Patent application number | Description | Published |
20080227337 | Memory card, memory card adaptor and combination thereof - The present invention provides a first memory card, a memory card adaptor and a memory device combining the first memory card and the memory card adaptor. The first memory card has dual interfaces for the host, wherein one interface is the USB interface and dual interface contact pads are respectively arranged on different surfaces and different ends of the first memory card. The first memory card adaptor has an appearance of a second memory card and has the corresponding connecting structure for fixing the first memory card. Once the memory device is in the USB mode, the user can directly extract the memory card or just partially extract the memory card to expose those USB contact pads. Further, the memory card adaptor can hold the first memory card without loosening while partially extracting from the insertion port of the memory card adaptor. | 09-18-2008 |
20080310653 | Digital audio signal amplifier - A digital audio signal amplifier includes: a digital signal amplifying module having a digital audio signal plug connected with a digital audio signal outlet of a main board to receive digital audio signals, the digital signal amplifying module processing the digital audio signals to generate high power analog audio signals; and an analog signal output interface coupled to the digital signal amplifying module and transferring the high power analog audio signals to a set of speaker. | 12-18-2008 |
20090027845 | Connector with build-in control unit and its application - A connector with a build-in control unit is to be suitable for use in a memory package. The connector includes a main body; a control unit; a plurality of first external contacts; and a plurality of second external contacts. The control unit is arranged in the main body. The first external contacts and the second external terminals are respectively arranged at the surface of the main body and electrically connected to the control unit. Wherein, the first external contacts are used for electrically connecting with the memory package. The I/O signal format of the memory package can transferred into the required I/O signal format by the control unit of the connector of the present invention. | 01-29-2009 |
20090073665 | Memory card - A memory card includes a first cover, a second cover, a set of leads and a memory component. The first cover has a set of openings; the second cover is combined with the first cover to define a holding space. The leads are arranged in the holding space, and their one end are emerged from the openings as an exterior terminal. The memory component arranged in the holding space includes a chip substrate and at least one function component electrically connected with the chip substrate, wherein the chip substrate has a set of conductive pads electrically connected to the other end of the leads. According to the above-mentioned structure, the memory card with smaller chip substrate is designed to reduce manufacture cost. | 03-19-2009 |
20090102731 | Antenna structure for TPMS transmitter - An antenna structure for a TPMS (Tire pressure Monitoring System) transmitter is disclosed herein. A TPMS transmitter couples with a valve so that a spiral coil within the TPMS transmitter can be electrically connected to a conduct body of the valve to get a specific resonance frequency. Hence, the length of the antenna structure can be increased effectively and the efficacy can be raised. | 04-23-2009 |
20090184404 | Electromagnetic shilding structure and manufacture method for multi-chip package module - An electromagnetic shielding structure for a multi-chip package module includes a substrate having at least one conductive point, a plurality of chips, an encapsulating body and an electromagnetic shielding layer. Wherein the chips are arranged and encapsulated by the encapsulating body on the substrate. The electromagnetic shielding layer is arranged on the encapsulating body and the conductive point to shield highly frequency electromagnetic wave by printing. Meanwhile, the electromagnetic shielding layer can replace the conventional metal shell to reduce the whole size of the multi-chip package module. | 07-23-2009 |
20090184882 | Semiconductor package with an antenna and manufacture method thereof - A manufacture method of semiconductor package with an antenna includes: providing a substrate with a first surface and an opposite second surface, wherein the first surface has a predetermined circuit; arranging a functional element on the first surface and electrically connecting the functional element with the predetermined circuit of the substrate; encapsulating the functional element and a portion of the first surface of the substrate by an encapsulating body; and printing an antenna electrically connected with the predetermined circuit on the surface of the encapsulating body. A semiconductor package with an antenna is also disclosed. | 07-23-2009 |
20090265101 | Access Device With Navigation Function - The present invention discloses an access device with a navigation function, which includes: a GPS module receiving a GPS signal from satellites; a processor coupled to the GPS module and processing GPS information; a storage unit coupled to the processor and storing the GPS information, map data and a navigation software; and a transmission interface coupled to the processor and implementing a computer device/electronic device to read data from/write data into the access device, wherein the computer device/electronic device communicates with the processor via the transmission interface to execute the navigation software using the GPS information and map data to navigate. | 10-22-2009 |
20090278749 | Decoration Structure with Loop Antenna - The present invention discloses a decoration structure with a loop antenna, wherein a loop antenna having superior electromagnetic radiation performance is used as the receiving antenna of a GPS device. Further, the present invention adorns and packages the loop antenna into a decorative strap and integrates the strap with the receiving device so as to reduce the receiving device size and convenience the user holding or wearing the receiving device. | 11-12-2009 |
20100225458 | BICYCLE BURGLARPROOF DEVICE - A bicycle burglarproof device includes a monitoring device and a warning device. The monitoring device detects a displacement of a bicycle, and wirelessly transmits a warning signal to the warning device once the displacement is identified as abnormal. Upon receiving the warning signal, the warning device notifies a user that an anomalous situation has happened via a recognizable signal generated by a prompting unit. The bicycle burglarproof device is capable of notifying the remote owner of the bicycle via a wireless communication module once an abnormal displacement of the bicycle is detected, so that the owner can immediately act to stop the burglary. In addition, the monitoring device is compactly designed and may be easily integrated with other bicycle accessories, so that it is less likely to catch the attention of burglars and get destroyed, thereby constant communication with the warning device may be maintained. | 09-09-2010 |
20100258891 | FINGERPRINT SENSOR CHIP PACKAGE METHOD AND THE PACKAGE STRUCTURE THEREOF - A fingerprint sensor chip package method and the package structure thereof are disclosed. The invention includes: providing a substrate; arranging a sensor chip on the substrate, with an active surface of the sensor chip facing upward; forming a patterned conductive colloid on the sensor chip, wherein the patterned conductive colloid extends from the periphery of the active surface of the sensor chip along the side wall of the sensor and electrically connects with the circuit layer of the substrate; forming a non-conductive film to cover the sensor chip, the patterned conductive colloid and a portion of the substrate; and forming a conductive film on the non-conductive film. The patterned conductive colloid replaces the conventional bond wires to improve the product yield and to omit the molding process. The conductive film is electrically connected with the grounding point/area on the substrate to dissipate the static charges for protecting the chip. | 10-14-2010 |
20100265135 | GLOBAL POSITIONING SYSTEM LOGGER - A global positioning system (GPS) logger includes a GPS module, a storage unit, a slot, a communication interface and a processing unit. The GPS module is configured for receiving a satellite signal and generating a log data including a position coordinate and a log time. The storage unit is configured for storing the log data. The slot is configured for an external storage media which stores a file including a time stamp to connect with the GPS logger. The communication interface is configured for an electronic device to electrically connect with the GPS logger so that the electronic device can exchange data with the GPS logger through the communication interface. The processing unit is electrically connected to the foresaid elements and configured for embedding the position coordinate in the file according to the log time and the time stamp while the file stored in the external storage media is accessed. | 10-21-2010 |
20100315241 | PET POSITIONING DEVICE, PET MONITORING DEVICE AND PET TRACKING SYSTEM THEREOF - A pet tracking system includes a pet positioning device and a pet monitoring device. The pet positioning device is worn on a pet and includes a positioning unit which is configured for detecting a position of the pet. And, the pet positioning device builds a direct wireless communication to the pet monitoring device by a wireless communication unit to send back the position of the pet. Therefore, the pet monitoring device is able to acquire the position of the pet without a mobile communication provided by a telecommunication proprietor. In preferred embodiment, the pet monitoring device can provide a warning signal to remind pet owners to pay attention to the pet while the pet is out of a predetermined range. | 12-16-2010 |
20110260310 | QUAD FLAT NON-LEADED SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF - A method for fabricating a quad flat non-leaded (QFN) package includes: forming die pads and bump solder pads by pressing a metal plate, wherein each of the die pads and the bump solder pads has at least a cross-sectional area greater than another located underneath along its thickness dimension, thereby enabling the die pads and the solder pads to be securely embedded in an encapsulant. The method further includes removing the metal plate after forming the encapsulant so as to prevent the encapsulant from overflowing onto the bottom surfaces of the bump solder pads. | 10-27-2011 |
20110317355 | Memory Device Having Wireless Recognition Function and a Portable Electronic Apparatus Integrating the Same - A memory device having wireless recognition function provided inside a portable electronic apparatus includes a semiconductor package having a substrate, a semiconductor chip disposed on the substrate, an antenna disposed on the substrate and electrically connected to the semiconductor chip, and an encapsulant encapsulating the semiconductor chip; and a magnetic member coupled to the encapsulant and spaced apart from the substrate by a pre-determined distance, in a manner that a projection area of the magnetic member on the substrate covers an area disposed with the antenna, thereby guiding electromagnetic waves emitted from the antenna in specific directions so as to enhance magnetic forces in the specific directions and enable the magnetic forces to penetrate a thicker casing in order to achieve a sensing chip having a sensing function, hence a mobile phone has an access card function. | 12-29-2011 |
20130250140 | COMPOSITE MEMORY CARD AND DEDICATED READER - A composite memory card has 4-bit and 1-bit data transfer modes; in which, when the composite memory card plugs in a general reader, it operates in the 4-bit data transfer mode to form 4-bit format information signal linking with the external transfer through four data pins; and when it plugs in a dedicated reader, it operates in the 1-bit data transfer mode to form 1-bit format data signal linking with the external transfer through one data pin, while it starts the internal audio processing module to read the internal audio file streaming and to transform into voice output signal output to the dedicated reader through the other data pins for broadcast, and to receive the voice input signal of the dedicated reader through data pins to transform into audio file streaming to import for storage; thus, the composite memory card combines the standard memory card and the audio processing function. | 09-26-2013 |