Chin-Fa
Chin-Fa Chang, Baihe Township TW
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20100309619 | Metal display casing and display thereof - A metal display casing is disclosed, which includes a base plate having an edge, a bending portion extended from the edge, a fold-back portion connected to the bending portion, and a screw hole disposed on the fold-back portion. A display utilizing the metal display casing is also disclosed. | 12-09-2010 |
Chin-Fa Chiu, Kuei-San TW
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20090128078 | MOTOR AND MOTOR SPEED CONTROLLING SYSTEM - A motor and a motor speed control system are disclosed. Two power signal lines and one feedback/speed-control signal line are coupled between a control device and the motor. The two power signal lines electrically connect the control device to the motor. The feedback/speed-control signal line bi-directionally transmits signals coming from the control device to the motor and from the motor to the control device. | 05-21-2009 |
Chin-Fa Su, New Taipei City TW
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20120211491 | OIL TANK FLOATING ROOF DEVICE - The present invention is an oil tank floating roof device, including a plurality of connecting bars and a plurality of floating units, which are respectively secured to the plurality of connecting bars by means a plurality of longitudinal and crosswise holding spaces collectively encircling the floating units. A plurality of locking members are fitted on the peripheries of the floating units, and two sides of the connecting bars respectively form at least one joining groove. The joining grooves respectively enable each of the floating units to longitudinally or crosswisely insert therein. The top portions of the connecting bars form at least one pressure resistant reinforcing plate, and the pressure resistant reinforcing plate is fitted with a plurality of locking portions. Bolts are used to respectively correspondingly pass through the locking portions and bolt into the locking members on the longitudinal or crosswise sides of the base of the floating units. | 08-23-2012 |
Chin-Fa Wang, Hsinchu TW
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20090236710 | COL SEMICONDUCTOR PACKAGE - A Chip-On-Lead (COL) semiconductor package is revealed, primarily comprising a plurality of leadframe's leads each having a carrying bar, a finger and a connecting portion connecting the carrying bar to the finger. A chip has a back surface attached to the carrying bars and is electrically connected to the fingers by a plurality of bonding wires. Therein, at least one of the bonding wires overpasses one of the connecting portions without electrical relationship. An insulation tape is attached onto the connecting portions in a manner to be formed between the overpassing section of the bonding wire and the overpast connecting portion so that electrical short can be avoided during wire-bonding processes of the COL semiconductor package. Therefore, the carrying bars under the chip have more flexibility in the layout design of COL semiconductor packages to use die pad(s) with smaller dimensions or even eliminate die pad. | 09-24-2009 |
20090236739 | SEMICONDUCTOR PACKAGE HAVING SUBSTRATE ID CODE AND ITS FABRICATING METHOD - A semiconductor package with a substrate ID code and its manufacturing method are revealed. A circuit and a solder mask are formed on the bottom surface of a substrate where the solder mask covers most of the circuit and a circuit-free zone of the substrate. A chip is disposed on the top surface of the substrate. A substrate ID code consisting of a plurality of laser marks is inscribed in the solder mask or in a portion of an encapsulant on the bottom surface away from the circuit to show the substrate lot number on the bottom surface. Therefore, quality control and failure tracking and management can easily be implemented by tracking the substrate ID code from the semiconductor package without changing the appearance of the semiconductor package. Furthermore, the substrate ID code can be implemented by the existing laser imprinting machines for semiconductor packaging processes and be formed at the same time of formation of a product code. The complexity of the semiconductor packaging processes is not increased and the circuits of the substrates are not easily damaged. | 09-24-2009 |
20090261463 | Chip mounting device and chip package array - A chip mounting device includes at least one chip mounting unit and at least one side rail configured beside the chip mounting unit. The chip mounting unit includes a die pad and a plurality of conductive contacts. The side rail includes at least one identifying element. A chip package array with the above-mentioned chip mounting device is also disclosed. The chip mounting device and chip package array includes the identifying element configured on the side rail to improve the identification of semi-finished packaged chips during chip package process to be read automatically by machines instead of operators, and further decrease the loss caused by misjudgments of operators. | 10-22-2009 |
20090302443 | LEADFRAME-BASED SEMICONDUCTOR PACKAGE HAVING ARCHED BEND IN A SUPPORTING BAR AND LEADFRAME FOR THE PACKAGE - A leadframe-based semiconductor package and a leadframe for the package are revealed. The semiconductor package primarily includes parts of the leadframe including one or more first leads, one or more second leads, and a supporting bar disposed between the first leads and the second leads and further includes a chip attached to the first leads, the second leads and the supporting bar, a plurality of bonding wires and an encapsulant. The supporting bar has an extended portion projecting from the first bonding finger and the second bonding finger and connected to a non-lead side of the encapsulant wherein the extended portion has an arched bend to absorb the pulling stresses and to block stress transmission. Cracks caused by delamination of the supporting bar will not be created during trimming the supporting bar along the non-lead side of the encapsulant. Moisture penetration along the cracks of the supporting bar to the die- bonding plane under the chip is desirably prevented. | 12-10-2009 |
20100110654 | INNER-CONNECTING STRUCTURE OF LEAD FRAME AND ITS CONNECTING METHOD - An inner-connecting structure of the lead frame is disclosed in the present invention, which includes a plurality of leads, an insulation film arranged on a portion of a first surface of those leads, a plurality of holes formed on the insulation film to expose a portion of the first surface of a portion of those leads, and a conductive element selectively connecting the exposed portion of those leads electrically. Besides, an inner-connecting method of the lead frame is also disclosed herein. The insulation film is utilized to separate the conductive element from the lead frame so that the lead can be easily interconnected with each other. | 05-06-2010 |
Chin-Fa Wang, Hukou Shiang TW
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20110215454 | COL PACKAGE HAVING SMALL CHIP HIDDEN BETWEEN LEADS - A Chip-On-Lead (COL) type semiconductor package having small chip hidden between leads is revealed. The lower surfaces of the leadframe's leads are attached to a wiring substrate and the leads are horizontally bent to form a die-holding cavity. A smaller chip is disposed on the wiring substrate by passing through the die-holding cavity to be on the same disposing level with the leads. At least a larger chip is disposed on the leads to overlap the smaller chip so that the small chip does not extrude from the leads. The encapsulant encapsulates a plurality of internal parts of the leads, the wiring substrate, and the larger chip. Therefore, the conventional unbalance issue of mold flow above and below the leads leading to cause excessive warpage can be avoided and numbers of stacked larger chips can be increased to have larger memory capacities. | 09-08-2011 |
Chin-Fa Wu, Chutung TW
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20150122072 | TWIN ROTATION DRIVING APPARATUS - A twin rotation driving apparatus is provided, including a base body, an axle unit pivotally connected to the base body for carrying a workpiece, a first driving unit disposed on the base body and having a first gear set connected to the axle unit and a first motor coaxially connected to the first gear set, and a second driving unit disposed on the base body and having a second gear set connected to the axle unit and a second motor coaxially connected to the second gear set. The twin rotation driving apparatus includes two motors and two gear sets. Therefore, smaller motors can be included in the twin rotation driving apparatus, and the twin rotation driving apparatus is compact and can still generate great enough torques. | 05-07-2015 |
Chin-Fa Yeh, Pingjen City TW
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20090135363 | Connection arrangement for an automotive display - A connection arrangement for an automotive display includes a male connector disposed within a positioning base of the seat back and a female connector embedded into the rear side of the display. The male connector is positioned at the bottom of the slot of the positioning base and consists of a plurality of male terminals horizontally arranged and electrically coupled to an automotive audio/video player. The female connector includes an upper row of insertion holes and a lower row of insertion holes for a practical connection to the male connector in an obverse direction and a reverse direction, respectively. The front and rear sides of the face end of a control circuit board includes first signal contacts and second signal contacts opposing to the rear end of the female terminals of the insertion holes of the upper and lower rows. The signal contacts are adapted to be a detection module to detect if the female connector is in an obverse direction and a reverse direction, thereby determining if the display is in an obverse direction and a reverse direction. Thus, an automatic turning process can be carried out for the adjustment of the image output. In this way, the display can be inserted into the seat back in an obverse direction and a reverse direction to provide the rear-seat passengers with different desired viewing angles. | 05-28-2009 |
20090137155 | Connection arrangement for image and antenna signals of an automotive display - A connection arrangement for image and antenna signals of an automotive display includes a male connector disposed within a positioning base of the seat back and a female connector embedded into the rear side of the display. The male connector is positioned at the bottom of the slot of the positioning base and consists of a plurality of male terminals horizontally arranged and electrically coupled to an automotive audio/video player. An antenna plug is respectively fitted at both sides of the male terminals. The female connector includes an upper row of insertion holes, a lower row of insertion holes, and antenna jacks for a practical connection to the male connector in an obverse direction and a reverse direction. The front and rear sides of the face end of a control circuit board includes first signal contacts and second signal contacts opposing to the rear end of the female terminals of the insertion holes of the upper and lower rows. The signal contacts are adapted to be a detection module to detect if the female connector is in an obverse direction and a reverse direction, thereby determining if the display is in an obverse direction and a reverse direction. Thus, an automatic turning process can be carried out for the adjustment of the image output. In this way, the image and antenna connection modules are integrated into a body. | 05-28-2009 |