Patent application number | Description | Published |
20080227235 | Sensor Component And Method For Producing A Sensor Component - A device for detecting a measured quantity has a sensor chip for detecting the measured quantity, a supply for providing a power supply, and an injection-molded enclosure for accommodating the sensor chip and the supply, the injection-molded enclosure including integrated conductive traces providing an electrical connection between the sensor chip and the supply. | 09-18-2008 |
20100233983 | SYSTEM INCLUDING RECEIVER FRONT ENDS - A system including an output node and receiver front ends. The receiver front ends are configured to receive an input signal. Each of the receiver front ends is configured to receive the input signal and provide an output signal at the output node. At least one of the receiver front ends is configured to selectively consume less power. | 09-16-2010 |
20120178401 | SYSTEM INCLUDING RECEIVER FRONT ENDS - An integrated circuit chip includes an output node, receiver front ends, and control logic. The receiver front ends are configured to receive an input signal. Each of the receiver front ends is configured to receive the input signal and provide an output signal at the output node. At least one of the receiver front ends is configured to selectively consume less power. The control logic is configured to select the number of receiver front ends providing an output signal to the output node based on a received signal strength indication. | 07-12-2012 |
20130022154 | ANALOG CORRELATION TECHNIQUE FOR ULTRA LOW POWER RECEIVERS - One embodiment of the present invention relates to an analog correlation unit comprising a plurality of parallel correlation components configured to operating according to an advanced switched-capacitor low pass filter principle that increases coding gain of the unit. Each correlation component comprises a sampling stage and a correlation stage. The sampling stage may comprise a switched capacitor configured to sample a received baseband signal to determine a value (e.g., polarity) of the baseband signal. The sampled baseband signal is provided to the correlation stages, which may respectively comprise a plurality of switched integrators configured to selectively receive and integrate the sampled baseband signal over time depending upon values (e.g., polarity) of the correlation code to generate voltage potential values. The analog correlation result is evaluated by a comparison of an adjustable threshold voltage with the difference between the output voltage potential values. | 01-24-2013 |
20140339313 | Semiconductor Device and an Identification Tag - A semiconductor device includes a semiconductor substrate, a battery attached to the semiconductor substrate, and a sensor attached to the semiconductor substrate. The battery is electrically connected to the sensor and configured to supply the sensor with electrical power. | 11-20-2014 |
20150053772 | CHIP ARRANGEMENT, ANALYSIS APPARATUS, RECEIVING CONTAINER, AND RECEIVING CONTAINER SYSTEM - In various embodiments, a chip arrangement includes a first chip having a first antenna which is monolithically integrated in the first chip and is intended to communicate with at least one of an external reader or an external writer; a second chip having a second antenna which is monolithically integrated in the second chip and is intended to communicate with the at least one of the external reader or the external writer; and a booster antenna which is coupled to the first antenna in a first coupling area in order to increase a range of the first antenna and is coupled to the second antenna in a second coupling area in order to increase a range of the second antenna. | 02-26-2015 |
20150054125 | CHIP, CHIP ARRANGEMENT AND METHOD FOR PRODUCING A CHIP - Various embodiments provide a chip. The chip has a carrier, an integrated circuit formed above the carrier, and an energy storage element. The energy storage element has a first electrode and a second electrode and is used to supply the integrated circuit with electrical energy. The carrier, the integrated circuit and the energy storage element are monolithically formed, the first electrode being formed from the carrier. | 02-26-2015 |
20160135684 | Functional Skin Patch - A functional skin patch having a first surface and a second surface opposite the first surface is provided. The functional skin patch includes a functional unit having a thermo harvester and an antenna unit. The thermo harvester has a first terminal thermally connected to the first surface and a second terminal. The antenna unit has a first terminal thermally connected to the second terminal of the thermo harvester and a second terminal thermally connected to the second surface. The antenna unit has a stacked layer structure including, in this sequence, a metal layer thermally connected to the second terminal of the thermo harvester, a ferrite layer thermally connected to the metal layer, and an antenna layer thermally connected to the ferrite layer. | 05-19-2016 |