Patent application number | Description | Published |
20090065888 | SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME - The present invention aims to enhance the reliability of a semiconductor device equipped with a Schottky barrier diode within the same chip, and its manufacturing technology. The semiconductor device includes an n-type n-well region formed over a main surface of a p-type semiconductor substrate, an n-type cathode region formed in part thereof and higher in impurity concentration than the n-well region, a p-type guard ring region formed so as to surround the n-type cathode region in circular form, an anode conductor film formed so as to integrally cover the n-type cathode region and the p-type guard ring region and to be electrically coupled thereto, n-type cathode conduction regions formed outside the p-type guard ring region with each separation portion left therebetween, and a cathode conductor film formed so as to cover the n-type cathode conduction regions and to be electrically coupled thereto. The anode conductor film and the n-type cathode region are Schottky-coupled to each other. | 03-12-2009 |
20090243027 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND A METHOD OF MANUFACTURING THE SAME - To achieve a further reduction in the size of a finished product by reducing the number of externally embedded parts, the embedding of a Schottky barrier diode which is relatively large in the amount of current in a semiconductor integrated circuit device has been pursued. In such a case, it is general practice to densely arrange a large number of contact electrodes in a matrix over a Schottky junction region. It has been widely performed to perform a sputter etching process with respect to the surface of a silicide layer at the bottom of each contact hole before a barrier metal layer is deposited. However, in a structure in which electrodes are thus arranged over a Schottky junction region, a reverse leakage current in a Schottky barrier diode is varied by variations in the amount of sputter etching. The present invention is a semiconductor integrated circuit device having a Schottky barrier diode in which contact electrodes are arranged over a guard ring in contact with a peripheral isolation region. | 10-01-2009 |
20100052073 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - In an LCD driver IC, a high-breakdown-voltage MISFET is mounted together with a typical low-breakdown-voltage MISFET. Because the high-breakdown-voltage MISFET has a gate oxide film thicker than that of the typical MISFET, the electrode of the high-breakdown-voltage MISFET is inevitably high in level. Accordingly, the depth of a gate contact is shallow so that process compatibility with the typical portion is necessary. In the present invention, in, e.g., the channel width direction of the high-breakdown-voltage MISFET, the boundary of a thick-film gate oxide region is located inwardly of the end of a gate electrode. At the gate electrode portion thus lowered in level, a gate contact is disposed so that the boundary of the thick film is located inwardly of the end of the gate electrode and between the gate contact and a channel end. | 03-04-2010 |
20120187520 | Semiconductor Device Comprising A Schottky Barrier Diode - The present invention aims to enhance the reliability of a semiconductor device equipped with a Schottky barrier diode within the same chip, and its manufacturing technology. The semiconductor device includes an n-type n-well region formed over a p-type semiconductor substrate, an n-type cathode region formed in part thereof and higher in impurity concentration than the n-well region, a p-type guard ring region formed so as to surround the n-type cathode region, an anode conductor film formed so as to integrally cover the n-type cathode region and the p-type guard ring region and to be electrically coupled thereto, n-type cathode conduction regions formed outside the p-type guard ring region with each separation portion left therebetween, and a cathode conductor film formed so as to cover the n-type cathode conduction regions and to be electrically coupled thereto. The anode conductor film and the n-type cathode region are Schottky-coupled to each other. | 07-26-2012 |
20120326262 | Semiconductor Integrated Circuit Device and A Method of Manufacturing the Same - To reduce size of a finished product by reducing the number of externally embedded parts, embedding of a Schottky barrier diode relatively large in the amount of current in a semiconductor integrated circuit device has been pursued. It is general practice to densely arrange a number of contact electrodes in a matrix over a Schottky junction region. A sputter etching process to the surface of a silicide layer at the bottom of each contact hole is performed before a barrier metal layer is deposited. However, in a structure in which electrodes are thus arranged over a Schottky junction region, a reverse leakage current in a Schottky barrier diode is varied by variations in the amount of sputter etching. The present invention is a semiconductor integrated circuit device having a Schottky barrier diode in which contact electrodes are arranged over a guard ring in contact with a peripheral isolation region. | 12-27-2012 |
20140061847 | SEMICONDUCTOR DEVICE COMPRISING A SCHOTTKY BARRIER DIODE - The present invention aims to enhance the reliability of a semiconductor device equipped with a Schottky barrier diode within the same chip, and its manufacturing technology. The semiconductor device includes an n-type n-well region formed over a p-type semiconductor substrate, an n-type cathode region formed in part thereof and higher in impurity concentration than the n-well region, a p-type guard ring region formed so as to surround the n-type cathode region, an anode conductor film formed so as to integrally cover the n-type cathode region and the p-type guard ring region and to be electrically coupled thereto, n-type cathode conduction regions formed outside the p-type guard ring region with each separation portion left therebetween, and a cathode conductor film formed so as to cover the n-type cathode conduction regions and to be electrically coupled thereto. The anode conductor film and the n-type cathode region are Schottky-coupled to each other. | 03-06-2014 |
20150162323 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - In IC chips for display device driving, an operational amplifier is widely used in input and output circuits, and a capacitor in a medium withstanding voltage chip is used as a compensation capacitor. As for this product area, cost competitiveness is very important. Therefore, a MIS capacitor with good area efficiency is widely used. However, unlike a so-called varactor widely used in a VCO circuit, a characteristic of as small a voltage dependence of the capacitor as possible is used. Therefore, an additional process is added to reduce the voltage dependence of the capacitor, but there is a problem of an increase in process cost. A semiconductor substrate side capacitor electrode in a MIS capacitor within a first conduction type medium withstanding voltage chip used in an I/O circuit or the like on a semiconductor integrated circuit device is formed in a first conduction type low withstanding voltage well region. | 06-11-2015 |
Patent application number | Description | Published |
20090261084 | Laser Dicing Sheet and Manufacturing Method For Chip Body - An object of the present invention is to provide a laser dicing sheet which is capable of preventing cutting of dicing sheet by laser beam, damage of the chuck table and fusion of the dicing sheet to the chuck table. | 10-22-2009 |
20110039065 | PRESSURE-SENSITIVE ADHESIVE SHEET - Provided is a pressure-sensitive adhesive sheet ( | 02-17-2011 |
20110068681 | LUMINESCENT COMPOSITION AND INORGANIC ELECTROLUMINESCENT SHEET USING THE SAME - The present invention provides a luminescent composition which is capable of providing an inorganic electroluminescent sheet with a high productivity at low costs in an efficient manner, and has a desired light transmittance (transparency) when no electric voltage is applied thereto, an inorganic electroluminescent sheet obtained from the luminescent composition which can be mass-produced, and a process for producing the inorganic electroluminescent sheet. The present invention relates to a luminescent composition including an inorganic electroluminescent substance and a binder resin, wherein a content of the inorganic electroluminescent substance is not less than 0.5 part by mass and less than 100 parts by mass on the basis of 100 parts by mass of the binder resin; and an inorganic electroluminescent sheet including at least a first transparent substrate, a first transparent electrode, an inorganic electroluminescent layer, a first transparent electrode and a second transparent substrate which are successively laminated in this order, wherein the inorganic electroluminescent layer is formed from the above luminescent composition, and the inorganic electroluminescent sheet has a light transmittance of 60% or more as measured at a wavelength of 550 nm under a non-light emitting condition. | 03-24-2011 |
20110143076 | PRESSURE-SENSITIVE ADHESIVE, SHEET FOR MANUFACTURING AN OPTICAL RECORDING MEDIUM AND OPTICAL RECORDING MEDIUM | 06-16-2011 |
20120045612 | PRESSURE-SENSITIVE ADHESIVE SHEET - A pressure-sensitive adhesive sheet is a laminate of a base material, a pressure-sensitive adhesive layer and a release material, and has a plurality of through-holes passing through from a surface of the base material to a pressure-sensitive adhesive face. The base material comprises a resin composition that contains 65 to 98 wt % of a polyolefin based resin (A) and 2.0 to 35 wt % of a pigment (B). In such a pressure-sensitive adhesive sheet, air entrapments and blisters can be prevented or removed by way of the through-holes. Also, expansion of the inner diameter of the through-holes is suppressed, and thereby the pressure-sensitive adhesive sheet has good appearance. | 02-23-2012 |
20130034729 | BASE MATERIAL FILM FOR DICING SHEET AND DICING SHEET - A base material film used for a dicing sheet, the dicing sheet including the base material film and a pressure-sensitive adhesive layer laminated on one surface of the base material film. The base material film includes a single layer of resin film or multiple layers of resin films, at least the resin film in contact with the pressure-sensitive adhesive layer being formed from a resin composition containing ethylene-(meth)acrylic acid copolymer as a main constituent, the resin composition further containing 0.3 to 17.0 parts by mass of an epoxy compound based on 100 parts by mass of the ethylene-(meth)acrylic acid copolymer. The dicing sheet that uses the base material film does not require application of physical energy such as an electron beam or a γ-ray, and can be reduced in dicing dust that is generated during the dicing of a cut object. | 02-07-2013 |
20130327399 | Protective Sheet for Solar Cell, Manufacturing Method Thereof, and Solar Cell Module - Protective sheet | 12-12-2013 |
20140069495 | SOLAR CELL PROTECTIVE SHEET, PRODUCING METHOD OF SAME, AND SOLAR CELL MODULE - A solar cell protective sheet includes a substrate and a thermoplastic resin layer laminated on at least one surface of the substrate. The thermoplastic resin layer contains at least one pigment selected from the group consisting of titanium oxide, talc, magnesium oxide, cerium oxide, barium sulfate, calcium carbonate and carbon black. The solar cell protective sheet has excellent adhesiveness to an encapsulant of a solar cell module and can suppress the warping caused in the solar cell module. | 03-13-2014 |
20140308494 | GAS BARRIER FILM, METHOD FOR PRODUCING SAME, GAS BARRIER FILM LAMINATE, MEMBER FOR ELECTRONIC DEVICES, AND ELECTRONIC DEVICE - The present invention provides: a gas barrier film comprising a cured resin layer and a gas barrier layer, the gas barrier layer being provided on at least one side of the cured resin layer,
| 10-16-2014 |
20140350187 | CURABLE RESIN COMPOSITION, CURABLE RESIN MOLDED BODY, CURED RESIN MOLDED BODY, METHOD FOR PRODUCING EACH OF SAME, AND LAMINATE BODY - Provided is a curable resin composition comprising a thermoplastic resin (A) that includes a cyclic structure in its main chain, and has a glass transition temperature (Tg) of 140° C. or more, and a monofunctional curable monomer (B). The present invention provides: a cured resin formed article that has heat resistance and low birefringence, a method for producing the same, a curable resin composition and a curable resin formed article that are useful as a raw material for producing the cured resin formed article, and a laminate that includes a layer formed of a cured resin. | 11-27-2014 |
20140364531 | CURABLE RESIN COMPOSITION, CURABLE RESIN MOLDED BODY, CURED RESIN MOLDED BODY, METHOD FOR PRODUCING EACH OF SAME, AND LAMINATE BODY - The present invention is: a curable resin composition comprising a thermoplastic resin (A), a curable monomer (B), and a photoinitiator (C), the thermoplastic resin (A) including an aromatic ring in its molecule, and having a glass transition temperature (Tg) of 140° C. or more, and the photoinitiator (C) having an absorbance at 380 nm of 0.4 or more when measured in a 0.1 mass % acetonitrile solution; a curable resin formed article obtained by forming the curable resin composition; a cured resin formed article obtained by curing the curable resin formed article; a laminate comprising at least one layer that is formed of a cured resin obtained by curing the curable resin composition. The present invention provides: a cured resin formed article that exhibits excellent heat resistance, includes only a small amount of residual low-boiling-point substance (e.g., solvent and curable monomer), and has small in-plane retardation, a method for producing the same, a curable resin composition and a curable resin formed article that are useful as a raw material for producing the cured resin formed article, and a laminate that includes a layer formed of a cured resin. | 12-11-2014 |
20150348819 | DICING SHEET BASE FILM AND DICING SHEET - A dicing sheet base film includes a resin layer (A). The resin layer (A) contains: a norbornene-based resin (a1) that is a thermoplastic resin containing a structural unit derived from a norbornene-based compound; a styrene-based elastomer (a2); and an olefin-based thermoplastic resin (a3) other than the norbornene-based resin (a1) and other than the styrene-based elastomer (a2). The dicing sheet base film suppresses the occurrence of dicing debris, in particular filament-like dicing debris, during the dicing of a cut object without imparting physical energy such as electron rays and γ rays, and has sufficient expandability in the expanding process. | 12-03-2015 |
20150348820 | DICING SHEET BASE FILM AND DICING SHEET - A dicing sheet base film includes a resin layer (A). The resin layer (A) contains: a polyethylene (a1) that has a density of 0.900 g/cm | 12-03-2015 |
20150357225 | BASE FILM FOR DICING SHEET AND DICING SHEET COMPRISING SAME - A base film for a dicing sheet is provided which can suppress dicing debris from generating during the dicing of a cut object in the full-cut dicing without imparting physical energy, such as electron beam or γ ray, and which has an enhanced expanding property in the expanding process. The base film for a dicing sheet comprises a resin layer that contains a polyethylene and an ethylene-tetracyclododecene copolymer. A dicing sheet that comprises the base film for a dicing sheet is also provided. | 12-10-2015 |
Patent application number | Description | Published |
20090158539 | ENDOSCOPE WASHING AND DISINFECTING APPARATUS AND LEAK DETECTION METHOD PERFORMED BY THE APPARATUS - An endoscope washing and disinfecting apparatus includes: a connecting portion connected to a bending transmitting portion of an endoscope to transmit driving force; a distal end driving portion for transmitting the driving force to the bending transmitting portion through the connecting portion; a fluid supplying unit for supplying gas into an inner space of the endoscope; and a control unit for controlling a pressure detecting portion for detecting pressure in the inner space and the distal end driving portion to provide the bending portion with bending motion, and for determining occurrence or nonoccurrence of water leak in the endoscope by comparing the pressure detected by the pressure detecting portion and a preset threshold. | 06-25-2009 |
20100252074 | ENDOSCOPE CLEANING/DISINFECTING APPARATUS AND ENDOSCOPE CLEANING/DISINFECTING METHOD - An endoscope cleaning/disinfecting apparatus for processing an endoscope in a cleaning tank using a diluted chemical obtained by diluting a chemical with hot water in a dilution tank of the present invention introduces the hot water into the cleaning tank immediately before processing, introduces the hot water into the dilution tank after the temperature of the hot water introduced into the cleaning tank falls within a specified temperature range, generates the diluted chemical, introduces the diluted chemical into the cleaning tank and processes the endoscope. | 10-07-2010 |
20120125385 | ENDOSCOPE CLEANING/DISINFECTING APPARATUS - An endoscope cleaning/disinfecting apparatus according to the present invention includes a chemical bottle, an insertion portion, a chemical receiving portion, a blade portion, a first limit switch and a second limit switch. When the chemical bottle is moved to a first position, the first limit switch changes from off to on to detect the first position, when the chemical bottle is inserted to a second position at which an inner face of the chemical receiving portion and a spout portion are aligned to each other, the second limit switch changes from off to on to detect the second position, and when the chemical bottle is inserted to a third position at which a stopper portion is opened, the first limit switch is released by a stepped portion from pressing by the chemical bottle, and thereby changes from on to off to detect the third position. | 05-24-2012 |
Patent application number | Description | Published |
20090058605 | WIRELESS RECEPTION DEVICE, WIRELESS SENDING DEVICE, AND WIRELESS TRANSMISSION DEVICE - A wireless reception device, a wireless sending device, and a wireless transmitting device are provided, wherein occurrences of distortion and an error in the radio signal that is being transmitted can be prevented even if compensation for circuit characteristics is performed. | 03-05-2009 |
20090086856 | RECEPTION FREQUENCY CONTROL CIRCUIT - The present invention aims to provide a reception frequency control circuit that is small in mounting area and unaffected by disturbance where an FSK-modulated signal is demodulated. In the reception frequency control circuit, a reception signal processing unit converts an FSK-modulated digital signal to an intermediate frequency when the FSK-modulated digital signal is received. Thereafter, a frequency voltage converting unit converts the intermediate signal to a voltage signal and outputs an output signal. At the same time, an analog frequency controlling unit detects a frequency deviation from the output signal by analog processing. A digital frequency controlling unit generates a reception frequency control signal for correcting the frequency and feeds back the same to the reception signal processing unit. Stable frequency control can be realized by performing reception frequency control by a combination of an analog circuit-digital circuit in this way. | 04-02-2009 |
20090128714 | ELECTRONIC DEVICE, REMOTE CONTROL DEVICE, AND REMOTE CONTROL SYSTEM - An electronic device includes a wireless receiving circuit for receiving signals transmitted from a remote control unit, a core circuit having a digital signal processing circuit for processing input signals and configured to perform at least one of display processing and record processing based on signals processed in the digital signal processing circuit in accordance with a control signal transmitted from the remote control unit and received by the wireless receiving circuit, and a preliminary activation circuit for starting electric power supply to the digital signal processing circuit to thereby activate the digital signal processing circuit when a pre-operation state where the remote control unit is expected to be operated during stoppage of electric power supply to the core circuit has occurred. | 05-21-2009 |
20120098608 | OSCILLATION CIRCUIT - An oscillation circuit includes a resonance circuit and an amplifier circuit. The resonance circuit includes an inner capacitor to be disposed inside a semiconductor integrated circuit, and an outer capacitor and an outer inductor to be disposed outside the semiconductor integrated circuit. The amplifier circuit includes an input terminal and an output terminal both connected to the resonance circuit. Further, the resonance circuit includes a first closed circuit portion including the inner capacitor, the outer inductor, and a first wiring portion for connecting the inner capacitor and the outer inductor. The resonance circuit further includes a second closed circuit portion including the outer capacitor, the outer inductor, and a second wiring portion for connecting the outer capacitor and the outer inductor. The second closed circuit portion has a wiring resistance smaller than that of the first closed circuit portion. | 04-26-2012 |
20120142283 | WIRELESS COMMUNICATION APPARATUS - A wireless communication apparatus using a frequency signal produced by a frequency synthesizer operates at a reduced power consumption and includes a reception portion comprising a first mixer mixing a signal based on the received wireless signal and the frequency signal, a second mixer mixing the first mixer output signal and a local signal, and a demodulation stage demodulating the second mixer output signal. The frequency synthesizer comprises a Voltage Controlled Oscillator (VCO) generating a frequency signal responsive to a variation of a control input voltage, and a feed back circuit receiving as a control input voltage a voltage corresponding to a phase difference between a signal obtained by frequency dividing the output frequency signal of the VCO and a reference clock signal. The VCO is operable at a high frequency that increases with an increase of a bias current. | 06-07-2012 |
20120286926 | WIRELESS KEY SYSTEM AND KEY LOCATION DETERMINATION METHOD - A wireless key system and location detection method determine whether a wireless key is located inside or outside a main body. A communication device in the main body transmits a wireless signal using an inner antenna and an outer antenna outside the main body having a different directivity. A wireless key measures direction of movement of the wireless key when the wireless signal is received by one of antennas having different directivities, detects one of the antennas receiving the highest signal level of the wireless signal as a first antenna, selects one of the antennas having the same directivity as the inner antenna as a second antenna according to the measured direction of movement and detected directivity of the antenna, and decides that the wireless key is inside the main body based on the signal levels of the wireless signals received by the first and second antennas. | 11-15-2012 |
20120297263 | SEMICONDUCTOR CHIP AND TEST METHOD - A semiconductor chip having a functional block that performs a communication function includes an input circuit that supplies an oscillating test signal to the functional block, and a test circuit that detects the strength of an oscillating signal which the functional block outputs in response. A strength signal indicating the detected strength is output from the test circuit through an external terminal of the semiconductor chip to a test device. The test device evaluates the strength signal to decide whether an operating characteristic of the functional block is within a specified range. The strength information indicated by the strength signal is not affected by impedance on the signal transmission line between the semiconductor chip and the test device, so the test is not affected by impedance loss. | 11-22-2012 |