Patent application number | Description | Published |
20080219816 | SMALL LOT LOADPORT CONFIGURATIONS - A substrate handling apparatus and method include a small lot loadport configuration having a plurality of small lot loadports adapted to be coupled to an equipment front end module (EFEM) designed for use with a large lot substrate carrier and having a large lot loadport envelope, where the small lot loadport configuration has a combined envelope substantially similar to the large lot loadport envelope, and where each small lot loadport is adapted to dock with a small lot substrate carrier. A system also is provided that includes (1) the (EFEM) and (2) the small lot loadport configuration. Numerous other aspects are provided. | 09-11-2008 |
20080283387 | METHODS AND APPARATUS FOR TRANSFERRING CONDUCTIVE PIECES DURING SEMICONDUCTOR DEVICE FABRICATION - In a first aspect, a programmable transfer device is provided for transferring conductive pieces to electrode pads of a target substrate. The programmable transfer device includes (1) a transfer substrate; and (2) a plurality of individually addressable electrodes formed on the transfer substrate. Each electrode is adapted to selectively attract and hold a conductive piece during transfer of the conductive piece to an electrode pad of a target substrate. Numerous other aspects are provided. | 11-20-2008 |
20090024241 | DUAL-MODE ROBOT SYSTEMS AND METHODS FOR ELECTRONIC DEVICE MANUFACTURING - Electronic device manufacturing systems and methods are provided. In some aspects, a system having a dual-mode robot is provided which is disposed within a system component (e.g., a factory interface or transfer chamber) and adapted to operate in a first mode and a second mode. In the first mode, the robot may transfer a substrate between components of the system (e.g., between a carrier and a process chamber or chamber to chamber) and in the second mode, the robot may execute a process motion profile (e.g., metrology). | 01-22-2009 |
20090030547 | CALIBRATION OF HIGH SPEED LOADER TO SUBSTRATE TRANSPORT SYSTEM - In one aspect, a system is disclosed having a substrate carrier loader adapted to load substrate carriers onto a moving conveyor; and a controller coupled to the substrate carrier loader, the controller adapted to assist in at least one of alignment of the substrate carrier loader to the moving conveyor and calibration of the substrate carrier loader to the moving conveyor or a storage location. Numerous other aspects are provided. | 01-29-2009 |
20090108544 | METHODS AND APPARATUS FOR SEALING A SLIT VALVE DOOR - Apparatus, methods and systems are provided for sealing a door of a slit valve. The invention includes a seal, adapted to extend along a perimeter of a slit valve door; and a hard stop, disposed between the seal and an outer edge of the slit valve door, and adapted to extend along at least a portion of the length of the seal, wherein the hard stop and the seal fill at least a portion of a gap between the slit valve door and a substrate sealing surface. Numerous other aspects are provided. | 04-30-2009 |
20090130821 | THREE DIMENSIONAL PACKAGING WITH WAFER-LEVEL BONDING AND CHIP-LEVEL REPAIR - A method, a system and a computer readable medium for three dimensional packaging with wafer-level bonding and chip-level repair. A first wafer is provided having a first plurality of chips. A second wafer is provided having a second plurality of chips. At least one chip is removed from the second wafer while retaining the relative alignment of the remaining chips in the second wafer. The first and second wafers are aligned and joined with wafer-to-wafer techniques. Where a bad chip having a relative physical position within the second wafer corresponding to a relative physical position within the first wafer of a good chip is removed, a good chip may be aligned and bonded to the first wafer using die-to-wafer techniques. | 05-21-2009 |
20090205930 | BREAK-AWAY POSITIONING CONVEYOR MOUNT FOR ACCOMMODATING CONVEYOR BELT BENDS - A break-away mounting system for a continuous-motion, high-speed position conveyor system is disclosed. A support cradle may be suspended from a conveyor belt such that the support cradle maintains a fixed position and orientation relative to at least one point on the conveyor belt without inducing appreciable stress on the conveyor belt, the support cradle, or the coupling between the conveyor belt and the support cradle. The mount may include a leading rotatable bearing attached to the support cradle which may releasably engage a first key attached to the conveyor belt, the rotatable bearing adapted to accommodate rotational forces applied to the support cradle by the conveyor belt. The mount may also include a slide bearing attached to the support cradle which may releasably engage a second key attached to the conveyor belt, the slide bearing adapted to accommodate longitudinal forces applied to the support cradle by the conveyor belt. | 08-20-2009 |
20090263215 | END EFFECTOR FOR A CLUSTER TOOL - Embodiments of the present invention generally provide an apparatus and method for transferring substrates in a processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, improved device yield performance, a more repeatable wafer processing history (or wafer history), and a reduced footprint when compared to conventional techniques. | 10-22-2009 |
20090308030 | LOAD PORT CONFIGURATIONS FOR SMALL LOT SIZE SUBSTRATE CARRIERS - In a first aspect, a method of opening a substrate carrier is provided. The method includes moving the substrate carrier such that a door of the substrate carrier contacts a supporting member; employing the supporting member to support the door; moving a housing of the substrate carrier away from the supporting member; and pivoting the supporting member and door below a bottom surface of the substrate carrier. Numerous other aspects are provided. | 12-17-2009 |
20110041764 | BATCH PROCESSING PLATFORM FOR ALD AND CVD - A batch processing platform used for ALD or CVD processing is configured for high throughput and minimal footprint. In one embodiment, the processing platform comprises an atmospheric transfer region, at least one batch processing chamber with a buffer chamber and staging platform, and a transfer robot disposed in the transfer region wherein the transfer robot has at least one substrate transfer arm that comprises multiple substrate handling blades. The platform may include two batch processing chambers configured with a service aisle disposed therebetween to provide necessary service access to the transfer robot and the deposition stations. In another embodiment, the processing platform comprises at least one batch processing chamber, a substrate transfer robot that is adapted to transfer substrates between a FOUP and a processing cassette, and a cassette transfer region containing a cassette handler robot. The cassette handler robot may be a linear actuator or a rotary table. | 02-24-2011 |
20110270574 | METHODS FOR MONITORING PROCESSING EQUIPMENT - Methods for monitoring processing equipment are provided herein. In some embodiments, a method for monitoring processing equipment when in an idle state for a period of idle time may include selecting a test from a list of a plurality of tests to perform on the processing equipment when the processing equipment is in the idle state, wherein the test has a total run time; starting the selected test; comparing a remaining idle time of the period of idle time to a remaining run time of the total run time as the selected test is performed; and determining whether to end the selected test prior to completing the total run time in response to the comparison. | 11-03-2011 |
20130018500 | METHODS AND APPARATUS FOR PROCESSING SUBSTRATES USING MODEL-BASED CONTROLAANM PORTHOUSE; KEITH BRIANAACI SunnyvaleAAST CAAACO USAAGP PORTHOUSE; KEITH BRIAN Sunnyvale CA USAANM LANE; JOHN W.AACI San JoseAAST CAAACO USAAGP LANE; JOHN W. San Jose CA USAANM GREGOR; MARIUSCHAACI GilroyAAST CAAACO USAAGP GREGOR; MARIUSCH Gilroy CA USAANM MERRY; NIRAACI Mountain ViewAAST CAAACO USAAGP MERRY; NIR Mountain View CA USAANM RICE; MICHAEL R.AACI PleasantonAAST CAAACO USAAGP RICE; MICHAEL R. Pleasanton CA USAANM MINKOVICH; ALEXAACI CampbellAAST CAAACO USAAGP MINKOVICH; ALEX Campbell CA USAANM LI; HONGBINAACI Mountain ViewAAST CAAACO USAAGP LI; HONGBIN Mountain View CA USAANM DZILNO; DMITRY A.AACI SunnyvaleAAST CAAACO USAAGP DZILNO; DMITRY A. Sunnyvale CA US - Methods and apparatus are disclosed herein. In some embodiments, methods of controlling process chambers may include predetermining a relationship between pressure in a processing volume and a position of an exhaust valve as a function of a process parameter; setting the process chamber to a first state having a first pressure in the processing volume and a first value of the process parameter, wherein the exhaust valve is set to a first position based on the predetermined relationship to produce the first pressure at the first value; determining a pressure control profile to control the pressure as the process chamber is changed to a second state having a second pressure and a second process parameter value from the first state; and applying the pressure control profile to control the pressure by varying the position of the exhaust valve while changing the process chamber to the second state. | 01-17-2013 |
20130045570 | METHOD AND SYSTEM FOR WAFER LEVEL SINGULATION - A method of singulating a plurality of semiconductor dies includes providing a carrier substrate and joining a semiconductor substrate to the carrier substrate. The semiconductor substrate includes a plurality of devices. The method also includes forming a mask layer on the semiconductor substrate, exposing a predetermined portion of the mask layer to light, and processing the predetermined portion of the mask layer to form a predetermined mask pattern on the semiconductor substrate. The method further includes forming the plurality of semiconductor dies, each of the plurality of semiconductor dies being associated with the predetermined mask pattern and including one or more of the plurality of devices and separating the plurality of semiconductor dies from the carrier substrate. | 02-21-2013 |
20140060433 | GAS EXHAUST FOR HIGH VOLUME, LOW COST SYSTEM FOR EPITAXIAL SILICON DEPOSITION - Apparatus for the removal of exhaust gases are provided herein. In some embodiments, an apparatus may include a carrier for supporting one or more substrates in a substrate processing tool, the carrier having a first exhaust outlet, and an exhaust assembly including a first inlet disposed proximate the carrier to receive process exhaust from the first exhaust outlet of the carrier, a second inlet to receive a cleaning gas, and an outlet to remove the process exhaust and the cleaning gas. | 03-06-2014 |
20140060434 | GAS INJECTOR FOR HIGH VOLUME, LOW COST SYSTEM FOR EPITAXIAL SILICON DEPOSITON - Apparatus for use in a substrate processing chamber are provided herein. In some embodiments, a gas injector for use in a process chamber may include first set of gas orifices configured to provide a jet flow of a first process gas into the process chamber, and a second set of gas orifices configured to provide a laminar flow of a second process gas into the process chamber, wherein the first set of gas orifices are disposed between at least two gas orifices of the second set of gas orifices. | 03-06-2014 |
20140060435 | DOORS FOR HIGH VOLUME, LOW COST SYSTEM FOR EPITAXIAL SILICON DEPOSITION - Apparatus for use in an inline substrate processing tool are provided herein. In some embodiments, a door for use in an inline substrate processing tool between a first and a second substrate processing module coupled to one another in a linear arrangement may include a reflective body disposed between two cover plates of substantially transparent material, configured to reflect light and heat energy into each of the at first and second substrate processing modules, wherein the door is selectively movable, via an actuator coupled to the door, between an open position that fluidly couples the first and second substrate processing modules to a closed position that isolates the first substrate processing module from the second substrate processing module. | 03-06-2014 |
20140196850 | METHOD AND SYSTEM FOR WAFER LEVEL SINGULATION - A method of singulating a plurality of semiconductor dies includes providing a carrier substrate and joining a semiconductor substrate to the carrier substrate. The semiconductor substrate includes a plurality of devices. The method also includes forming a mask layer on the semiconductor substrate, exposing a predetermined portion of the mask layer to light, and processing the predetermined portion of the mask layer to form a predetermined mask pattern on the semiconductor substrate. The method further includes forming the plurality of semiconductor dies, each of the plurality of semiconductor dies being associated with the predetermined mask pattern and including one or more of the plurality of devices and separating the plurality of semiconductor dies from the carrier substrate. | 07-17-2014 |
20140197151 | SUBSTRATE SUPPORT WITH SWITCHABLE MULTIZONE HEATER - Embodiments of substrate supports with a heater are provided herein. In some embodiments, a substrate support may include a first member to distribute heat to a substrate when present above a first planar surface of the first member, a second member disposed beneath the first member, the second member including a plurality of resistive heating elements, wherein the plurality of resistive heating elements provide local temperature compensation to the first member to heat the substrate when present, a third member disposed beneath the second member, the third member including one or more base heating zones to provide a base temperature profile to the first member, and a fourth member disposed beneath the third member, the fourth member including a first set of electrical conductors coupled to each of the resistive heating elements. | 07-17-2014 |
20140251375 | METHODS AND APPARATUS FOR SUBSTRATE EDGE CLEANING - A substrate cleaning apparatus may include a substrate support having a support surface to support a substrate to be cleaned, wherein the substrate support is rotatable about a central axis normal to the support surface; a first nozzle to provide a first cleaning gas to a region of the inner volume corresponding to the position of an edge of the substrate when the substrate is supported by the support surface of the substrate support; a first annular body disposed opposite and spaced apart from the support surface of the substrate support by a gap, the first annular body having a central opening defined by an inner wall shaped to provide a reducing size of the gap between the first annular body and the support surface in a radially outward direction; and a first gas inlet to provide a first gas to the central opening of the first annular body. | 09-11-2014 |
20150013771 | SUBSTRATE PROCESSING SYSTEM, VALVE ASSEMBLY, AND PROCESSING METHOD - In one aspect, a valve assembly adapted to seal an opening in a chamber is disclosed. Valve assembly includes a housing being adapted for coupling to a chamber surface having the opening therein, the housing including a threshold portion positioned adjacent to the chamber opening, the threshold portion having one or more inlets adapted to supply gas to an interior region of the housing adjacent to the chamber opening; and a sealing surface adapted to selectively (1) seal the opening, and (2) retract from the opening so as not to obstruct substrate passage. Numerous other system aspects are provided, as are methods and computer program products in accordance with these and other aspects. | 01-15-2015 |
20150075659 | SLIT VALVE WITH A PRESSURIZED GAS BEARING - According to an embodiment of the invention, there is provided a slit valve, comprising: a first slit valve portion having a first window therethrough, the first window is sized to permit passage of an object through the first window; wherein the first window is surrounded by a first area of the first slit valve portion; a second slit valve portion that comprises a first sealing element and a first positioning module; wherein the first positioning module is arranged to move the first sealing element in relation to the first window; wherein at least one slit valve portion of the first and second slit valve portions comprises at least one first gas opening for emitting pressurized gas so as to assist in a creation of a first gas cushion between the first area and the first sealing element when the first sealing element is placed adjacent to the first window thus creating a seal between the first and second slit valve portions. | 03-19-2015 |