Patent application number | Description | Published |
20080219816 | SMALL LOT LOADPORT CONFIGURATIONS - A substrate handling apparatus and method include a small lot loadport configuration having a plurality of small lot loadports adapted to be coupled to an equipment front end module (EFEM) designed for use with a large lot substrate carrier and having a large lot loadport envelope, where the small lot loadport configuration has a combined envelope substantially similar to the large lot loadport envelope, and where each small lot loadport is adapted to dock with a small lot substrate carrier. A system also is provided that includes (1) the (EFEM) and (2) the small lot loadport configuration. Numerous other aspects are provided. | 09-11-2008 |
20080289932 | SYSTEM FOR TRANSPORTING SUBSTRATE CARRIERS - In a semiconductor fabrication facility, a conveyor transports substrate carriers. The substrate carriers are unloaded from the conveyor and loaded onto the conveyor without stopping the conveyor. A load and/or unload mechanism lifts the substrate carriers from the conveyor during unloading operations, while matching the horizontal speed of the conveyor. Similarly, during loading operations, the load/unload mechanism lowers a substrate carrier into engagement with the conveyor while matching the horizontal speed of the conveyor. Individual substrates, without carriers, may be similarly loaded and/or unloaded from a conveyor. | 11-27-2008 |
20080298945 | METHODS AND APPARATUS FOR EXTENDING THE REACH OF A DUAL SCARA ROBOT LINKAGE - Methods and apparatus are provided for the use of a dual Selective Compliant Assembly Robot Arm (SCARA) robot. In some embodiments two SCARAs are provided, each including an elbow joint, wherein the two SCARAs are vertically stacked such that one SCARA is a first arm and the other SCARA is a second arm, and wherein the second arm is adapted to support a first substrate, and the first arm is adapted to extend to a full length when the second arm supports the first substrate, and wherein the first substrate supported by the second arm is coplanar with the elbow joint of the first arm, and the second arm is further adapted to move concurrently in parallel (and/or in a coordinated fashion) with the first arm a sufficient amount to avoid interference between the first substrate and the elbow joint of the first arm. Numerous other embodiments are provided. | 12-04-2008 |
20090024241 | DUAL-MODE ROBOT SYSTEMS AND METHODS FOR ELECTRONIC DEVICE MANUFACTURING - Electronic device manufacturing systems and methods are provided. In some aspects, a system having a dual-mode robot is provided which is disposed within a system component (e.g., a factory interface or transfer chamber) and adapted to operate in a first mode and a second mode. In the first mode, the robot may transfer a substrate between components of the system (e.g., between a carrier and a process chamber or chamber to chamber) and in the second mode, the robot may execute a process motion profile (e.g., metrology). | 01-22-2009 |
20090030547 | CALIBRATION OF HIGH SPEED LOADER TO SUBSTRATE TRANSPORT SYSTEM - In one aspect, a system is disclosed having a substrate carrier loader adapted to load substrate carriers onto a moving conveyor; and a controller coupled to the substrate carrier loader, the controller adapted to assist in at least one of alignment of the substrate carrier loader to the moving conveyor and calibration of the substrate carrier loader to the moving conveyor or a storage location. Numerous other aspects are provided. | 01-29-2009 |
20090101483 | METHODS AND APPARATUS FOR TRANSPORTING SUBSTRATE CARRIERS - A conveyor apparatus adapted to transport and article is provided. The conveyor apparatus has a belt section including a plurality of slots and a plurality of T-shaped stiffeners extending in the slots. Respective belt sections may be spliced together using a plurality of T-shaped stiffeners extending through slots in diagonally-formed ends of each belt section. Methods of the invention are described as are numerous other aspects. | 04-23-2009 |
20090110518 | SEALED SUBSTRATE CARRIERS AND SYSTEMS AND METHODS FOR TRANSPORTING - An electronic device manufacturing system is disclosed. The system includes a processing tool having one or more processing chambers each adapted to perform an electronic device manufacturing process on one or more substrates; a substrate carrier adapted to couple to the system and carry one or more substrates; and a component adapted to create a sealed environment relative to at least a portion of the substrate carrier and to substantially equalize the sealed environment with an environment within the substrate carrier. Methods of the invention are described as are numerous other aspects. | 04-30-2009 |
20090126851 | DIE-TO-ROBOT ALIGNMENT FOR DIE-TO-SUBSTRATE BONDING - A method, a system and a computer readable medium having a set of instructions stored thereon for die-to-robot alignment for die-to-substrate bonding are described. First, a robot is aligned with a substrate to provide a pre-aligned robot. Next, a die is aligned with the pre-aligned robot to provide a robot-aligned die. Finally, the robot-aligned die is bonded to a region of the substrate. The substrate is held stationary immediately following the aligning of the robot with the substrate and at least until the robot-aligned die is bonded to the region of the substrate. | 05-21-2009 |
20090130821 | THREE DIMENSIONAL PACKAGING WITH WAFER-LEVEL BONDING AND CHIP-LEVEL REPAIR - A method, a system and a computer readable medium for three dimensional packaging with wafer-level bonding and chip-level repair. A first wafer is provided having a first plurality of chips. A second wafer is provided having a second plurality of chips. At least one chip is removed from the second wafer while retaining the relative alignment of the remaining chips in the second wafer. The first and second wafers are aligned and joined with wafer-to-wafer techniques. Where a bad chip having a relative physical position within the second wafer corresponding to a relative physical position within the first wafer of a good chip is removed, a good chip may be aligned and bonded to the first wafer using die-to-wafer techniques. | 05-21-2009 |
20090188103 | METHODS AND APPARATUS FOR MOVING A SUBSTRATE CARRIER - Systems, methods, and apparatus are provided for electronic device manufacturing. The invention includes removing a first substrate carrier and a second substrate carrier from a moving conveyor using an end effector assembly and concurrently transferring the first and second substrate carriers from the moving conveyor to a support location via the end effector assembly. Numerous other aspects are provided. | 07-30-2009 |
20090205930 | BREAK-AWAY POSITIONING CONVEYOR MOUNT FOR ACCOMMODATING CONVEYOR BELT BENDS - A break-away mounting system for a continuous-motion, high-speed position conveyor system is disclosed. A support cradle may be suspended from a conveyor belt such that the support cradle maintains a fixed position and orientation relative to at least one point on the conveyor belt without inducing appreciable stress on the conveyor belt, the support cradle, or the coupling between the conveyor belt and the support cradle. The mount may include a leading rotatable bearing attached to the support cradle which may releasably engage a first key attached to the conveyor belt, the rotatable bearing adapted to accommodate rotational forces applied to the support cradle by the conveyor belt. The mount may also include a slide bearing attached to the support cradle which may releasably engage a second key attached to the conveyor belt, the slide bearing adapted to accommodate longitudinal forces applied to the support cradle by the conveyor belt. | 08-20-2009 |
20090263215 | END EFFECTOR FOR A CLUSTER TOOL - Embodiments of the present invention generally provide an apparatus and method for transferring substrates in a processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, improved device yield performance, a more repeatable wafer processing history (or wafer history), and a reduced footprint when compared to conventional techniques. | 10-22-2009 |
20090308030 | LOAD PORT CONFIGURATIONS FOR SMALL LOT SIZE SUBSTRATE CARRIERS - In a first aspect, a method of opening a substrate carrier is provided. The method includes moving the substrate carrier such that a door of the substrate carrier contacts a supporting member; employing the supporting member to support the door; moving a housing of the substrate carrier away from the supporting member; and pivoting the supporting member and door below a bottom surface of the substrate carrier. Numerous other aspects are provided. | 12-17-2009 |
20100178139 | ELECTROSTATIC END EFFECTOR APPARATUS, SYSTEMS AND METHODS - Systems, apparatus and methods for transporting substrates between system components of an electronic device manufacturing system are provided. The systems and apparatus include an electrostatic end effector having a base, an electrode pair on the base, and spacer members for spacing the substrate from the electrode pairs to provide a gap between the electrode pair and the substrate. Methods of the invention as well as numerous other aspects are provided. | 07-15-2010 |
20100178146 | SYSTEMS, APPARATUS AND METHODS FOR TRANSPORTING SUBSTRATES - A substrate transporting robot apparatus is disclosed which is adapted to transport a substrate to and from a chamber of an electronic device processing system. The apparatus may include an upper arm rotatable in an X-Y plane, a forearm rotatable relative to the upper arm in the X-Y plane, and a wrist member rotatable relative to the forearm in the X-Y plane, the wrist member including an end effector adapted to carry a substrate. The wrist member may be subjected to independent rotation such that various degrees of yaw may be imparted to the wrist member. In some aspects, the independent rotation is provided without a motive power device (e.g., motor) being provided on the arms or wrist member, i.e., the wrist member may be remotely driven. Systems and methods using the robot apparatus are also provided as are numerous other aspects. | 07-15-2010 |
20100178147 | ROBOT SYSTEMS, APPARATUS AND METHODS FOR TRANSPORTING SUBSTRATES - Substrate transport systems, apparatus and methods are described. The systems are adapted to efficiently put or pick substrates at a destination by rotating a boom linkage to a position adjacent to the destination and then actuating a robot assembly to put or pick the substrate at the destination. Numerous other aspects are provided. | 07-15-2010 |
20120060971 | METHODS AND LOADPORT APPARATUS FOR PURGING A SUBSTRATE CARRIER - In a first aspect, a loadport is provided. The loadport has a plate adapted to couple to a door of a substrate carrier to open the substrate carrier wherein the plate includes a first opening adapted to couple to a first port in the door of the substrate carrier on a first side of the plate and to couple to a gas source on a second side of the plate, and wherein the loadport is adapted to allow a flow of gas into the substrate carrier via the first opening in the plate. Methods of purging substrate carriers are provided, as are numerous other aspects. | 03-15-2012 |
20120325328 | METHODS AND LOADPORT FOR PURGING A SUBSTRATE CARRIER - In a first aspect, a substrate carrier is provided that includes an enclosure adapted to be sealable and to house at least one substrate. The substrate carrier includes a first port leading into the enclosure and adapted to allow a flow of gas into the enclosure while the substrate carrier is closed. Numerous other aspects are provided. | 12-27-2012 |
20130039726 | ROBOT SYSTEMS, APPARATUS, AND METHODS ADAPTED TO TRANSPORT SUBSTRATES IN ELECTRONIC DEVICE MANUFACTURING - Substrate transport systems, apparatus, and methods are described. The systems are adapted to efficiently put or pick substrates at a destination by rotating a boom linkage to a position adjacent to the destination and then independently actuating an upper arm link housing and one or more wrist members to put or pick one or more substrates at the destination wherein the wrist member is independently actuated relative to the forearm link housing and the motion of the forearm link member is kinematically linked to the motion of the upper arm link housing. Numerous other aspects are provided. | 02-14-2013 |
20130039734 | ROBOT SYSTEMS, APPARATUS, AND METHODS ADAPTED TO PROCESS SUBSTRATES IN MULTIPLE TIERS - Substrate transport systems, apparatus, and methods are described. In one aspect, the systems are disclosed having vertically stacked transfer chamber bodies. In one embodiment, a common robot apparatus services process chambers or load lock chambers coupled to upper and lower transfer chamber bodies. In another embodiment, separate robot apparatus service the process chambers and/or load lock chambers coupled to upper and lower transfer chamber bodies, and an elevator apparatus transfers the substrates between the various elevations. Degassing apparatus are described, as are numerous other aspects. | 02-14-2013 |
20130115028 | ROBOT SYSTEMS, APPARATUS, AND METHODS ADAPTED TO TRANSPORT DUAL SUBSTRATES IN ELECTRONIC DEVICE MANUFACTURING - Substrate transport systems and robot apparatus are described. The systems are adapted to efficiently pick or place a substrate at a destination by independently rotating an upper arm, a forearm, and dual wrist members relative to each other and a base. Methods of operating the robot apparatus are provided, as are numerous other aspects. | 05-09-2013 |
20130272823 | ROBOT SYSTEMS, APPARATUS, AND METHODS HAVING INDEPENDENTLY ROTATABLE WAISTS - Electronic device processing systems and robot apparatus are described. The systems and apparatus are adapted to efficiently pick or place substrates into twin chambers by having independently rotatable first and second booms, and independently rotatable first and second upper arms, wherein each upper arm has a forearm, a wrist member, and an end effector adapted to carry a substrate coupled thereto. The boom members and upper arms are driven through co-axial drive shafts in some embodiments. Co-axial and non-coaxial drive motors are disclosed. Methods of operating the robot apparatus and processing systems are provided, as are numerous other aspects. | 10-17-2013 |
20140010625 | BOOM DRIVE APPARATUS, MULTI-ARM ROBOT APPARATUS, ELECTRONIC DEVICE PROCESSING SYSTEMS, AND METHODS FOR TRANSPORTING SUBSTRATES IN ELECTRONIC DEVICE MANUFACTURING SYSTEMS - Boom drive apparatus for substrate transport systems and methods are described. The boom drive apparatus is adapted to drive one or more multi-arm robots rotationally mounted to the boom to efficiently put or pick substrates. The boom drive apparatus has a boom including a hub, a web, a first pilot above the web, and a second pilot below the web, a first driving member rotationally mounted to the first pilot, a second driving member rotationally mounted to the second pilot, a first driven member rotationally mounted to the boom above the a web, a second driven member rotationally mounted to the boom below the a web, and a first and second transmission members coupling the driving members to driven members located outboard on the boom. Numerous other aspects are provided. | 01-09-2014 |
20140044503 | LINKED VACUUM PROCESSING TOOLS AND METHODS OF USING THE SAME - In some embodiments, a linked processing tool system is provided that includes (1) a first processing tool having at least a first transfer chamber configured to couple to a plurality of processing chambers; (2) a second processing tool having at least a second transfer chamber configured to couple to a plurality of processing chambers; (3) a third transfer chamber coupled between the first and second processing tools and configured to transfer substrates between the first and second processing tools; and (4) a single sequencer that controls substrate transfer operations between the first processing tool, the second processing tool and the third transfer chamber of the linked processing tool system. Numerous other aspects are provided. | 02-13-2014 |
20140150878 | PROCESS CHAMBER GAS FLOW APPARATUS, SYSTEMS, AND METHODS - Process chamber gas flow control apparatus having a tiltable valve are disclosed. The gas flow apparatus includes a process chamber adapted to contain a substrate, an exit from the process chamber including a valve seat, and a tiltable valve configured and adapted to tilt relative to the valve seat to control flow non-uniformities within the process chamber. Systems and methods including the tiltable valve apparatus are disclosed, as are numerous other aspects. | 06-05-2014 |
20140154038 | MULTI-AXIS ROBOT APPARATUS WITH UNEQUAL LENGTH FOREARMS, ELECTRONIC DEVICE MANUFACTURING SYSTEMS, AND METHODS FOR TRANSPORTING SUBSTRATES IN ELECTRONIC DEVICE MANUFACTURING - Embodiments include multi-arm robots for substrate transport systems that include a boom, first and second forearms rotationally coupled to the boom, the second forearm being shorter than the first forearm, a first wrist member rotationally coupled to the first forearm, and a second wrist member rotationally coupled to the second forearm. Each of the boom, first and second forearms, and the first and second wrist members are configured to be independently rotated to carry out substrate motion profiles. Electronic device processing systems and methods of transporting substrates are described, as are numerous other aspects. | 06-05-2014 |
20140156070 | VIBRATION-CONTROLLED SUBSTRATE HANDLING ROBOTS, SYSTEMS, AND METHODS - Embodiments disclose a vibration-controlled robot apparatus. The apparatus includes a robot having an end effector operable to transport a substrate, a sensor coupled to the robot, the sensor operable to sense vibration as the robot transports the substrate, and operating the robot to reduce vibration of the end effector supporting the substrate. In some embodiments, a filter is provided in the motor drive circuit to filter one or more frequencies causing unwanted vibration of the end effector. Vibration control systems and methods of operating the same are provided, as are other aspects. | 06-05-2014 |
20140262035 | SEMICONDUCTOR DEVICE MANUFACTURING PLATFORM WITH SINGLE AND TWINNED PROCESSING CHAMBERS - A transfer chamber for semiconductor device manufacturing includes (1) a plurality of sides that define a region configured to maintain a vacuum level and allow transport of substrates between processing chambers, the plurality of sides defining a first portion and a second portion of the transfer chamber and including (a) a first side that couples to two twinned processing chambers; and (b) a second side that couples to a single processing chamber; (2) a first substrate handler located in the first portion of the transfer chamber; (3) a second substrate handler located in the second portion of the transfer chamber; and (4) a hand-off location configured to allow substrates to be passed between the first portion and the second portion of the transfer chamber using the first and second substrate handlers. Method aspects are also provided. | 09-18-2014 |
20140271050 | WAFER HANDLING SYSTEMS AND METHODS - A wafer handling system may include upper and lower linked robot arms that may move a wafer along a nonlinear trajectory between chambers of a semiconductor processing system. These features may result in a smaller footprint in which the semiconductor processing system may operate, smaller transfer chambers, smaller openings in process chambers, and smaller slit valves, while maintaining high wafer throughput. In some embodiments, simultaneous fast wafer swaps between two separate chambers, such as load locks and ALD (atomic layer deposition) carousels, may be provided. Methods of wafer handling are also provided, as are other aspects. | 09-18-2014 |
20140271055 | SUBSTRATE DEPOSITION SYSTEMS, ROBOT TRANSFER APPARATUS, AND METHODS FOR ELECTRONIC DEVICE MANUFACTURING - Electronic device processing systems are described. The system includes a mainframe housing having a transfer chamber, a first facet, a second facet opposite the first facet, a third facet, and a fourth facet opposite the third facet, a first carousel assembly coupled to a first facet, a second carousel assembly coupled to the third facet, a first load lock coupled to the second facet, a second load lock coupled to the fourth facet, and a robot adapted to operate in the transfer chamber to exchange substrates from the first and second carousels. Methods and multi-axis robots for transporting substrates are described, as are numerous other aspects. | 09-18-2014 |
20140286736 | SYSTEMS, APPARATUS AND METHODS FOR TRANSPORTING SUBSTRATES IN ELECTRONIC DEVICE MANUFACTURING - An electronic device processing system is disclosed. The system includes a transfer chamber including facets and a plurality of single-entry process chambers coupled to the facets, wherein at least some process chambers are non-focalized process chambers, at least one load lock chamber, and a robot apparatus operable to transport substrates between the process chambers and the load lock chamber(s). Robot apparatus includes an upper arm, a forearm, and a wrist member adapted for independent rotation relative to the forearm about a wrist axis, and an end effector adapted to carry a substrate. Various degrees of yaw may be imparted to the wrist member in order to service the non-focalized process chambers. Systems and methods are also provided as are other aspects. | 09-25-2014 |
20140286741 | SUBSTRATE PROCESSING SYSTEMS AND ROBOT APPARATUS FOR TRANSPORTING SUBSTRATES IN ELECTRONIC DEVICE MANUFACTURING - Robot apparatus, substrate transport systems, and methods are described. The robot apparatus and systems are adapted to efficiently put or pick substrates at a destination by rotating a boom linkage to a position adjacent to the destination and then actuating robot assemblies to put or pick the substrates at the destination. Numerous other aspects are provided. | 09-25-2014 |
20140367266 | FAST AND CONTINUOUS EDDY-CURRENT METROLOGY OF A CONDUCTIVE FILM - A measurement tool includes a rotation stage supporting an workpiece support, a thickness sensor overlying a workpiece support surface; a translation actuator coupled to the thickness sensor for translation of the thickness sensor relative to the workpiece support surface; and a computer coupled to control the rotation actuator and the translation actuator, and coupled to receive an output of the thickness sensor. | 12-18-2014 |
20150016941 | SEALED SUBSTRATE CARRIERS AND SYSTEMS AND METHODS FOR TRANSPORTING SUBSTRATES - An electronic device manufacturing system is disclosed. The system includes a processing tool having one or more processing chambers each adapted to perform an electronic device manufacturing process on one or more substrates; a substrate carrier adapted to couple to the system and carry one or more substrates; and a component adapted to create a sealed environment relative to at least a portion of the substrate carrier and to substantially equalize the sealed environment with an environment within the substrate carrier. Methods of the invention are described as are numerous other aspects. | 01-15-2015 |
20150022821 | CARRIER ADAPTER INSERT APPARATUS AND CARRIER ADAPTER INSERT DETECTION METHODS - Methods, apparatus, and assemblies are provided for an adapter insert including an adapter frame including a support rail adapted to support one or more substrates in a substrate carrier, a frame extension coupled to, or integral with, the adapter frame, and a mapping feature formed on the frame extension and disposed to be detected by a sensor for determining whether an adapter insert is present or absent in a substrate carrier. Numerous additional features are disclosed. | 01-22-2015 |
20150082625 | MIXED-PLATFORM APPARATUS, SYSTEMS, AND METHODS FOR SUBSTRATE PROCESSING - An electronic device manufacturing system may include a mainframe to which one or more process chambers of different size may be coupled. A different number of process chambers may be coupled to each facet (i.e., side wall) of the mainframe. The process chambers coupled to one facet may be of a different size than process chambers coupled to other facets. For example, one process chamber of a first size may be coupled to a first facet, two process chambers each of a second size different than the first size may be coupled to a second facet, and three process chambers each of a third size different than the first and second sizes may be coupled to a third facet. Other configurations are possible. The mainframe may have a square or rectangular shape. Methods of assembling an electronic device manufacturing system are also provided, as are other aspects. | 03-26-2015 |