuit is die-attached to an underside of the lead frame. An optically-transmissive infrared pass compound is molded over the light detector and the light emitter and portions of the lead frame. Next, an optically non-transmissive infrared cut compound is molded over the optically-transmissive infrared pass compound to provide an optical proximity sensor having no metal shield but exhibiting very low crosstalk characteristics. | 08-04-2011 |
20110297831 | Small Low-Profile Optical Proximity Sensor - In an embodiment, the invention provides a proximity sensor including a transmitter die, a receiver die, an ASIC die, a lead frame, wire bonds, a first transparent encapsulant, a second transparent encapsulant, and an opaque encapsulant. The transmitter die, the receiver die and the ASIC die are attached to portions of the lead frame. Wire bonds electrically connect the transmitter die, the receiver die, the ASIC die, and the lead frame. The first transparent encapsulant covers the receiver die, the ASIC die, the wire bonds, and a portion of the lead frame. The second transparent encapsulant covers the transmitter die, the wire bonds, and a portion of the lead frame. The opaque encapsulant covers portions of the first and second encapsulants and a portion of the lead frame. | 12-08-2011 |
20110297832 | Proximity Sensor - A proximity sensor includes a printed circuit board (PCB); a first cup and a second cup embedded in the PCB; an electromagnetic radiation transmitter operably mounted in the first cup; and an electromagnetic radiation receiver operably mounted in the second cup. | 12-08-2011 |
20120037793 | LENS HAVING MULTIPLE CONIC SECTIONS FOR LEDS AND PROXIMITY SENSORS - A lens element comprising a base, a plurality of lens sections and a top lens section is disclosed. The plurality of lens sections are formed above a planar parallel to the base with each of the lens sections being positioned rotationally symmetric about an optical axis. The lens sections define a dome shape with every adjoining lens sections being conjugated with each other. A top lens section is formed at the center above the other lens sections and conjugated therewith. All of the lens sections are conjugated with each of its neighboring lens sections. Each of the lens sections has a optical property to direct light towards a target point. The target point may be positioned along the optical axis. | 02-16-2012 |
20120086018 | PACKAGE-ON-PACKAGE PROXIMITY SENSOR MODULE - A package-on-package proximity sensor module including a infrared transmitter package and a infrared receiver package is presented. The proximity sensor module may include a fully-assembled infrared transmitter package and a fully-assembled infrared receiver package disposed on a quad flat pack no-lead (QFN) lead frame molded with an IR cut compound housing. A bottom surface of the QFN lead frame may be etched and covered with the IR cut compound to provide a locking feature between the QFN lead frame and the IR cut compound housing. | 04-12-2012 |
20120092254 | PROXIMITY SENSOR WITH MOTION DETECTION - A proximity sensor with movement detection is provided. The proximity sensor may provide a navigation function in response to movement of an object. The proximity sensor includes a driver operable to generate a current to a plurality of light sources in a particular timing sequence, a photo detector configured to receive light and generate an output signal, a controller configured to report the movement of an object near the proximity sensor if the output signal pattern generated matches one of the output signal patterns from among a set of known output signal patterns. The proximity sensor may be configured to provide a navigation operation when an object moves near the proximity sensor. | 04-19-2012 |
20120145932 | PROXIMITY SENSOR DEVICE AND METHOD - A proximity sensor device is provided in compact unit that has the ability to sense or monitor in different directions, such as sensing or monitoring in both the vertical and horizontal directions. Methods are also provided. In an illustrative embodiment, the proximity sensor device includes a first transmitting/receiving pair and a second transmitting/receiving pair on a printed circuit board along with an IC to control the transmitters and receivers, as well as, in some embodiments, to provide signal filtering, amplification or other desired features. | 06-14-2012 |
20120327491 | HOLOGRAPHIC DISPLAY SYSTEM WITH MOTION SENSORS - A holographic display system with motion sensors is disclosed. In one embodiment, the holographic display system is a flat screen display having display screen and a holographic overlay positioned over the display screen. A plurality of sensors are embedded in the holographic overlay. Alternatively, the plurality of sensors may be attached to a substrate, which is positioned behind the display screen. In another embodiment, the holographic display system is a projection type display in which image beams are projected from an image projector onto a holographic screen. A plurality of sensors are located on the holographic screen. In yet another embodiment, a method for sensing a user's movement using a holographic display system with motion sensors is shown. | 12-27-2012 |
20130010310 | PROXIMITY SENSOR WITH MOTION DETECTION - A proximity sensor with movement detection is provided. The proximity sensor may include an ASIC chip; at least three light sources configured to emit light in a particular sequence; and a photo detector configured to receive light and generate an output signal. The proximity sensor may have a compact size package, wherein the photo detector may be stacked on the ASIC chip and disposed at a substantially equal distance from the at least three light sources. The proximity sensor includes a driver operable to generate a current to a plurality of light sources in a particular timing sequence, a photo detector configured to receive light and generate an output signal, an ASIC configured to report the movement of an object near the proximity sensor if the output signal pattern generated matches one of the output signal patterns from among a set of known output signal patterns. The proximity sensor may be configured to be used as a counter or an on/off switch based on particular movements detected. | 01-10-2013 |
20130026350 | MULTI-DIRECTIONAL PROXIMITY SENSOR - A proximity sensor with multi-directional movement detection is provided. The proximity sensor may include an ASIC chip; at least three light sources configured to emit light in a particular sequence; and a photo detector configured to receive light and generate an output signal. The multi-directional proximity sensor may have a first proximity sensor with at least one side surface and a second proximity sensor connected to the first proximity sensor configured to detect object movement over a plane substantially parallel to the at least one side surface of the first proximity sensor. The multi-directional movement detection proximity sensor may include a PCB, in which more than one proximity sensor may be disposed on the PCB and operatively integrated to detect multi-directional movement. | 01-31-2013 |
Patent application number | Description | Published |
20110024627 | Proximity Sensor with Ceramic Housing and Light Barrier - An optical proximity sensor is provided that comprises an infrared light emitter, an infrared light detector, a ceramic housing, a substrate, and a cover or shield. The ceramic housing is mounted on or attached to the substrate, and comprises first and second recesses separated by a light barrier. The cover is mounted over the ceramic housing, the light emitter and the light detector. The infrared light emitter is located within the first recess and mounted on the substrate. The infrared light detector is located within the second recess and mounted on the substrate. The light barrier between the first and second recesses, in conjunction with the remainder of the ceramic housing, the substrate, and the cover or shield substantially attenuates or blocks the transmission of undesired direct, scattered or reflected infrared light between the light emitter and the light detector, and thereby minimizes optical crosstalk and interference between the light emitter and the light detector. | 02-03-2011 |
20110316776 | INPUT DEVICE WITH PHOTODETECTOR PAIRS - Input devices configured to provide user interface by detecting three dimensional movement of an external object are disclosed. The input device comprises at least two photodetector pairs, a radiation source and a circuit configurable to detect differential and common mode signals generated in the photodetector pairs. By detecting the common mode and differential signals, movement of an external object may be determined and used to control a pointer, or a cursor. | 12-29-2011 |
20120293472 | Ambient Light Sensor Configured to Determine the Direction of a Beam of Ambient Light Incident Thereon - Various embodiments of an ambient light sensor configured to determine the direction of a beam of light incident thereon are disclosed. In one embodiment, an ambient light sensor is provided that comprises a plurality of light detectors arranged in a spatial array upon a light sensing surface. Each of the light detectors in the array is configured to generate an analog output voltage in response to the beam of ambient light falling thereon. The amount of light incident on the individual light detectors in the spatial array varies according to the position of each such sensor with respect to direction of the beam of ambient light. An analog-to-digital converter (ADC) is operably coupled to the plurality of light detectors and is configured to receive the analog output signals generated thereby as inputs thereto, and to provide digital output values representative of the analog signals. Control logic circuitry is operably coupled to the ADC and configured to receive the digital output values therefrom, and is further configured to process such digital output values to determine the direction of the beam of light incident upon the spatial array. | 11-22-2012 |